公开(公告)号：CA2596435A1

公开(公告)日：2006-08-10

申请号：CA2596435

申请日：2006-01-31

Applicant: HARVARD COLLEGE

Inventor： WHITESIDES GEORGE M ,  LEE ANDREW ,  WEIBEL DOUGLAS B ,  POTENTA SCOTT ,  KRUITHOF MAARTEN ,  SIEGEL ADAM

IPC: F16K3/24

公开(公告)号：WO2007061448A3

公开(公告)日：2008-08-28

申请号：PCT/US2006019787

申请日：2006-05-18

Applicant: HARVARD COLLEGE ,  BRUZEWICZ DEREK A ,  BONCHEVA-BETTEX MILA ,  WHITESIDES GEORGE M ,  SIEGEL ADAM ,  WEIBEL DOUGLAS B ,  SHEVKOPLYAS SERGEY ,  MARTINEZ ANDRES

Inventor： BRUZEWICZ DEREK A ,  BONCHEVA-BETTEX MILA ,  WHITESIDES GEORGE M ,  SIEGEL ADAM ,  WEIBEL DOUGLAS B ,  SHEVKOPLYAS SERGEY ,  MARTINEZ ANDRES

IPC: H05K3/10 ,  B01F13/00 ,  B01L3/00 ,  B29C39/12

CPC classification number: H05K3/101 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0874 ,  B01L2400/0415 ,  B33Y80/00 ,  H05K1/0272 ,  H05K1/032 ,  H05K3/389 ,  H05K2201/0162 ,  H05K2201/0305 ,  H05K2203/128 ,  Y10T29/49117

Abstract: Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as "microsolidic" devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and/or thermal energy) that interacts withy and/or affects the flowing fluid and/or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways/connections.

Abstract translation: 本文公开了各种微流体装置和可以使用诸如模具的装置形成的固体，通常导电的装置。 在某些实施方案中，形成的装置包括通过固化存在于一个或多个微流体通道（这种装置在下文中称为“微溶体”装置）中的液态金属形成的导电通路。 在某些这样的装置中，其中可以在微流体结构的区域之间形成和/或重组电连接; 在一些情况下，所形成的器件/电路可能是柔性的和/或涉及柔性电气部件。 在某些实施方案中，在微流体通道中形成的固体金属线/导电路径可以保持在微流体结构内。 在某些这样的实施例中，所形成的导电路径可以位于结构的其它微流体通道附近，其携带流动的流体，使得导电路径可以产生与...相互作用的能量（例如电磁和/或热能） /或影响流动的流体和/或其中所含的或由其携带的部件。 在其它实施方案中，微溶体结构可以从微流体模具中移除以形成独立结构。 在某些实施方案中，形成的固体金属结构可与入射到结构上的光能相互作用，或者可用于制造轻质电极。 本发明的另一方面涉及可以包括这些导电路径/连接的自组装结构的形成。

公开(公告)号：WO2006083833A3

公开(公告)日：2007-02-22

申请号：PCT/US2006003354

申请日：2006-01-31

Applicant: HARVARD COLLEGE ,  WEIBEL DOUGLAS B ,  LEE ANDREW ,  POTENTA SCOTT ,  SIEGEL ADAM ,  KRUITHOF MAARTEN ,  WHITESIDES GEORGE M

Inventor： WEIBEL DOUGLAS B ,  LEE ANDREW ,  POTENTA SCOTT ,  SIEGEL ADAM ,  KRUITHOF MAARTEN ,  WHITESIDES GEORGE M

IPC: F16K3/24

CPC classification number: F15B1/04 ,  B01L3/502738 ,  B01L3/502746 ,  B01L2200/0636 ,  B01L2300/0867 ,  B01L2400/0487 ,  B01L2400/0655 ,  B01L2400/082 ,  F15B2201/21 ,  F15B2201/305 ,  F15B2201/4053 ,  F16K99/0001 ,  F16K99/0026 ,  F16K99/0034 ,  F16K2099/0074 ,  F16K2099/0078 ,  F16K2099/0084 ,  Y10T137/0318 ,  Y10T137/0396 ,  Y10T137/2213 ,  Y10T137/4824 ,  Y10T137/6161

Abstract: A microfluidic valve assembly includes a structure defining a microfluidic fluid path and an actuator that can be moved between different positions controlling flow through the channel. In one embodiment, the actuator can be threaded into at least a portion of the structure, and can be moved rotationally between a first position, causing relatively greater constriction of a microfluidic fluid path, and a second position causing relatively lesser constriction of the fluid path. Actuating the actuator, e.g., by rotation, can deform material between the valve and the fluid path, thereby constricting at least a portion of the underlying fluid path and regulating the flow of a fluid in the fluid path. In another aspect, the invention provides a reservoir into which fluid can be placed and from which fluid can be introduced into a microfluidic system. In one embodiment, the reservoir is expandable and thereby able to store fluid under pressure for delivery to a microfluidic system.

Abstract translation: 微流体阀组件包括限定微流体流体路径的结构和可以在控制流过通道的不同位置之间移动的致动器。 在一个实施例中，致动器可以被螺纹连接到结构的至少一部分中，并且可以在第一位置和第二位置之间旋转地移动，第一位置引起微流体流体路径的相对较大的收缩，并且引起相对较小的流体路径收缩的第二位置 。 例如通过旋转来致动致动器可以在阀和流体路径之间变形材料，从而收缩下面的流体路径的至少一部分并且调节流体路径中的流体的流动。 在另一方面，本发明提供了一种储存器，流体可以放置在该储存器中，并且可以从该储存器将流体引入到微流体系统中。 在一个实施例中，储存器是可膨胀的并且因此能够在压力下存储流体以递送到微流体系统。

公开(公告)号：WO2007061448A9

公开(公告)日：2007-07-26

申请号：PCT/US2006019787

申请日：2006-05-18

Applicant: HARVARD COLLEGE ,  BRUZEWICZ DEREK A ,  BONCHEVA-BETTEX MILA ,  WHITESIDES GEORGE M ,  SIEGEL ADAM ,  WEIBEL DOUGLAS B ,  SHEVKOPLYAS SERGEY ,  MARTINEZ ANDRES

Inventor： BRUZEWICZ DEREK A ,  BONCHEVA-BETTEX MILA ,  WHITESIDES GEORGE M ,  SIEGEL ADAM ,  WEIBEL DOUGLAS B ,  SHEVKOPLYAS SERGEY ,  MARTINEZ ANDRES

IPC: H05K3/10

CPC classification number: H05K3/101 ,  B01L3/5027 ,  B01L3/502707 ,  B01L2200/12 ,  B01L2300/0645 ,  B01L2300/0816 ,  B01L2300/0874 ,  B01L2400/0415 ,  B33Y80/00 ,  H05K1/0272 ,  H05K1/032 ,  H05K3/389 ,  H05K2201/0162 ,  H05K2201/0305 ,  H05K2203/128 ,  Y10T29/49117

Abstract: Disclosed herein are a variety of microfluidic devices and solid, typically electrically conductive devices that can be formed using such devices as molds. In certain embodiments, the devices that are formed comprise conductive pathways formed by solidifying a liquid metal present in one or more microfluidic channels (such devices hereinafter referred to as "microsolidic" devices). In certain such devices, in which electrical connections can be formed and/or reformed between regions in a microfluidic structure; in some cases, the devices/circuits formed may be flexible and/or involve flexible electrical components. In certain embodiments, the solid metal wires/conductive pathways formed in microfluidic channel(s) may remain contained within the microfluidic structure. In certain such embodiments, the conductive pathways formed may be located in proximity to other microfluidic channel(s) of the structure that carry flowing fluid, such that the conductive pathway can create energy (e.g. electromagnetic and/or thermal energy) that interacts withy and/or affects the flowing fluid and/or a component contained therein or carried thereby. In other embodiments, a microsolidic structure may be removed from a microfluidic mold to form a stand-alone structure. In certain embodiments, the solid metal structures formed may interact with light energy incident upon a structure or may be used to fabricate a light-weight electrode. Another aspect of the invention relates to the formation of self-assembled structures that may comprise these electrically conductive pathways/connections.

Abstract translation: 本文公开了各种微流体装置和可以使用诸如模具的装置形成的固体，通常导电的装置。 在某些实施方案中，所形成的装置包括通过固化存在于一个或多个微流体通道中的液体金属形成的导电通路（以下称为“微溶体”装置）。 在某些这样的器件中，其中可以在微流体结构中的区域之间形成和/或重组电连接; 在一些情况下，形成的器件/电路可以是柔性的和/或涉及柔性电气部件。 在某些实施方案中，在微流体通道中形成的固体金属线/导电路径可以保持在微流体结构内。 在某些这样的实施例中，所形成的导电路径可以位于结构的其他微流体通道附近，该流体通道携带流动的流体，使得导电路径可产生与其相互作用的能量（例如电磁和/或热能） /或影响流动的流体和/或其中所含的或由其携带的部件。 在其它实施方案中，微溶体结构可以从微流体模具中移除以形成独立结构。 在某些实施方案中，所形成的固体金属结构可与入射到结构上的光能相互作用，或者可用于制造轻质电极。 本发明的另一方面涉及可以包括这些导电路径/连接的自组装结构的形成。