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    ELECTRICAL-CONTACT ASSEMBLIES
    2.
    发明申请
    ELECTRICAL-CONTACT ASSEMBLIES 审中-公开
    电接点组件

    公开(公告)号：WO2017069709A1

    公开(公告)日：2017-04-27

    申请号：PCT/SG2016/050517

    申请日：2016-10-24

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： TESANOVIC, Bojan ,  RIEL, Peter

    IPC: H05K3/40 ,  H05K3/46

    CPC classification number: H05K3/425 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/284 ,  H05K2201/09118 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2203/0733 ,  H05K2203/1461 ,  H05K2203/1476

    Abstract: An electrical-contact assembly includes electrical contacts with first and second electrical-contact surfaces on opposing sides of the assembly. The electrical-contact assembly is manufactured by a structurable process (e.g., photo-structurable process) and by electroplating. The first and second electrical-contact surfaces can be positioned with respect to each other with an accuracy, for example, of at least 5 microns. Further, the thickness of the electrical-contact assembly can be at most 17 microns in some cases. The electrical-contact assembly can include integrated active optoelectronic elements, overmolds, optical elements and non-transparent walls.

    Abstract translation: 电触头组件包括在组件的相对侧上具有第一和第二电接触表面的电触点。 电触头组件通过可结构化工艺（例如，光致结构化工艺）和电镀来制造。 第一和第二电接触表面可以以例如至少5微米的精度相对于彼此定位。 此外，电触头组件的厚度在一些情况下可以至多17微米。 电接触组件可以包括集成的有源光电元件，包覆模制件，光学元件和不透明的壁。

    COMPACT, POWER-EFFICIENT STACKED BROADBAND OPTICAL EMITTERS
    3.
    发明申请
    COMPACT, POWER-EFFICIENT STACKED BROADBAND OPTICAL EMITTERS 审中-公开
    功能强大的堆叠宽带光电发射器

    公开(公告)号：WO2016048241A1

    公开(公告)日：2016-03-31

    申请号：PCT/SG2015/050335

    申请日：2015-09-23

    Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

    Inventor： RIEL, Peter ,  ROENTGEN, Peter

    IPC: H01S3/091 ,  H01S3/16 ,  H01S5/10 ,  H01S5/30

    CPC classification number: G01J3/10 ,  G01J3/06 ,  G01J3/108 ,  G01J3/26 ,  H01S3/094096 ,  H01S5/0071 ,  H01S5/0287 ,  H01S5/041 ,  H01S5/1096 ,  H01S5/183 ,  H01S5/32375 ,  H01S5/34306 ,  H01S5/34313 ,  H01S5/34326 ,  H01S5/3438 ,  H01S5/4043 ,  H01S5/4087

    Abstract: The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected wavelength or narrow range of wavelengths to pass through.

    Abstract translation: 本公开描述了包括半导体层堆叠的宽带光发射源，其中每个半导体层可操作地发射不同的相应波长的光; 光源，其可操作以提供来自所述堆的受激光子发射的光泵浦; 其中所述半导体层依次设置在所述堆叠中，使得所述半导体层中的第一层最靠近所述光源，并且所述半导体层中的最后一个离所述光源最远，并且其中，所述半导体层中的每个特定的一个 对于由比特定半导体层更靠近光源的其它半导体层产生的光至少部分透明。 本公开还描述了包括宽带光发射装置的各种光谱仪，并且可选地包括可调谐波长滤波器，其可操作以允许所选波长或窄波长范围通过。

    OPTICAL ELEMENT STACK ASSEMBLIES
    7.
    发明公开
    OPTICAL ELEMENT STACK ASSEMBLIES 审中-公开
    光学元件组件

    公开(公告)号：EP3207416A1

    公开(公告)日：2017-08-23

    申请号：EP15850175.9

    申请日：2015-10-14

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： HEIMGARTNER, Stephan ,  BIETSCH, Alexander ,  RIEL, Peter

    IPC: G02B7/00 ,  B32B37/12 ,  H01L31/0232

    Abstract: The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.

    Abstract translation: 本公开描述了包括彼此堆叠的多个基板的光学元件堆叠组件。 至少一个衬底在其表面上包括光学元件，例如DOE。 例如，可以在晶圆级工艺中制造堆叠组件。

    COMPACT, POWER-EFFICIENT STACKED BROADBAND OPTICAL EMITTERS
    8.
    发明公开
    COMPACT, POWER-EFFICIENT STACKED BROADBAND OPTICAL EMITTERS 审中-公开
    紧凑，高效堆叠宽带光学发射器

    公开(公告)号：EP3198689A1

    公开(公告)日：2017-08-02

    申请号：EP15845489.2

    申请日：2015-09-23

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： RIEL, Peter ,  ROENTGEN, Peter

    IPC: H01S3/091 ,  H01S3/16 ,  H01S5/10 ,  H01S5/30

    CPC classification number: G01J3/10 ,  G01J3/06 ,  G01J3/108 ,  G01J3/26 ,  H01S3/094096 ,  H01S5/0071 ,  H01S5/0287 ,  H01S5/041 ,  H01S5/1096 ,  H01S5/183 ,  H01S5/32375 ,  H01S5/34306 ,  H01S5/34313 ,  H01S5/34326 ,  H01S5/3438 ,  H01S5/4043 ,  H01S5/4087

    Abstract: The present disclosure describes broadband optical emission sources that include a stack of semiconductor layers, wherein each of the semiconductor layers is operable to emit light of a different respective wavelength; a light source operable to provide optical pumping for stimulated photon emission from the stack; wherein the semiconductor layers are disposed sequentially in the stack such that a first one of the semiconductor layers is closest to the light source and a last one of the semiconductor layers is furthest from the light source, and wherein each particular one of the semiconductor layers is at least partially transparent to the light generated by the other semiconductor layers that are closer to the light source than the particular semiconductor layer. The disclosure also describes various spectrometers that include a broadband optical emission device, and optionally include a tuneable wavelength filter operable to allow a selected wavelength or narrow range of wavelengths to pass through.

    Abstract translation: 本公开描述了包括半导体层堆叠的宽带光发射源，其中每个半导体层可操作以发射不同相应波长的光; 光源，其可操作以提供用于从所述堆叠体激发的光子发射的光学泵浦; 其中所述半导体层顺序地布置在所述堆叠中，使得所述半导体层中的第一半导体层最靠近所述光源，并且所述半导体层中的最后一个半导体层距离所述光源最远，并且其中所述半导体层中的每个特定半导体层是 对于由比特定半导体层更靠近光源的其他半导体层产生的光至少部分透明。 本公开还描述了包括宽带光发射装置的各种光谱仪，并且可选地包括可操作以允许所选波长或窄波长范围通过的可调波长滤波器。

    METHOD OF MANUFACTURING A PLURALITY OF OPTICAL DEVICES
    9.
    发明公开
    METHOD OF MANUFACTURING A PLURALITY OF OPTICAL DEVICES 审中-公开
    工艺生产光学多个设备

    公开(公告)号：EP2580781A1

    公开(公告)日：2013-04-17

    申请号：EP11738586.4

    申请日：2011-06-10

    Applicant: Heptagon Micro Optics Pte. Ltd.

    Inventor： RUDMANN, Hartmut ,  RIEL, Peter

    IPC: H01L27/146

    CPC classification number: H01L27/14687 ,  H01L27/14618 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14632 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: In accordance with an aspect of the invention, a method of manufacturing, on a waver scale, a plurality of optical devices comprises the steps of providing a wafer scale spacer with a plurality of holes arranged in a hole pattern at the positions of camera modules, providing a wafer scale substrate with an infrared (IR) filter that is patterned to comprise a plurality of IR filter sections, the IR filter sections being arranged in an IR filter pattern that is such that radiation paths through the substrate and onto the camera modules go through the IR filter sections, and stacking the substrate and the spacer on each other with the holes and the filter sections being aligned.

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