公开(公告)号：DE69220163D1

公开(公告)日：1997-07-10

申请号：DE69220163

申请日：1992-09-04

Applicant: IBM

Inventor： BABICH EDWARD D ,  GALLIGAN EILEEN A ,  GELORME JEFFREY D ,  MCGOUEY RICHARD P ,  NUNES SHARON L ,  PARASZCZAK JURIJ R ,  SERINO RUSSELL J ,  WITMAN DAVID F

IPC: G03F7/004 ,  G03F7/029 ,  G03F7/038 ,  G03F7/075 ,  H01L21/027 ,  H01L21/30

公开(公告)号：CA1278635C

公开(公告)日：1991-01-02

申请号：CA499558

申请日：1986-01-14

Applicant: IBM

Inventor： BABICH EDWARD D ,  HATZAKIS MICHAEL ,  LIUTKIS JOHN J ,  PARASCZCAK JURI R ,  SHAW JANE M

IPC: G03C5/00 ,  C08F2/48 ,  C08F290/00 ,  C08F299/00 ,  C08F299/08 ,  C08K5/07 ,  C08L83/07 ,  G03F7/00 ,  G03F7/004 ,  G03F7/038 ,  G03F7/075 ,  H01L21/30

Abstract: ORGANOSILICON POLYMER COMPOSITION AND USE THEREOF FOR PHOTOLITHOGRAPHY A composition containing a polysiloxane having a polymerizable ethylenically unsaturated group, and 2,2-dimethoxy-2-phenyl acetophenone as an ultraviolet light sensitizer; and use thereof in lithography.

公开(公告)号：DE69220163T2

公开(公告)日：1997-12-18

申请号：DE69220163

申请日：1992-09-04

Applicant: IBM

Inventor： BABICH EDWARD D ,  GALLIGAN EILEEN A ,  GELORME JEFFREY D ,  MCGOUEY RICHARD P ,  NUNES SHARON L ,  PARASZCZAK JURIJ R ,  SERINO RUSSELL J ,  WITMAN DAVID F

IPC: G03F7/004 ,  G03F7/029 ,  G03F7/038 ,  G03F7/075 ,  H01L21/027 ,  H01L21/30

公开(公告)号：DE69023958T2

公开(公告)日：1996-06-20

申请号：DE69023958

申请日：1990-05-23

Applicant: IBM

Inventor： BABICH EDWARD D ,  HATZAKIS MICHAEL ,  MCGOUEY RICHARD P ,  NUNES SHARON ,  PARASZCZAK JURIJ R ,  SHAW JANE M

IPC: B32B7/02 ,  C08L83/14 ,  H01B3/18 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L21/312

公开(公告)号：DE69023958D1

公开(公告)日：1996-01-18

申请号：DE69023958

申请日：1990-05-23

Applicant: IBM

Inventor： BABICH EDWARD D ,  HATZAKIS MICHAEL ,  MCGOUEY RICHARD P ,  NUNES SHARON ,  PARASZCZAK JURIJ R ,  SHAW JANE M

IPC: B32B7/02 ,  C08L83/14 ,  H01B3/18 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/48 ,  H01L23/14 ,  H01L23/498 ,  H01L21/312

公开(公告)号：CA1266148A

公开(公告)日：1990-02-20

申请号：CA499386

申请日：1986-01-10

Applicant: IBM

Inventor： BABICH EDWARD D ,  HATZAKIS MICHAEL ,  JACOBS SCOTT L ,  PARASCZCAK JURI R ,  SHAW JANE M ,  WITMAN DAVID F

IPC: C08L61/00 ,  C08K5/549 ,  C08L33/00 ,  C08L33/02 ,  C08L61/04 ,  C08L61/06 ,  G03C1/00 ,  G03C1/72 ,  G03F7/004 ,  G03F7/038 ,  G03F7/26 ,  G03F7/38 ,  H01L21/027

Abstract: PLASMA-RESISTANT POLYMERIC MATERIAL, PREPARATION THEREOF, AND USE THEREOF Plasma-resistant polymeric materials are prepared by reacting a polymeric material containing reactive hydrogen functional groups with a multifunctional organometallic material containing at least two functional groups which are reactive with the reactive hydrogen functional groups of the polymeric material, such as hexamethylcyclotrisilazane.