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公开(公告)号：SG11202110275QA
公开(公告)日：2021-10-28
申请号：SG11202110275Q
申请日：2020-06-19
Applicant: IBM
Inventor： JINKA OBLESH , OLIVADESE SALVATORE , HART SEAN , BRONN NICHOLAS , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA
IPC: H01L23/367 , F25D19/00
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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2.发明专利
公开(公告)号：IL288973D0
公开(公告)日：2022-02-01
申请号：IL28897321
申请日：2021-12-13
Applicant: IBM , BRONN NICHOLAS , BOGORIN DANIELA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE
Inventor： BRONN NICHOLAS , BOGORIN DANIELA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE
Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.
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公开(公告)号：BR112021025662A2
公开(公告)日：2022-02-08
申请号：BR112021025662
申请日：2020-05-21
Applicant: IBM
Inventor： BOGORIN DANIELA , BRONN NICHOLAS , GUMANN PATRYK , OLIVADESE SALVATORE , HART SEAN
Abstract: interpositor supercondutor para a transmissão de informações quânticas para correção de erro quântico. um sistema para transmissão de informação quântica para correção de erro quântico inclui um chip de ancilla qubit incluindo uma pluralidade de ancilla qubits e um chip de qubit de dados espaçado do chip de ancilla qubit, o chip de qubit de dados incluindo uma pluralidade de qubits de dados. o sistema inclui um intermediário acoplado ao chip ancilla qubit e ao chip de qubit de dados, o intermediário incluindo um material dielétrico e uma pluralidade de estruturas supercondutoras formadas no material dielétrico. as estruturas supercondutoras permitem a transmissão de informações quânticas entre a pluralidade de qubits de dados no chip de qubit de dados e a pluralidade de ancilla qubits no chip de ancilla qubit por meio de fótons virtuais para correção de erro quântico.
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公开(公告)号：AU2021249420A1
公开(公告)日：2022-09-01
申请号：AU2021249420
申请日：2021-03-10
Applicant: IBM
Inventor： SHAO DONGBING , LEWANDOWSKI ERIC , BRONN NICHOLAS , BRINK MARKUS
Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.
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Patent Agency Ranking5.发明专利
公开(公告)号：AU2020297857A1
公开(公告)日：2021-10-14
申请号：AU2020297857
申请日：2020-05-21
Applicant: IBM
Inventor： BRONN NICHOLAS , BOGORIN DANIELA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE
Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.
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6.发明专利
公开(公告)号：CA3143363A1
公开(公告)日：2020-12-24
申请号：CA3143363
申请日：2020-05-21
Applicant: IBM
Inventor： BRONN NICHOLAS , BOGORIN DANIELA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE
Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.
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7.发明专利
公开(公告)号：IL288973B2
公开(公告)日：2025-01-01
申请号：IL28897321
申请日：2021-12-13
Applicant: IBM , BRONN NICHOLAS , BOGORIN DANIELA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE
Inventor： BRONN NICHOLAS , BOGORIN DANIELA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE
IPC: G06N10/00 , H01L23/00 , H01L25/065 , H01L25/18 , H04B10/90
Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.
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公开(公告)号：SG11202110214UA
公开(公告)日：2021-10-28
申请号：SG11202110214U
申请日：2020-06-23
Applicant: IBM
Inventor： BRONN NICHOLAS , BOGORIN DANIELA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE , ORCUTT JASON
Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.
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9.发明专利
公开(公告)号：SG11202110203UA
公开(公告)日：2021-10-28
申请号：SG11202110203U
申请日：2020-05-21
Applicant: IBM
Inventor： BRONN NICHOLAS , BOGORIN DANIELA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE
Abstract: A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.
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