公开(公告)号：BR112021020936A2

公开(公告)日：2022-01-25

申请号：BR112021020936

申请日：2020-04-15

Applicant: IBM

Inventor： SHAO DONGBING ,  SOLGUN FIRAT ,  JARED BARNEY HERTZBERG ,  BRINK MARKUS

IPC: H01L39/22 ,  B82Y10/00 ,  G06N10/00

Abstract: estruturas de sintonia de frequência qubit e métodos de fabricação para dispositivos de computação quântica flip chip. um dispositivo de computação quântica inclui um primeiro chip com um primeiro substrato e um ou mais qubits descartados no primeiro substrato. cada um ou mais qubits tem uma frequência de ressonância associada. o dispositivo de computação quântica inclui ainda um segundo chip com um segundo substrato e pelo menos uma superfície condutora descartada no segundo substrato oposto ao um ou mais qubits. a pelo menos uma superfície condutora tem pelo menos uma dimensão configurada para ajustar a frequência de ressonância associada a pelo menos um ou mais qubits a um determinado valor de ajuste de frequência.

公开(公告)号：AU2021249420A1

公开(公告)日：2022-09-01

申请号：AU2021249420

申请日：2021-03-10

Applicant: IBM

Inventor： SHAO DONGBING ,  LEWANDOWSKI ERIC ,  BRONN NICHOLAS ,  BRINK MARKUS

IPC: G06N10/00 ,  H01L21/00 ,  H01L23/00 ,  H01L25/00 ,  H01L27/00

Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.

公开(公告)号：CA3137214A1

公开(公告)日：2020-10-22

申请号：CA3137214

申请日：2020-04-15

Applicant: IBM

Inventor： SHAO DONGBING ,  BRINK MARKUS ,  SOLGUN FIRAT ,  HERTZBERG JARED BARNEY

IPC: B82Y10/00 ,  H01L39/22

Abstract: A quantum computing device includes a first chip having a first substrate and one or more qubits disposed on the first substrate. Each of the one or more qubits has an associated resonance frequency. The quantum computing device further includes a second chip having a second substrate and at least one conductive surface disposed on the second substrate opposite the one or more qubits. The at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits to a determined frequency adjustment value.

公开(公告)号：IL286613D0

公开(公告)日：2021-10-31

申请号：IL28661321

申请日：2021-09-22

Applicant: IBM ,  SHAO DONGBING ,  BRINK MARKUS ,  SOLGUN FIRAT ,  HERTZBERG JARED BARNEY

Inventor： SHAO DONGBING ,  BRINK MARKUS ,  SOLGUN FIRAT ,  HERTZBERG JARED BARNEY

IPC: B82Y10/00 ,  G06N10/00 ,  H01L27/18 ,  H01L29/66 ,  H01L39/02 ,  H01L39/24

Abstract: A quantum computing device includes a first chip having a first substrate and one or more qubits disposed on the first substrate. Each of the one or more qubits has an associated resonance frequency. The quantum computing device further includes a second chip having a second substrate and at least one conductive surface disposed on the second substrate opposite the one or more qubits. The at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits to a determined frequency adjustment value.

公开(公告)号：SG11202109829PA

公开(公告)日：2021-10-28

申请号：SG11202109829P

申请日：2020-04-15

Applicant: IBM

Inventor： SHAO DONGBING ,  BRINK MARKUS ,  SOLGUN FIRAT ,  HERTZBERG JARED

IPC: G06N10/00 ,  B82Y10/00 ,  H01L39/22

Abstract: A quantum computing device includes a first chip having a first substrate and one or more qubits disposed on the first substrate. Each of the one or more qubits has an associated resonance frequency. The quantum computing device further includes a second chip having a second substrate and at least one conductive surface disposed on the second substrate opposite the one or more qubits. The at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits to a determined frequency adjustment value.

公开(公告)号：AU2020259830A1

公开(公告)日：2021-09-30

申请号：AU2020259830

申请日：2020-04-15

Applicant: IBM

Inventor： SHAO DONGBING ,  BRINK MARKUS ,  SOLGUN FIRAT ,  HERTZBERG JARED BARNEY

IPC: G06N10/00 ,  B82Y10/00 ,  H01L39/22

Abstract: A quantum computing device includes a first chip having a first substrate and one or more qubits disposed on the first substrate. Each of the one or more qubits has an associated resonance frequency. The quantum computing device further includes a second chip having a second substrate and at least one conductive surface disposed on the second substrate opposite the one or more qubits. The at least one conductive surface has at least one dimension configured to adjust the resonance frequency associated with at least one of the one or more qubits to a determined frequency adjustment value.