公开(公告)号：DE102016221191A1

公开(公告)日：2017-05-04

申请号：DE102016221191

申请日：2016-10-27

Applicant: IBM

Inventor： DANG BING ,  FRITZ GREGORY ,  LEWANDOWSKI ERIC ,  MARIA JOANA ,  WEBB BUCKNELL ,  WRIGHT STEVEN

IPC: A61M37/00 ,  B81B1/00

Abstract: Eine digitale biomedizinische Einheit umfasst ein Substrat, welches einen Hohlraum bildet, eine Versiegelung, welche um den Hohlraum herum ausgebildet ist, eine Abdeckung, welche durch die Versiegelung mit dem Substrat verbunden ist, eine reaktive Metallstruktur, welche eine Mehrzahl von Metallschichten aufweist, wobei die reaktive Metallstruktur eine Komponente des Substrats und/oder der Abdeckung ist, eine Metallspur, welche so konfiguriert ist, dass sie eine von selbst fortschreitende Reaktion zwischen der Mehrzahl von Metallschichten der reaktiven Metallstruktur auslöst und Inhalte des Hohlraums freisetzt, und eine Stromversorgung, welche so konfiguriert ist, dass sie einen elektrischen Strom auf die Metallspur anwendet.

公开(公告)号：AU2021295256A1

公开(公告)日：2022-11-10

申请号：AU2021295256

申请日：2021-06-15

Applicant: IBM

Inventor： LEWANDOWSKI ERIC ,  YAU JENG-BANG ,  ZHANG ERIC ,  WEBB BUCKNELL

IPC: H01L39/24 ,  G06N10/00 ,  H01L27/18

Abstract: Techniques for selectively tuning the operating frequency of superconducting Josephson junction resonators are provided which include chemically altering a Josephson junction (110) via a plasma treatment, preferably by masked exposure of a transmon qubit die (104) to plasma (502) including reactants such as hydrogen or oxygen. In particular, the plasma treatment adjusts an electrical resistance of the Josephson junction. An apparatus for carrying out the plasma treatment is also disclosed.

公开(公告)号：AU2021249420A1

公开(公告)日：2022-09-01

申请号：AU2021249420

申请日：2021-03-10

Applicant: IBM

Inventor： SHAO DONGBING ,  LEWANDOWSKI ERIC ,  BRONN NICHOLAS ,  BRINK MARKUS

IPC: G06N10/00 ,  H01L21/00 ,  H01L23/00 ,  H01L25/00 ,  H01L27/00

Abstract: Systems and techniques that facilitate hybrid readout packaging for quantum multichip bonding are provided. In various embodiments, an interposer can have a first quantum chip and a second quantum chip. In various aspects, a readout resonator (e.g., input/output port) of one or more qubits on the first quantum chip can be routed to an inner portion of the interposer. In various instances, the inner portion can be located between the first quantum chip and the second quantum chip. In various aspects, routing the readout resonator to the inner portion can reduce a number of crossings and/or intersections between input/output lines on the interposer and connection buses between qubits on the interposer.

公开(公告)号：SG11202110210PA

公开(公告)日：2021-10-28

申请号：SG11202110210P

申请日：2020-05-13

Applicant: IBM

Inventor： LEWANDOWSKI ERIC ,  WEBB BUCKNELL ,  HERTZBERG JARED ,  SANDBERG MARTIN ,  JINKA OBLESH

IPC: H01L23/44

Abstract: A thermalization structure is formed using a foil and a low temperature device (LTD). The foil includes a first layer of a first material. The LTD includes a surface from which heat is transferred away from the LTD. A coupling is formed between the foil and the surface of the LTD, where the coupling includes a bond formed between the foil and the surface such that forming the bond forms a set of ridges in the foil, a ridge in the set of ridges operating to dissipate the heat.