公开(公告)号：MY115697A

公开(公告)日：2003-08-30

申请号：MYPI9704495

申请日：1997-09-26

Applicant: IBM

Inventor： CARTER KENNETH RAYMOND ,  HEDRICK JAMES LUPTON ,  MILLER ROBERT DENNIS

IPC: G03C5/00 ,  C08G77/452 ,  C08L83/10 ,  H01L21/312 ,  H01L21/314 ,  H01L21/768 ,  H01L23/522

Abstract: THE INVENTION RELATES TO AN INTEGRATED CIRCUIT DEVICE COMPRISING (I) A SUBSTRATE; (II) METALLIC CIRCUIT LINES POSITIONED ON THE SUBSTRATE AND (III) A DIELECTRIC MATERIAL POSITIONED ON THE CIRCUIT LINES. THE DIELECTRIC MATERIAL COMPRISES THE REACTION PRODUCT OF AN ORGANIC POLYSILICA AND UNCONDENSED PRECURSOR POLYMER PREFERABLY TERMINATED WITH AN ALKOXYSILYL ALKYL GROUP. (FIG. 1)

公开(公告)号：SG53076A1

公开(公告)日：1998-09-28

申请号：SG1997003523

申请日：1997-09-24

Applicant: IBM

Inventor： CARTER KENNETH RAYMOND ,  HEDRICK JAMES LUPTON ,  MILLER ROBERT DENNIS

IPC: C08G77/452 ,  C08L83/10 ,  H01L21/312 ,  H01L21/314 ,  H01L21/768 ,  H01L23/522 ,  H05K1/05

Abstract: The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and uncondensed precursor polymer preferably terminated with an alkoxysilyl alkyl group.

公开(公告)号：MY118011A

公开(公告)日：2004-08-30

申请号：MYPI9704493

申请日：1997-09-26

Applicant: IBM

Inventor： BROWN HUGH RALPH ,  CARTER KENNETH RAYMOND ,  CHA HYUK-JIN ,  DIPIETRO RICHARD ANTHONY ,  HEDRICK JAMES LUPTON ,  HUMMEL JOHN PATRICK ,  MILLER ROBERT DENNIS ,  YOON DO YEUNG

IPC: B32B3/10 ,  C08G77/455 ,  B32B15/08 ,  C08G73/10 ,  C09D183/10 ,  H01L21/316 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/522

Abstract: THE INVENTION RELATES TO AN INTEGRATED CIRCUIT DEVICE COMPRISING (I) A SUBSTRATE (2, 18); (II) METALLIC CIRCUIT LINES (4, 14, 16) POSITIONED ON THE SUBSTRATE AND (III) A DIELECTRIC MATERIAL (6, 10, 24) POSITIONED ON THE CIRCUIT LINES. THE DIELECTRIC MATERIAL COMPRISES THE REACTION PRODUCT OF AN ORGANIC POLYSILICA AND POLYAMIC ESTER PREFERABLY TERMINATED WITH AN ALKOXYSILYL ALKYL GROUP. (FIG. 1)

公开(公告)号：SG63750A1

公开(公告)日：1999-03-30

申请号：SG1997003478

申请日：1997-09-20

Applicant: IBM

Inventor： BROWN HUGH RALPH ,  CARTER KENNETH RAYMOND ,  CHA HYUK-JIN ,  DIPIETRO RICHARD ANTHONY ,  HEDRICK JAMES LUPTON ,  HUMMEL JOHN PATRICK ,  MILLER ROBERT DENNIS ,  YOON DO YEUNG

IPC: C08G77/455 ,  C08G73/10 ,  C09D183/10 ,  H01L21/316 ,  H01L21/768 ,  H01L23/498 ,  H01L23/522 ,  H01L21/312 ,  H01L21/48

Abstract: The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and polyamic ester preferably terminated with an alkoxysilyl alkyl group.