公开(公告)号：JPH10135202A

公开(公告)日：1998-05-22

申请号：JP28164197

申请日：1997-10-15

Applicant: IBM

Inventor： BROWN HUGH RALPH ,  KENETH RAYMOND CARTER ,  CHA HYUK-JIN ,  DIPIETRO RICHARD ANTHONY ,  JAMES LUPTON HEDRICK ,  HUMMEL JOHN PATRICK ,  ROBERT DENNIS MILLER ,  YOON DO YEUNG

IPC: C08G77/455 ,  C08G73/10 ,  C09D183/10 ,  H01L21/316 ,  H01L21/768 ,  H01L23/498 ,  H01L23/522

Abstract: PROBLEM TO BE SOLVED: To reduce required drive current and power consumption for the device, by laying interconnecting metal circuit lines on a substrate and disposing a specified dielectric material adjacent to the circuit lines. SOLUTION: The device comprises a substrate 2, meal circuit lines 4' and a dielectric material 6. The substrate 2 has vertical studs 8 formed therein. The dielectric material 6 in an org. polysilica, pref. a reaction product with polyaminate, having a terminal group (RO)m (R'')n SiR'-; m=1, 2 or 3, m+n=3, R and R' are hydrocarbyl group, R'' is hydride or hydrocarbyl group. The terminal group is a mono-, di- or tri-C1-C10 alkoxysilyl C1-10 alkyl or aryl group. This lowers the dielectric const. of the inserted dielectric material to allow the circuit line spacing to be reduced, without increasing the crosstalk or capacitive coupling, and also reduces the drive current and power consumption.

公开(公告)号：MY118011A

公开(公告)日：2004-08-30

申请号：MYPI9704493

申请日：1997-09-26

Applicant: IBM

Inventor： BROWN HUGH RALPH ,  CARTER KENNETH RAYMOND ,  CHA HYUK-JIN ,  DIPIETRO RICHARD ANTHONY ,  HEDRICK JAMES LUPTON ,  HUMMEL JOHN PATRICK ,  MILLER ROBERT DENNIS ,  YOON DO YEUNG

IPC: B32B3/10 ,  C08G77/455 ,  B32B15/08 ,  C08G73/10 ,  C09D183/10 ,  H01L21/316 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/522

Abstract: THE INVENTION RELATES TO AN INTEGRATED CIRCUIT DEVICE COMPRISING (I) A SUBSTRATE (2, 18); (II) METALLIC CIRCUIT LINES (4, 14, 16) POSITIONED ON THE SUBSTRATE AND (III) A DIELECTRIC MATERIAL (6, 10, 24) POSITIONED ON THE CIRCUIT LINES. THE DIELECTRIC MATERIAL COMPRISES THE REACTION PRODUCT OF AN ORGANIC POLYSILICA AND POLYAMIC ESTER PREFERABLY TERMINATED WITH AN ALKOXYSILYL ALKYL GROUP. (FIG. 1)

公开(公告)号：SG63750A1

公开(公告)日：1999-03-30

申请号：SG1997003478

申请日：1997-09-20

Applicant: IBM

Inventor： BROWN HUGH RALPH ,  CARTER KENNETH RAYMOND ,  CHA HYUK-JIN ,  DIPIETRO RICHARD ANTHONY ,  HEDRICK JAMES LUPTON ,  HUMMEL JOHN PATRICK ,  MILLER ROBERT DENNIS ,  YOON DO YEUNG

IPC: C08G77/455 ,  C08G73/10 ,  C09D183/10 ,  H01L21/316 ,  H01L21/768 ,  H01L23/498 ,  H01L23/522 ,  H01L21/312 ,  H01L21/48

Abstract: The invention relates to an integrated circuit device comprising (i) a substrate; (ii) metallic circuit lines positioned on the substrate and (iii) a dielectric material positioned on the circuit lines. The dielectric material comprises the reaction product of an organic polysilica and polyamic ester preferably terminated with an alkoxysilyl alkyl group.