3.
    发明专利
    未知

    公开(公告)号:DE1283004B

    公开(公告)日:1968-11-14

    申请号:DEJ0024339

    申请日:1963-08-29

    Applicant: IBM

    Abstract: 1,011,373. Random access storage for records; statistical apparatus. INTERNATIONAL BUSINESS MACHINES CORPORATION. Aug. 30, 1963 [Aug. 30, 1962], No. 34310/63. Headings G4M and G5R. Information storage apparatus comprises a plurality of storage channels each containing a record member and a pneumatic device adapted to eject a record from a selected storage channel. In Fig. 2 rectangular records 10 are stored in slots 14 formed in a storage member 12. Each slot 14 comprises a shallow rear portion 16 and a deeper forward portion 18 provided with grooves 24 on each side for engaging the edges of the record. If the record is five thousandths of an inch thick the rear portion 16 should have a depth of about six thousandths of an inch, and the spacing between upper and lower walls of forward portion 18 should be at least 0À018 inch, smaller spacing leading to instability when air is blown over the record by the ejector means. The ejector means comprises an air gun 32 adapted to be moved by solenoids (not shown) into a first position, where its nozzle is horizontally displaced from a channel 30 connected to the rear of a slot 14 so that the flow of air across the mouth of the channel 30 causes suction to be applied to the channel, or into a second position adjacent channel 30 so that air pressure is applied to the channel to blast the record 10 out of the storage member. The gun may be movable vertically to select a desired record, but preferably the gun is fixed in the vertical plane and the storage member 12 is movable. The record may be blasted clear of the storage member and after use the leading edge of the record may be fed into the slot 14 by an external feeding mechanism, the suction applied by the gun 32 then drawing the record completely into the storage means. Alternatively, Fig. 6 (not shown), the transducing station may be provided adjacent the storage means and may include a stop so that only part of the record is expelled from a slot 14; no external feeding mechanism is then required. If the record is in the form of a disc, each channel 30 may communicate with its associated rear portion 16 via a plurality of subchannels to apply the air pressure more uniformly along the rear edge of the disc, Fig. 7 (not shown). Another arrangement shown in plan in Fig. 5 allows the height of slots 14 1 to be reduced, and therefore for closer spacing of records in the storage member. The record strip (not shown) has a 45 degrees cut along the rear corner and is fed into the slot by external driving means. The record is driven out of the slot by an air blast applied through channel 30 1 to the cut edge of the strip. The air escapes through a duct 45 to atmosphere so there is little flow over the faces of the strip and consequently little tendency for the strip to vibrate. Specification 1,000,778 is referred to.

    4.
    发明专利
    未知

    公开(公告)号:DE3584222D1

    公开(公告)日:1991-10-31

    申请号:DE3584222

    申请日:1985-09-30

    Applicant: IBM

    Abstract: A method and apparatus for automatically detecting defects on the surfaces of semiconductor wafers (40) and chips which provides a 100% inspection capability. The entire surface of each water is scanned by use of a low magnification, low resolution detector (104) such as a photodiode array. Whenever a defect occurs, encoders (20) on the supporting XY table are triggered, such that the location of a defect on the wafer is recorded. After the event coordinates have been determined, the XY table positions each defect directly under a high magnification detector (204) to determine the nature of the detected event. Since only the locations of the detected events are stored, 100% of the processed wafers can be scanned for defects.

    5.
    发明专利
    未知

    公开(公告)号:DE3581295D1

    公开(公告)日:1991-02-21

    申请号:DE3581295

    申请日:1985-01-17

    Applicant: IBM

    Abstract: A method of plasma etching a batch of semiconductor wafers to end point using optical emission spectroscopy is described. The method is applicable to any form of dry plasma etching which produces an emission species capable of being monitored. In a preferred embodiment, as well as a first alternative embodiment, a computer simulation is performed using an algorithm describing the concentration of the monitored etch species within the etching chamber as a function of time. The simulation produces a time period for continuing the etching process past a detected time while monitoring the intensity of emission of the etch species. In a second alternative embodiment, this latter time period is calculated using mathematical distributions describing the parameters of the etching process. In all three embodiments, the actual time that end point of an etching process is reached is closely approximated. In this manner, all wafers in a batch of wafers being etched reach end point while at the same time, the amount of over etching is greatly minimized.

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