公开(公告)号：JPH11312734A

公开(公告)日：1999-11-09

申请号：JP3969299

申请日：1999-02-18

Applicant: IBM

Inventor： EDWARD C CORNEY III ,  STEPHEN E LUCY ,  COTE WILLIAM J ,  RONALD D GOLDBLATT

IPC: H01L21/768 ,  H01L21/28 ,  H01L21/283 ,  H01L21/98 ,  H01L23/52

Abstract: PROBLEM TO BE SOLVED: To provide a forming method of a contact to a copper metal inside an insulating layer via on a semiconductor wafer. SOLUTION: This contact forming method includes the five steps comprising a first step of forming a wafer 20 having a patterned copper layer 22, a second step of forming an insulating film 24 on the copper layer 22, a third step of forming a via 26 in the insulating film 24, a fourth step of forming a wafer 20 in reducing atmosphere for reducing a copper oxide on the copper in the via 26, to produce a copper as well as the fifth step of bringing the wafer 20 into contact with the copper inside the via 26, without exposing the wafer 20 to the oxidizing environment but to make a liner 52 adhere to the wafer 20. In such a constitution, this contact forming method can solve the problem of copper bounce detected in the via 26 cleaned up by conventional sputtering process. In addition, the liner 52 is selected for the adhesion and the avoidance of copper diffusion as well.

公开(公告)号：DE3880051T2

公开(公告)日：1993-10-28

申请号：DE3880051

申请日：1988-07-12

Applicant: IBM

Inventor： COTE WILLIAM J ,  KAANTA CARTER W GRANDVIEW ROAD ,  LEACH MICHAEL A ,  PAULSEN JAMES K STEAM MILL ROA

IPC: H01L21/3205 ,  H01L21/768 ,  H01L21/90

公开(公告)号：DE3852370T2

公开(公告)日：1995-05-24

申请号：DE3852370

申请日：1988-09-22

Applicant: IBM

Inventor： COTE WILLIAM J ,  KERBAUGH MICHAEL L ,  KENNEY DONALD M ,  LEACH MICHAEL A ,  ROBINSON JEFFREY A ,  SWEETSER ROBERT W

IPC: H01L21/302 ,  H01L21/027 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/31 ,  H01L21/312

公开(公告)号：DE68909168T2

公开(公告)日：1994-04-21

申请号：DE68909168

申请日：1989-10-21

Applicant: IBM

Inventor： COTE WILLIAM J ,  LEACH MICHAEL A

IPC: B24B37/04 ,  B24B49/16 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/00

公开(公告)号：DE3880051D1

公开(公告)日：1993-05-13

申请号：DE3880051

申请日：1988-07-12

Applicant: IBM

Inventor： COTE WILLIAM J ,  KAANTA CARTER W GRANDVIEW ROAD ,  LEACH MICHAEL A ,  PAULSEN JAMES K STEAM MILL ROA

IPC: H01L21/3205 ,  H01L21/768 ,  H01L21/90

公开(公告)号：DE3852370D1

公开(公告)日：1995-01-19

申请号：DE3852370

申请日：1988-09-22

Applicant: IBM

Inventor： COTE WILLIAM J ,  KERBAUGH MICHAEL L ,  KENNEY DONALD M ,  LEACH MICHAEL A ,  ROBINSON JEFFREY A ,  SWEETSER ROBERT W

IPC: H01L21/302 ,  H01L21/027 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/31 ,  H01L21/312

公开(公告)号：DE68909168D1

公开(公告)日：1993-10-21

申请号：DE68909168

申请日：1989-10-21

Applicant: IBM

Inventor： COTE WILLIAM J ,  LEACH MICHAEL A

IPC: B24B37/04 ,  B24B49/16 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/00