公开(公告)号：DE69832324T2

公开(公告)日：2006-07-27

申请号：DE69832324

申请日：1998-04-14

Applicant: IBM

Inventor： EDWARDS DAVID LINN ,  CAMMARANO ARMANDO SALVATORE ,  COFFIN JEFFREY THOMAS ,  COURTNEY MARK GERARD ,  DROFITZ STEPHEN S ,  ELLSWORTH MICHAEL JOSEPH ,  GOLDMANN LEWIS SIGMUND ,  IRUVANTI SUSHUMNA ,  POMPEO FRANK LOUIS ,  SABLINSKI WILLIAM EDWARD ,  SHERIF RAED A ,  TOY HILTON T

IPC: B23K35/14 ,  H01L23/10 ,  B23K35/26 ,  H01L21/50 ,  H01L21/60 ,  H01L23/02

Abstract: A scheme of providing a seal band for semi-conductor substrates and chip carriers encompasses a structure and a method that uses a multi-layer metallic seal (23) to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability. hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core (43), and lower melting point thin interconnecting solder layers (41.45). where the thin interconnecting solder layers may have similar or different melting points.