公开(公告)号：JPH0817831A

公开(公告)日：1996-01-19

申请号：JP29101294

申请日：1994-11-25

Applicant: IBM

Inventor： KURAUSU DEIITORITSUCHI BEIYAA ,  UIRIAMU RESURII GASURII ,  SUTANREE RICHIYAADO MAAKAREUIT ,  ERITSUKU MENDERU ,  UIRIAMU JIYON PATORITSUKU ,  KIYASARIIN ARISU PERII ,  UIRIAMU ARON PURISUKIN ,  YAKOBU RAIZUMAN ,  POORU MAACHIN SHIYAIBURU ,  CHIYAARUZU RANBAATO SUTANDOREI

IPC: H01L21/3205 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/768

Abstract: PURPOSE: To form a structure with a metal layer and a silicon dioxide layer on a same flat surface on a substrate. CONSTITUTION: A metal layer pattern 72 of Al-Cu is formed on a substrate 70, and a silicon dioxide layer 74 is adhered on it. The upper surface of the substrate is chemically and mechanically polished using a basic slurry containing silica particle until the surfaces of the metal layer pattern 72 and the silicon dioxide layer 74 become essentially the same flat surfaces.

公开(公告)号：JPS62102543A

公开(公告)日：1987-05-13

申请号：JP21422486

申请日：1986-09-12

Applicant: IBM

Inventor： KURAUSU DEIITORITSUCHI BEIYAA ,  UIRIAMU RESURII GASURII ,  SUTANREE RICHIYAADO MAAKAREUIT ,  ERITSUKU MENDERU ,  UIRIAMU JIYON PATORITSUKU ,  KIYASARIIN ARISU PERII ,  UIRIAMU ARON PURISUKIN ,  YAKOBU RAIZUMAN ,  POORU MAACHIN SHIYAIBURU ,  CHIYAARUZU RANBAATO SUTANDOREI

IPC: H01L21/3205 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/768

公开(公告)号：JPS59170175A

公开(公告)日：1984-09-26

申请号：JP22456383

申请日：1983-11-30

Applicant: Ibm

Inventor： JIYAGUTAA SHIN BASHI ,  ERITSUKU MENDERU

IPC: C09K3/14 ,  B24B37/04 ,  C01F7/02

CPC classification number: B24B37/04

公开(公告)号：JPS5531582A

公开(公告)日：1980-03-05

申请号：JP8158379

申请日：1979-06-29

Applicant: IBM

Inventor： JIYAGUTAA ESU BASHI ,  BINSENTO JIEI RAIANZU ,  ERITSUKU MENDERU

IPC: B24B37/00 ,  B24D13/14

公开(公告)号：JPS6062107A

公开(公告)日：1985-04-10

申请号：JP7883484

申请日：1984-04-20

Applicant: IBM

Inventor： SUTEFUN UIRIAMU KEESU SAADO ,  ERITSUKU MENDERU ,  MIYUN SOKU PATSUKU ,  YUUJIN JIYOSEFU BATSUTSUNAA ,  REON GAADONAA UIRUSON JIYUNIA

IPC: H01L21/02 ,  H01L21/208 ,  H01L21/322 ,  H01L21/33 ,  H01L21/331 ,  H01L29/02 ,  H01L29/70 ,  H01L29/73

公开(公告)号：JPS59170274A

公开(公告)日：1984-09-26

申请号：JP22456283

申请日：1983-11-30

Applicant: Ibm

Inventor： JIYAGUTAA SHIN BASHI ,  ERITSUKU MENDERU

IPC: C23F1/00 ,  B24B1/00 ,  B24B37/00 ,  C04B41/80 ,  C09K3/14 ,  C23F3/00

CPC classification number: B24B1/00 ,  C09K3/1463

公开(公告)号：JPS61163641A

公开(公告)日：1986-07-24

申请号：JP20073285

申请日：1985-09-12

Applicant: IBM

Inventor： JIEEMUZU ROBAATO HAUSU ,  ERITSUKU MENDERU

IPC: H01L21/304 ,  H01L21/306 ,  H01L29/06