公开(公告)号：JPH0817831A

公开(公告)日：1996-01-19

申请号：JP29101294

申请日：1994-11-25

Applicant: IBM

Inventor： KURAUSU DEIITORITSUCHI BEIYAA ,  UIRIAMU RESURII GASURII ,  SUTANREE RICHIYAADO MAAKAREUIT ,  ERITSUKU MENDERU ,  UIRIAMU JIYON PATORITSUKU ,  KIYASARIIN ARISU PERII ,  UIRIAMU ARON PURISUKIN ,  YAKOBU RAIZUMAN ,  POORU MAACHIN SHIYAIBURU ,  CHIYAARUZU RANBAATO SUTANDOREI

IPC: H01L21/3205 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/768

Abstract: PURPOSE: To form a structure with a metal layer and a silicon dioxide layer on a same flat surface on a substrate. CONSTITUTION: A metal layer pattern 72 of Al-Cu is formed on a substrate 70, and a silicon dioxide layer 74 is adhered on it. The upper surface of the substrate is chemically and mechanically polished using a basic slurry containing silica particle until the surfaces of the metal layer pattern 72 and the silicon dioxide layer 74 become essentially the same flat surfaces.

公开(公告)号：JPS5934661A

公开(公告)日：1984-02-25

申请号：JP10946483

申请日：1983-06-20

Applicant: Ibm

Inventor： HAASARAN SHIN BAATEIA ,  SATEIAPARU SHIN BAATEIA ,  YAKOBU RAIZUMAN ,  EMANIYUERU EI BUARUSAMAKISU

IPC: H01L29/73 ,  H01L21/225 ,  H01L21/285 ,  H01L21/331 ,  H01L23/485 ,  H01L29/735

CPC classification number: H01L29/735 ,  H01L21/2257 ,  H01L21/28525 ,  H01L23/485 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：JPS529648A

公开(公告)日：1977-01-25

申请号：JP7999576

申请日：1976-07-07

Applicant: IBM

Inventor： JIYOSEFU EMU HAABIRUCHIYATSUKU ,  UIRIAMU SHII METSUGAA ,  YAKOBU RAIZUMAN ,  JIERARUDEIN SHII SHIYUWARUTSU

IPC: C23F4/00 ,  C23F1/00 ,  H01L21/302 ,  H01L21/3065

公开(公告)号：JPS6045065A

公开(公告)日：1985-03-11

申请号：JP6130384

申请日：1984-03-30

Applicant: IBM

Inventor： NARASHIBAA KANDATSUPA ANANSA ,  YAKOBU RAIZUMAN ,  POORU JIYAMIN TSUANGU

IPC: H01L21/331 ,  H01L21/74 ,  H01L21/8222 ,  H01L21/8224 ,  H01L27/082 ,  H01L29/73 ,  H01L29/732 ,  H01L29/735

公开(公告)号：JPS5818938A

公开(公告)日：1983-02-03

申请号：JP8409482

申请日：1982-05-20

Applicant: IBM

Inventor： UEIIKAN CHIYU ,  UIRIAMU EARON PURISUKIN ,  YAKOBU RAIZUMAN

IPC: H01L21/76 ,  H01L21/31 ,  H01L21/3105 ,  H01L21/316 ,  H01L21/762

公开(公告)号：JPS52106280A

公开(公告)日：1977-09-06

申请号：JP1315477

申请日：1977-02-10

Applicant: IBM

Inventor： AABIN TSUE HOU ,  YAKOBU RAIZUMAN

IPC: G11C11/405 ,  G11C11/404 ,  H01L21/8242 ,  H01L27/07 ,  H01L27/102 ,  H01L27/108

公开(公告)号：JPS62102543A

公开(公告)日：1987-05-13

申请号：JP21422486

申请日：1986-09-12

Applicant: IBM

Inventor： KURAUSU DEIITORITSUCHI BEIYAA ,  UIRIAMU RESURII GASURII ,  SUTANREE RICHIYAADO MAAKAREUIT ,  ERITSUKU MENDERU ,  UIRIAMU JIYON PATORITSUKU ,  KIYASARIIN ARISU PERII ,  UIRIAMU ARON PURISUKIN ,  YAKOBU RAIZUMAN ,  POORU MAACHIN SHIYAIBURU ,  CHIYAARUZU RANBAATO SUTANDOREI

IPC: H01L21/3205 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/768

公开(公告)号：JPS58118158A

公开(公告)日：1983-07-14

申请号：JP18301682

申请日：1982-10-20

Applicant: IBM

Inventor： YAKOBU RAIZUMAN

IPC: H01L21/033 ,  H01L21/225 ,  H01L21/336 ,  H01L29/423 ,  H01L29/78

公开(公告)号：JPS58118156A

公开(公告)日：1983-07-14

申请号：JP18301382

申请日：1982-10-20

Applicant: IBM

Inventor： YAKOBU RAIZUMAN ,  POORU JIYAAMIN TSUANGU

IPC: H01L27/088 ,  H01L21/033 ,  H01L21/28 ,  H01L21/306 ,  H01L21/31 ,  H01L21/336 ,  H01L21/8234 ,  H01L29/78

公开(公告)号：JPS62219943A

公开(公告)日：1987-09-28

申请号：JP200787

申请日：1987-01-09

Applicant: IBM

Inventor： ANSONII JIYON DARI ,  SEIKI OGURA ,  YAKOBU RAIZUMAN ,  NIBUO ROBUDO

IPC: H01L21/76 ,  H01L21/762