公开(公告)号：JPS57155383A

公开(公告)日：1982-09-25

申请号：JP17909681

申请日：1981-11-10

Applicant: IBM

Inventor： POORU MAACHIN SHIYAIBURU ,  JIERARUDEIN KOGIN SHIYUWARUTSU

IPC: H01L21/302 ,  C23F1/00 ,  C23F4/00 ,  H01L21/3065 ,  H05K3/06 ,  H05K3/38

Abstract: A composite mask (5A, 6A) is formed by sequentially depositing blanket layers (5) and (6) of molybdenum and of a material respectively selected from the group consisting of MgO and Al2O3 on the surface of a copper layer (3), and producing in these layers (5) and (6) a pattern of openings corresponding to the negative of the desired copper pattern (3). Using said mask (5A, 6A) the portions of copper layer (3) exposed in said openings are removed, preferably by dry etching. MgO or Al2O3 adhere well to Mo and Mo adheres well to copper. The Mo layer (5A) also serves as a diffusion barrier for the copper. … The method is applicable in forming copper interconnect metallurgy for components such as semiconductor or dielectric substrates.

公开(公告)号：JPH0817831A

公开(公告)日：1996-01-19

申请号：JP29101294

申请日：1994-11-25

Applicant: IBM

Inventor： KURAUSU DEIITORITSUCHI BEIYAA ,  UIRIAMU RESURII GASURII ,  SUTANREE RICHIYAADO MAAKAREUIT ,  ERITSUKU MENDERU ,  UIRIAMU JIYON PATORITSUKU ,  KIYASARIIN ARISU PERII ,  UIRIAMU ARON PURISUKIN ,  YAKOBU RAIZUMAN ,  POORU MAACHIN SHIYAIBURU ,  CHIYAARUZU RANBAATO SUTANDOREI

IPC: H01L21/3205 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/768

Abstract: PURPOSE: To form a structure with a metal layer and a silicon dioxide layer on a same flat surface on a substrate. CONSTITUTION: A metal layer pattern 72 of Al-Cu is formed on a substrate 70, and a silicon dioxide layer 74 is adhered on it. The upper surface of the substrate is chemically and mechanically polished using a basic slurry containing silica particle until the surfaces of the metal layer pattern 72 and the silicon dioxide layer 74 become essentially the same flat surfaces.

公开(公告)号：JPS62102543A

公开(公告)日：1987-05-13

申请号：JP21422486

申请日：1986-09-12

Applicant: IBM

Inventor： KURAUSU DEIITORITSUCHI BEIYAA ,  UIRIAMU RESURII GASURII ,  SUTANREE RICHIYAADO MAAKAREUIT ,  ERITSUKU MENDERU ,  UIRIAMU JIYON PATORITSUKU ,  KIYASARIIN ARISU PERII ,  UIRIAMU ARON PURISUKIN ,  YAKOBU RAIZUMAN ,  POORU MAACHIN SHIYAIBURU ,  CHIYAARUZU RANBAATO SUTANDOREI

IPC: H01L21/3205 ,  H01L21/304 ,  H01L21/3105 ,  H01L21/3213 ,  H01L21/768

公开(公告)号：JPS5928366A

公开(公告)日：1984-02-15

申请号：JP8518483

申请日：1983-05-17

Applicant: Ibm

Inventor： POORU MAACHIN SHIYAIBURU ,  JIYON SHIYUABERUDO

IPC: H01L21/48 ,  H01L23/538 ,  H05K1/03 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4647 ,  H01L21/486 ,  H01L23/5383 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/01012 ,  H01L2924/09701 ,  H01L2924/15312 ,  H05K1/0306 ,  H05K3/061 ,  H05K3/4605 ,  H05K2201/0179 ,  H05K2203/0369 ,  H05K2203/0733