公开(公告)号：DE3171502D1

公开(公告)日：1985-08-29

申请号：DE3171502

申请日：1981-10-27

Applicant: IBM

Inventor： CANESTARO MICHAEL JAMES ,  FEY EDMOND OTTO

IPC: C23C22/63 ,  C23F1/34 ,  H05K3/38 ,  C23F1/00 ,  H05K3/06

Abstract: A copper foil having at least one nodular surface is contacted with an oxidizing composition for a length of time sufficient to oxidize said nodular surface of said copper foil further to roughen said nodular surface. The oxidizing composition e.g. consists of an aqueous alkaline solution of alkali metal chlorite, said solution containing said chlorite in a concentration of about 2 percent to about 10 percent, and alkali metal hydroxide in a concentration of about 0.3 percent to about 0.7 percent. … The copper foil resulting from the oxidizing treatment is useful as a sacrificial metal layer in producing metal plated substrates by creating an irregular surface on the dielectric substrate employed and it is applicable in the preparation of printed circuits.

公开(公告)号：DE3379719D1

公开(公告)日：1989-06-01

申请号：DE3379719

申请日：1983-12-28

Applicant: IBM

Inventor： BERNIER WILLIAM EMMETT ,  EMMI FRANCIS ,  FEY EDMOND OTTO ,  GENDLER PAUL LEWIS ,  TWIEG ROBERT JAMES

IPC: B41M5/20

公开(公告)号：DE3769813D1

公开(公告)日：1991-06-13

申请号：DE3769813

申请日：1987-01-28

Applicant: IBM

Inventor： FEY EDMOND OTTO ,  HASELBAUER PETER ,  JUNG DAE YOUNG ,  KASCHAK RONALD ANTHONY ,  KILTHAU HANS-DIETER ,  MAGNUSON ROY HARVEY ,  WAGNER ROBERT JOSEPH

IPC: C23C18/31 ,  C23C18/16 ,  C23C18/40 ,  H05K3/18 ,  C23C18/38 ,  H05K3/00