公开(公告)号：JP2002026441A

公开(公告)日：2002-01-25

申请号：JP2001137713

申请日：2001-05-08

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL FRANCIS ,  FREITAG LADD WILLIAM ,  GARY T GARY ,  FRANCOIS M GINDON ,  JOHNSON GLEN WALDEN ,  MARSHALL A RUTOONEOO ,  SHERMAN JOHN H ,  REALE TETORAATO

IPC: H01S5/024 ,  G02B6/42 ,  H01L23/373

Abstract: PROBLEM TO BE SOLVED: To provide an optoelectronic module having a miniaturized package size by improving the heat removal from optoelectronic chips and eliminating the crosstalk between the chips by means of a simplified structure, and then, using a simple and sure assembling method. SOLUTION: A heat sink for the transceiver optoelectronic module contains a double direct heat route, a structure surrounding many chips, and a central web which electrically separates a transmitter chip and a receiver chip from each other. A retainer used for an optical coupler has a port into which an epoxy is injected. On the over-molded base of the optoelectronic module, an epoxy flow managing member is formed. The assembling method of the optoelectronic module includes gap setting and a modified TAB bonding process.

公开(公告)号：DE69027522D1

公开(公告)日：1996-07-25

申请号：DE69027522

申请日：1990-11-27

Applicant: IBM

Inventor： BLOCK TIMOTHY ROY ,  EBLER MARCIA BERG ,  FREITAG LADD WILLIAM ,  HEILING GERALD MICHAEL ,  HOLTER SPENCER CLINTON ,  KARST DENNIS LEON ,  SILJENBERG DAVID WARREN ,  SODERSTROM RONALD LEE ,  TRNKA JOHN THOMAS

IPC: H04B10/12 ,  G02B6/38 ,  H04B10/135 ,  H04B10/14 ,  H04B10/155 ,  H04B10/2581 ,  H04B10/00 ,  G02B6/42

Abstract: An optical fiber link card communication module, and process for fabricating the module, where the module provides a parallel electrical interface to the user, facilitates high speed serial transmission of data over an optical data link, and contains a plurality of converters (130,131) for performing conversions between both electrical and optical signals. The module further includes edge mounted optical components having leads mounted on the surface of a card (as opposed to standard pin-in-hole type leads) to minimize lead capacitance and inductance from the optical components to the card electronics, on board card control means for the converters and safety shut down means on the same card as the electrical and optical components. A preferred embodiment of the invention contemplates fabricating the optical communication module on a single multilayer card with all the transmitter electrical components being located on one side of the card, all receiver electrical components being located on the other side of the card, and the transmitter and receiver components being separated by shielding layers in the card. By using two transmitter/receiver pairs (with the transmitters and receivers being located on respective sides of the card) an embodiment of the invention provides for double full duplex communications.

公开(公告)号：DE69027522T2

公开(公告)日：1997-01-23

申请号：DE69027522

申请日：1990-11-27

Applicant: IBM

Inventor： BLOCK TIMOTHY ROY ,  EBLER MARCIA BERG ,  FREITAG LADD WILLIAM ,  HEILING GERALD MICHAEL ,  HOLTER SPENCER CLINTON ,  KARST DENNIS LEON ,  SILJENBERG DAVID WARREN ,  SODERSTROM RONALD LEE ,  TRNKA JOHN THOMAS

IPC: H04B10/12 ,  G02B6/38 ,  H04B10/135 ,  H04B10/14 ,  H04B10/155 ,  H04B10/2581 ,  H04B10/00 ,  G02B6/42

Abstract: An optical fiber link card communication module, and process for fabricating the module, where the module provides a parallel electrical interface to the user, facilitates high speed serial transmission of data over an optical data link, and contains a plurality of converters (130,131) for performing conversions between both electrical and optical signals. The module further includes edge mounted optical components having leads mounted on the surface of a card (as opposed to standard pin-in-hole type leads) to minimize lead capacitance and inductance from the optical components to the card electronics, on board card control means for the converters and safety shut down means on the same card as the electrical and optical components. A preferred embodiment of the invention contemplates fabricating the optical communication module on a single multilayer card with all the transmitter electrical components being located on one side of the card, all receiver electrical components being located on the other side of the card, and the transmitter and receiver components being separated by shielding layers in the card. By using two transmitter/receiver pairs (with the transmitters and receivers being located on respective sides of the card) an embodiment of the invention provides for double full duplex communications.