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公开(公告)号：JP2002043342A
公开(公告)日：2002-02-08
申请号：JP2001137796
申请日：2001-05-08
Applicant: IBM
Inventor： CHAN BENSON , FORTIER PAUL FRANCIS , FRANCOIS M GINDON , JOHNSON GLEN WALDEN , MARSHALL A RUTOONEOO , SHERMAN JOHN H , REALE TETORAATO
Abstract: PROBLEM TO BE SOLVED: To provide a method by which positioning of a laminate substrate or other substrates on a mold base is improved. SOLUTION: This alignment system of a photoelectric module has an overmolded chip carrier 26 and positions a substrate in a mold precisely to form an overmold frame 18 on the substrate. Co-operating stand-off pads 70, 71, 72 in a retainer assembly on the overmold frame stabilize an assembly of these components, and provide precise gaps to bond these two components permanently. The retainer assembly 36 has a co-operating feature for positioning an end electric lead of a flexible circuit in an electric pad array on the substrate. A nearby electric lead is protected by a permanent enclosing plate on a nearby edge portion of the flexible circuit and positioned by optic dies and an electric pad on their carriers.
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公开(公告)号：JP2005004214A
公开(公告)日：2005-01-06
申请号：JP2004172726
申请日：2004-06-10
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： CHAN BENSON , FORTIER PAUL FRANCIS , FRANCOIS M GINDON , JOHNSON GLEN WALDEN , MARSHALL A RUTOONEOO , SHERMAN JOHN H , REALE TETORAATO
CPC classification number: B29C45/14655 , B29C45/14065 , G02B6/4201 , G02B6/421 , G02B6/423 , G02B6/4231 , G02B6/4239 , G02B6/4255 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4292
Abstract: PROBLEM TO BE SOLVED: To precisely align a laminated substrate and other substrates on a mold base.
SOLUTION: An alignment system has overmolded chip carriers and precisely aligns the substrate within a mold. Cooperating standoff pads on an overmold frame and on a retainer assembly provide a precise gap to receive an adhesive. The retainer assembly carries optoelectronic components, including a flexible circuit, and a tip portion of the flexible circuit and a wall of a receiving cavity within the overmold frame have a cooperating feature, to precisely register a distal electrical lead of the flexible circuit with an array of an electrical pad on the board. A permanent shroud at an approximate end portion of the flexible circuit protects and helps to register approximate electrical leads with the electrical pad on optic dye and on these carriers.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：将层压基板和其他基板精确对准在模具基座上。 解决方案：对准系统包覆成型芯片载体并精确地将基板对准模具内。 包覆模制框架和保持器组件上的配合支座提供精确的间隙以接收粘合剂。 保持器组件携带光电子部件，包括柔性电路，柔性电路的尖端部分和覆盖模制框架内的接收腔的壁具有配合特征，以精确地将柔性电路的远端电引线与阵列 的板上的电垫。 在柔性电路的大致端部处的永久性护罩保护并有助于将近似的电引线与光学染料上的电焊盘和这些载体对准。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2002026441A
公开(公告)日：2002-01-25
申请号：JP2001137713
申请日：2001-05-08
Applicant: IBM
Inventor： CHAN BENSON , FORTIER PAUL FRANCIS , FREITAG LADD WILLIAM , GARY T GARY , FRANCOIS M GINDON , JOHNSON GLEN WALDEN , MARSHALL A RUTOONEOO , SHERMAN JOHN H , REALE TETORAATO
IPC: H01S5/024 , G02B6/42 , H01L23/373
Abstract: PROBLEM TO BE SOLVED: To provide an optoelectronic module having a miniaturized package size by improving the heat removal from optoelectronic chips and eliminating the crosstalk between the chips by means of a simplified structure, and then, using a simple and sure assembling method. SOLUTION: A heat sink for the transceiver optoelectronic module contains a double direct heat route, a structure surrounding many chips, and a central web which electrically separates a transmitter chip and a receiver chip from each other. A retainer used for an optical coupler has a port into which an epoxy is injected. On the over-molded base of the optoelectronic module, an epoxy flow managing member is formed. The assembling method of the optoelectronic module includes gap setting and a modified TAB bonding process.
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