公开(公告)号：JP2002026441A

公开(公告)日：2002-01-25

申请号：JP2001137713

申请日：2001-05-08

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL FRANCIS ,  FREITAG LADD WILLIAM ,  GARY T GARY ,  FRANCOIS M GINDON ,  JOHNSON GLEN WALDEN ,  MARSHALL A RUTOONEOO ,  SHERMAN JOHN H ,  REALE TETORAATO

IPC: H01S5/024 ,  G02B6/42 ,  H01L23/373

Abstract: PROBLEM TO BE SOLVED: To provide an optoelectronic module having a miniaturized package size by improving the heat removal from optoelectronic chips and eliminating the crosstalk between the chips by means of a simplified structure, and then, using a simple and sure assembling method. SOLUTION: A heat sink for the transceiver optoelectronic module contains a double direct heat route, a structure surrounding many chips, and a central web which electrically separates a transmitter chip and a receiver chip from each other. A retainer used for an optical coupler has a port into which an epoxy is injected. On the over-molded base of the optoelectronic module, an epoxy flow managing member is formed. The assembling method of the optoelectronic module includes gap setting and a modified TAB bonding process.