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公开(公告)号:AT404996T
公开(公告)日:2008-08-15
申请号:AT04777432
申请日:2004-06-30
Applicant: IBM
Inventor: BRYANT ANDRES , CLARK WILLIAM , FRIED DAVID , JAFFE MARK , NOWAK EDWARD , PEKARIK JOHN , PUTNAM CHRISTOPHER
IPC: H01L29/06 , H01L21/00 , H01L21/308 , H01L21/336 , H01L21/8238 , H01L21/84 , H01L27/12 , H01L29/76 , H01L29/786
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公开(公告)号:AT467905T
公开(公告)日:2010-05-15
申请号:AT02808339
申请日:2002-12-20
Applicant: IBM
Inventor: RANKIN JED , ABADEER WAGDI , BROWN JEFFREY , CHATTY KIRAN , TONTI WILLIAM , GAUTHIER ROBERT , FRIED DAVID
IPC: H01L23/525 , H01L21/82 , H01L21/84 , H01L27/06 , H01L27/118 , H01L27/12
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公开(公告)号:AT498199T
公开(公告)日:2011-02-15
申请号:AT03719421
申请日:2003-03-19
Applicant: IBM
Inventor: CLARK WILLIAM , FRIED DAVID , LANZEROTTI LOUIS , NOWAK EDWARD
IPC: H01L21/336 , H01L29/10 , H01L29/78 , H01L29/786
Abstract: A method and structure for a transistor that includes an insulator and a silicon structure on the insulator. The silicon structure includes a central portion and Fins extending from ends of the central portion. A first gate is positioned on a first side of the central portion of the silicon structure. A strain-producing layer could be between the first gate and the first side of the central portion of the silicon structure and a second gate is on a second side of the central portion of the silicon structure.
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