Optical mask with integral spacers and method of making
    2.
    发明授权
    Optical mask with integral spacers and method of making 失效
    具有整体间隔的光学面罩及其制作方法

    公开(公告)号:US3676002A

    公开(公告)日:1972-07-11

    申请号:US3676002D

    申请日:1969-06-30

    Applicant: IBM

    CPC classification number: G03F1/50

    Abstract: THIS IS AN OPTICAL MASK PRIMARILY FOR USE IN THE MANUFACTURE OF SOLID STATE SEMICONDUCTOR DEVICES. THE MASK HAS INTEGRAL SPACER PORTIONS WHICH INTIMATELY CONTACT THE SURFACE OF THE DEVICE DURING THE STAGE IN THE PROCESSING WHEN THE PHOTORESIST IS EXPOSED. THESE INTEGRAL SPACERS NOT ONLY PROTECT THE MASK DURING CONTACT WITH THE DEVICE BUT ALSO PROVIDE IMPROVED DEVICES BECAUSE OF SUPERIOR OPTICAL CHARACTERISTICS.

    METHOD FOR FORMING PHOTORESIST PATTERN
    6.
    发明专利

    公开(公告)号:JP2002323773A

    公开(公告)日:2002-11-08

    申请号:JP2002031631

    申请日:2002-02-08

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide a device and a method to develop a photoresist pattern on the substrate of electronic parts such as semiconductor wafers. SOLUTION: A specified developer composition and a specified rinsing liquid composition are successively used to develop an exposed photoresist pattern and to rinse the developed pattern. Both of the developer composition and the rising liquid composition contain anionic surfactants. By successively using the above solutions, a resist pattern with the pattern prevented from deformation can be obtained even when small features of about >3 aspect ratio and

    RESIST COMPOSITION, AND METHOD FOR FORMING RESIST LAYER WITH PATTERN FORMED ON SUBSTRATE

    公开(公告)号:JP2000221686A

    公开(公告)日:2000-08-11

    申请号:JP2000013834

    申请日:2000-01-24

    Applicant: IBM

    Abstract: PROBLEM TO BE SOLVED: To provide the resist composition high in resolution and intensified in etching resistance by incorporating acid-sensitive protective groups in one of a polymer additive containing silicon and a base polymer containing no silicon and solubilizing both of the polymer additive and the base polymer in an aqueous basic solution after exposure processing. SOLUTION: The resist composition contains the polymer additive (a) containing silicon and the base polymer (b) containing no silicon and a photo- acid-generator and a solvent, and one of (a) and (b) contains the acid-sensitive protective groups and both of them are soluble in an aqueous basic solution after the exposure processing. The polymer additive (a) is a homopolymer of a siloxane and silane and silsesqueioxane or silyl homopolymer or a copolymer containing a monomer selected from a group comprising a siloxane, silane, silsesquinoxane, and silyl.

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