Abstract:
Polysulfone resists are made more sensitive to decomposition by electron beam radiation and also made sensitive to radiation of light in the 3,000 to 5,000 A region by the addition of sensitizers which are either energy transfer agents or sources of free radicals.
Abstract:
THIS IS AN OPTICAL MASK PRIMARILY FOR USE IN THE MANUFACTURE OF SOLID STATE SEMICONDUCTOR DEVICES. THE MASK HAS INTEGRAL SPACER PORTIONS WHICH INTIMATELY CONTACT THE SURFACE OF THE DEVICE DURING THE STAGE IN THE PROCESSING WHEN THE PHOTORESIST IS EXPOSED. THESE INTEGRAL SPACERS NOT ONLY PROTECT THE MASK DURING CONTACT WITH THE DEVICE BUT ALSO PROVIDE IMPROVED DEVICES BECAUSE OF SUPERIOR OPTICAL CHARACTERISTICS.
Abstract:
LIGHT SENSITIVE PHOTORESIST COMPOSITIONS PARTICULARLY USEFUL FOR PROJECTION EXPOSURE APPLICATIONS INCLUDE A PHOTOCROSSLINKABLE POLYMER AND NOVEL SENSITIZERS WHICH ARE BISP-AZIDO CINNAMYLIDENE DERIVATIVES OF CYCLIC AND LINEAR KETONES.
Abstract:
Antireflective compositions characterized by the presence of an SiO-containing polymer having pendant chromophore moieties are useful antireflective coating/hardmask compositions in lithographic processes. These compositions provide outstanding optical, mechanical and etch selectivity properties while being applicable using spin-on application techniques. The compositions are especially useful in lithographic processes used to configure underlying material layers on a substrate, especially metal or semiconductor layers.
Abstract:
Resist compositions having good footing properties even on difficult substrates are obtained by using a combination of base additives including a room temperature solid base, and a liquid low vapor pressure base. The compositions are especially useful on metal substrates such as chromium-containing layers commonly used in mask-making.
Abstract:
PROBLEM TO BE SOLVED: To provide a device and a method to develop a photoresist pattern on the substrate of electronic parts such as semiconductor wafers. SOLUTION: A specified developer composition and a specified rinsing liquid composition are successively used to develop an exposed photoresist pattern and to rinse the developed pattern. Both of the developer composition and the rising liquid composition contain anionic surfactants. By successively using the above solutions, a resist pattern with the pattern prevented from deformation can be obtained even when small features of about >3 aspect ratio and
Abstract:
Resist compositions having good footing properties even on difficult substrates are obtained by using a combination of base additives including a room temperature solid base, and a liquid low vapor pressure base. The compositions are especially useful on metal substrates such as chromium-containing layers commonly used in mask-making.
Abstract:
PROBLEM TO BE SOLVED: To provide a method and device for removing a solid residual or a liquid residual, or both of them, from an electronic component such as a semiconductor wafer or the like. SOLUTION: The residual is solidified on the surface of the wafer by the use of liquid or a supercritical carbon dioxide, and then the residual is removed by vaporization from the system. In a favorable embodiment, after the solidifying step and the vaporizing step are repeated (cycled), the CO 2 is removed from a vessel. The residual is removed with the vaporizing carbon dioxide. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide the resist composition high in resolution and intensified in etching resistance by incorporating acid-sensitive protective groups in one of a polymer additive containing silicon and a base polymer containing no silicon and solubilizing both of the polymer additive and the base polymer in an aqueous basic solution after exposure processing. SOLUTION: The resist composition contains the polymer additive (a) containing silicon and the base polymer (b) containing no silicon and a photo- acid-generator and a solvent, and one of (a) and (b) contains the acid-sensitive protective groups and both of them are soluble in an aqueous basic solution after the exposure processing. The polymer additive (a) is a homopolymer of a siloxane and silane and silsesqueioxane or silyl homopolymer or a copolymer containing a monomer selected from a group comprising a siloxane, silane, silsesquinoxane, and silyl.