公开(公告)号：JPS6083332A

公开(公告)日：1985-05-11

申请号：JP9671084

申请日：1984-05-16

Applicant: IBM

Inventor： HIROYUKI HIRAOKA

IPC: C23C14/12 ,  C23F1/00 ,  C23F1/02 ,  G03F1/20 ,  G03F7/09 ,  H01L21/027 ,  H01L21/302 ,  H01L21/3065 ,  H01L21/311

公开(公告)号：JPS6377052A

公开(公告)日：1988-04-07

申请号：JP12610987

申请日：1987-05-25

Applicant: IBM

Inventor： HIROYUKI HIRAOKA

IPC: G03C1/00 ,  G03F7/038 ,  G03F7/039 ,  G03F7/075 ,  G03F7/11 ,  H01L21/027

公开(公告)号：JPS6062123A

公开(公告)日：1985-04-10

申请号：JP9763884

申请日：1984-05-17

Applicant: IBM

Inventor： HIROYUKI HIRAOKA

IPC: H01L21/027 ,  G03F7/075 ,  G03F7/16 ,  G03F7/20 ,  H01L21/312

公开(公告)号：JPS6356919A

公开(公告)日：1988-03-11

申请号：JP12610687

申请日：1987-05-25

Applicant: IBM

Inventor： HIROYUKI HIRAOKA ,  JIEFUREI UIRIAMU RABADEII ,  JIEEMUZU SHII TANGU RII ,  SUKOTSUTO AASAA MAKUDONARUDO ,  KAARUTON GURANTO UIRUSON

IPC: H01L21/302 ,  G03F7/40 ,  H01L21/027 ,  H01L21/3065

公开(公告)号：JPS58115435A

公开(公告)日：1983-07-09

申请号：JP17650182

申请日：1982-10-08

Applicant: IBM

Inventor： JIYOAKIMU BAAGON ,  HIROYUKI HIRAOKA ,  ROORENSU UIRIAMU UERUSHIYU JIY

IPC: G03F7/039 ,  G03F7/004 ,  G03F7/038 ,  G03F7/26 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027

公开(公告)号：JPS5842041A

公开(公告)日：1983-03-11

申请号：JP10148182

申请日：1982-06-15

Applicant: IBM

Inventor： JIEEMUZU EKONOMII ,  ROI JIYON GURITSUTAA ,  HIROYUKI HIRAOKA

IPC: G03C1/72 ,  C08G8/00 ,  G03F7/039

Abstract: A positive working electron beam resist comprising a resinous condensation product of formaldehyde with a phenol or a cresol having a chloro substituent ortho to the hydroxyl group on its aromatic ring is imagewise exposed to electron beam irradiation and then the exposed portion of the resist is dissolved away to leave a petterned mask.

公开(公告)号：JPS60251628A

公开(公告)日：1985-12-12

申请号：JP604385

申请日：1985-01-18

Applicant: IBM

Inventor： HIROYUKI HIRAOKA

IPC: H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H05K3/00

公开(公告)号：JPH02291562A

公开(公告)日：1990-12-03

申请号：JP6287290

申请日：1990-03-15

Applicant: IBM

Inventor： HIROYUKI HIRAOKA

IPC: G03F7/11 ,  G03F7/38 ,  G03F7/40 ,  H01L21/027

Abstract: PURPOSE: To prevent the swelling and cracking of the surface of a resist image by coating the image with poly (dimethylsilazane), heating the coated image and washing it with a solvent. CONSTITUTION: When a photoresist image is treated so as to impart resistance to reactive ion etching, the image is coated with poly (dimethylsilazane) and the coated image is heated and washed with a solvent. The poly (dimethylsilazane) is dissolved in a hydrocarbon solvent and used for silylating the resist image. The heating process is carried out at 95 deg.C for about 30min on a hot plate which is most convenient and enables easy heating. A solvent such as toluene or xylene is used. The swelling and cracking of the surface of the resist image are prevented.

公开(公告)号：JPH01235016A

公开(公告)日：1989-09-20

申请号：JP295589

申请日：1989-01-11

Applicant: IBM

Inventor： HEIDEI RII DEITSUKUSUTEIIN ,  HIROYUKI HIRAOKA ,  JIEEMUZU SHIIITANGU RII

IPC: G11B5/17 ,  G11B5/31

Abstract: PURPOSE: To decrease the treating temp. and treating time in the production of a thin film magnetic head and to improve the dimensional stability by using a photosensitive resin crosslinked with a crosslinking agent which is activated by heat to form an electric insulating body surrounding a conductive coil. CONSTITUTION: The thin film magnetic head assembly 11 consists of a nonmagnetic ceramic base body and a magnetic pole piece layers 12, 14 formed on the base body. A nonmagnetic insulating material 22 is deposited between the magnetic pole piece layers 12, 14. As for the nonmagnetic insulating material 22, a photosensitive resin containing a crosslinking agent which is activated by heat is used. Thereby, the hardening time is significantly decreased, the hardening temp. is significantly decreased, and a more stable insulating layer can be formed.

公开(公告)号：JPS60124940A

公开(公告)日：1985-07-04

申请号：JP14983384

申请日：1984-07-20

Applicant: IBM

Inventor： HIROYUKI HIRAOKA

IPC: H01L21/027 ,  G03F7/075 ,  G03F7/09 ,  G03F7/20 ,  G03F7/26 ,  G03F7/30 ,  H01L21/30 ,  H01L21/311