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公开(公告)号:DE3871712T2
公开(公告)日:1993-01-28
申请号:DE3871712
申请日:1988-10-05
Applicant: IBM
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公开(公告)号:DE69328328T2
公开(公告)日:2000-10-19
申请号:DE69328328
申请日:1993-07-30
Applicant: IBM
Inventor: DONLAN JR FRASER PATRICK , HARE DAVID DWIGHT , JONES JEFFREY DONALD , MILLER THOMAS LAWRENCE , MOORE RONALD JAMES , NELSON RICHARD FRANCIS
IPC: B05C5/02 , B05D1/36 , B08B3/02 , C23F1/08 , F26B21/00 , H01L21/304 , H05K3/00 , H05K3/06 , H05K3/22 , H05K3/26
Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
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公开(公告)号:ES2114973T3
公开(公告)日:1998-06-16
申请号:ES93109877
申请日:1993-06-21
Applicant: IBM
Inventor: BARD STEVEN LINDZ , JONES JEFFREY DONALD , KATYL ROBERT HENRY , MOORE RONALD JAMES , MORENO OSCAR AUREO
IPC: B05C5/02 , B05D1/36 , B08B3/02 , C23F1/08 , F26B21/00 , H01L21/304 , H05K3/00 , H05K3/22 , H05K3/26
Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
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公开(公告)号:DE69317703D1
公开(公告)日:1998-05-07
申请号:DE69317703
申请日:1993-06-21
Applicant: IBM
Inventor: BARD STEVEN LINDZ , JONES JEFFREY DONALD , KATYL ROBERT HENRY , MOORE RONALD JAMES , MORENO OSCAR AUREO
IPC: B05C5/02 , B05D1/36 , B08B3/02 , C23F1/08 , F26B21/00 , H01L21/304 , H05K3/00 , H05K3/22 , H05K3/26
Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
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公开(公告)号:AT164722T
公开(公告)日:1998-04-15
申请号:AT93109877
申请日:1993-06-21
Applicant: IBM
Inventor: BARD STEVEN LINDZ , JONES JEFFREY DONALD , KATYL ROBERT HENRY , MOORE RONALD JAMES , MORENO OSCAR AUREO
IPC: B05C5/02 , B05D1/36 , B08B3/02 , C23F1/08 , F26B21/00 , H01L21/304 , H05K3/00 , H05K3/22 , H05K3/26
Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
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公开(公告)号:SG44399A1
公开(公告)日:1997-12-19
申请号:SG1996000148
申请日:1993-06-21
Applicant: IBM
Inventor: BARD STEVEN LINDZ , JONES JEFFREY DONALD , KATYL ROBERT HENRY , MOORE RONALD JAMES , MORENO OSCAR AUREO
IPC: B05C5/02 , B05D1/36 , B08B3/02 , C23F1/08 , F26B21/00 , H01L21/304 , H05K3/00 , H05K3/22 , H05K3/26
Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
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公开(公告)号:DE3871712D1
公开(公告)日:1992-07-09
申请号:DE3871712
申请日:1988-10-05
Applicant: IBM
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公开(公告)号:DE69328328D1
公开(公告)日:2000-05-18
申请号:DE69328328
申请日:1993-07-30
Applicant: IBM
Inventor: DONLAN JR FRASER PATRICK , HARE DAVID DWIGHT , JONES JEFFREY DONALD , MILLER THOMAS LAWRENCE , MOORE RONALD JAMES , NELSON RICHARD FRANCIS
IPC: B05C5/02 , B05D1/36 , B08B3/02 , C23F1/08 , F26B21/00 , H01L21/304 , H05K3/00 , H05K3/06 , H05K3/22 , H05K3/26
Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
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公开(公告)号:DE69317703T2
公开(公告)日:1998-10-29
申请号:DE69317703
申请日:1993-06-21
Applicant: IBM
Inventor: BARD STEVEN LINDZ , JONES JEFFREY DONALD , KATYL ROBERT HENRY , MOORE RONALD JAMES , MORENO OSCAR AUREO
IPC: B05C5/02 , B05D1/36 , B08B3/02 , C23F1/08 , F26B21/00 , H01L21/304 , H05K3/00 , H05K3/22 , H05K3/26
Abstract: A new apparatus for treating substrates with fluids, as well as a corresponding fluid treatment method, is disclosed. The new apparatus includes a new configuration of fluid jet injectors which substantially overcomes the problem of dragout, in which fluid impinged upon an area of a substrate is retained on that area, preventing fresh fluid from reaching the impinged area. This new configuration also avoids imposing torques on substrates, and substantially reduces the need for rollers and guides for transporting substrates.
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公开(公告)号:DE69301060T2
公开(公告)日:1996-07-04
申请号:DE69301060
申请日:1993-04-23
Applicant: IBM
Inventor: AMEEN JOSEPH GEORGE , FUNARI JOSEPH , MOORE RONALD JAMES
Abstract: A method of precisely depositing accurately defined quantities of solder (21) onto high density circuit patterns (23) on a substrate (25) without use of a solder mask or the like wherein solder paste (21) is originally deposited within a precisely defined transfer member (11) (e.g., graphite block having holes drilled therein), the transfer member (15) then being aligned relative to the respective circuitry such that when both block (11) and substrate (25) are heated, solder flow and deposition will occur without the use of a solder mask or the like. Following deposition, a second circuit member (e.g., flexible circuit) may be electrically coupled to the substrate's conductors (23), the deposited solder providing the coupling medium. Hydrogen gas may be used during the heating of the paste and also during the soldering of the flexible circuit to the substrate.
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