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    DIAPHRAGM ACTIVATED MICRO-ELECTROMECHANICAL SWITCH
    1.
    发明公开
    DIAPHRAGM ACTIVATED MICRO-ELECTROMECHANICAL SWITCH 有权
    MEMBRANAKIVIERTER微机电开关

    公开(公告)号：EP1535297A4

    公开(公告)日：2007-07-18

    申请号：EP02768707

    申请日：2002-08-26

    Applicant: IBM

    Inventor： JAHNES CHRISTOPHER V ,  LUND JENNIFER L ,  SAENGER KATHERINE L ,  VOLANT RICHARD P

    IPC: B81B3/00 ,  B81C1/00 ,  G02B5/00 ,  G02B26/00 ,  G02B26/08 ,  H01H57/00 ,  H01H59/00

    CPC classification number: H01H59/0009 ,  H01H2057/006

    Abstract: A micro-electromechanical (MEM) RF switch provided with a deflectable membrane (60) activates a switch contact or plunger (40). The membrane incorporates interdigitated metal electrodes (70) which cause a stress gradient in the membrane when activated by way of a DC electric field. The stress gradient results in a predictable bending or displacement of the membrane (60), and is used to mechanically displace the switch contact (30). An RF gap area (25) located within the cavity (250) is totally segregated from the gaps (71) between the interdigitated metal electrodes (70). The membrane is electrostatically displaced in two opposing directions, thereby aiding to activate and deactivate the switch. The micro-electromechanical switch includes: a cavity (250); at least one conductive path (20) integral to a first surface bordering the cavity; a flexible membrane (60) parallel to the first surface bordering the cavity (250), the flexible membrane (60) having a plurality of actuating electrodes (70); and a plunger (40) attached to the flexible membrane (60) in a direction away from the actuating electrodes (70), the plunger (40) having a conductive surface that makes electric contact with the conductive paths, opening and closing the switch.

    MICRO-ELECTROMECHANICAL SWITCH HAVING A DEFORMABLE ELASTOMERIC CONDUCTIVE ELEMENT
    2.
    发明公开
    MICRO-ELECTROMECHANICAL SWITCH HAVING A DEFORMABLE ELASTOMERIC CONDUCTIVE ELEMENT 审中-公开
    微机电开关，可变形的弹性LEITFüHIGEN元

    公开(公告)号：EP1535296A4

    公开(公告)日：2007-04-04

    申请号：EP02746591

    申请日：2002-06-14

    Applicant: IBM

    Inventor： DELIGIANNI HARIKLIA ,  GREENBERG DAVID R ,  JAHNES CHRISTOPHER V ,  LUND JENNIFER L ,  SAENGER KATHERINE L ,  VOLANT RICHARD P

    IPC: H01H57/00 ,  H01H59/00 ,  H01L21/00

    CPC classification number: H01H59/0009

    Abstract: A micro-electromechanical switch (MEMS) having a deformable elastomeric element (1) which exhibits a large change in conductivity with a small amount of displacement. The deformable elastomeric element (1) is displaced by an electrostatic force that is applied laterally resulting in a small transverse displacement. The transversal displacement, in turn, pushes a metallic contact (7) against two conductive paths (5, 6), allowing passage of electrical signals. The elastomer (1) is provided on two opposing sids with embedded metallic elements (9, 10), such as impregnated metallic rods, metallic sheets, metallic particles, or conductive paste. Actuation electrodes (18, 8) are placed parallel to the conductive sides of the elastomer. A voltage applied between the conductive side of the elastomer and the respective actuation electrodes (18, 8) generate the electrostatic attractive force that compresses the elastomer (1), creating the transverse displacement that closes the MEMS. The elastomeric based MEMS extends the lifetime of the switch by extending fatigue life of the deformable switch elements.

    MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND RELATED ACTUATOR BUMPS, METHOD OF MANUFACTURE AND DESIGN STRUCTURES
    4.
    发明申请
    MICRO-ELECTRO-MECHANICAL SYSTEM (MEMS) AND RELATED ACTUATOR BUMPS, METHOD OF MANUFACTURE AND DESIGN STRUCTURES 审中-公开
    微电子机械系统（MEMS）及相关执行机构的制造，制造和设计结构的方法

    公开(公告)号：WO2012177304A3

    公开(公告)日：2014-03-13

    申请号：PCT/US2012029005

    申请日：2012-03-14

    Applicant: IBM ,  JAHNES CHRISTOPHER V ,  STAMPER ANTHONY K

    Inventor： JAHNES CHRISTOPHER V ,  STAMPER ANTHONY K

    IPC: B81B3/00

    CPC classification number: H01H59/0009 ,  B81B3/001 ,  B81B7/0006 ,  B81B2201/016 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C1/0015 ,  B81C1/00293 ,  B81C2203/0145 ,  G06F17/5045 ,  G06F17/5068 ,  H01H1/0036 ,  H01H2001/0057 ,  Y10T29/49121

    Abstract: Micro-Electro-Mechanical System (MEMS) structures, methods of manufacture and design structures are provided. The method of forming a MEMS structure includes forming fixed actuator electrodes (115) and a contact point on a substrate. The method further includes forming a MEMS beam (100) over the fixed actuator electrodes and the contact point. The method further includes forming an array of actuator electrodes (105') in alignment with portions of the fixed actuator electrodes, which are sized and dimensioned to prevent the MEMS beam from collapsing on the fixed actuator electrodes after repeating cycling. The array of actuator electrodes are formed in direct contact with at least one of an underside of the MEMS beam and a surface of the fixed actuator electrodes.

    Abstract translation: 提供微机电系统（MEMS）结构，制造方法和设计结构。 形成MEMS结构的方法包括在基板上形成固定的致动器电极（115）和接触点。 该方法还包括在固定的致动器电极和接触点上形成MEMS光束（100）。 该方法还包括形成与固定致动器电极的部分对准的致动器电极阵列（105'），其尺寸和尺寸被设计成防止MEMS梁在重复循环之后塌陷在固定的致动器电极上。 致动器电极的阵列形成为与MEMS光束的下侧和固定的致动器电极的表面中的至少一个直接接触。

    MEMS-Strukturen mit planarem Hohlraum und verwandte Strukturen, Herstellungsverfahren und Design-Strukturen
    7.
    发明专利
    MEMS-Strukturen mit planarem Hohlraum und verwandte Strukturen, Herstellungsverfahren und Design-Strukturen 未知

    公开(公告)号：DE112011102134T5

    公开(公告)日：2013-04-04

    申请号：DE112011102134

    申请日：2011-06-08

    Applicant: IBM

    Inventor： HERRIN RUSSELL T ,  JAHNES CHRISTOPHER V ,  STAMPER ANTHONY K ,  WHITE ERIC J

    IPC: B81C1/00 ,  B81B3/00 ,  H01H59/00

    Abstract: Ein Verfahren zum Bilden mindestens eines Hohlraums (60b) eines mikroelektromechanischen Systems (MEMS) weist das Bilden einer ersten Hohlraum-Opferschicht (18) über einer Verdrahtungsschicht (14) und einem Substrat (10) auf. Das Verfahren weist ferner das Bilden einer Isolatorschicht (40) über der ersten Hohlraum-Opferschicht auf. Das Verfahren weist ferner das Durchführen eines reversen Damaszener-Rückätzverfahrens auf der Isolatorschicht auf. Das Verfahren weist ferner das Planarisieren der Isolatorschicht und der ersten Hohlraum-Opferschicht auf. Das Verfahren weist ferner das Austreiben oder Ablösen der ersten Hohlraum-Opferschicht zu einer planaren Fläche für einen ersten Hohlraum (60b) des MEMS auf.

    Durch Oberflächenladung aktivierte nanoporöse semipermeable Membran zur Entsalzung
    8.
    发明专利
    Durch Oberflächenladung aktivierte nanoporöse semipermeable Membran zur Entsalzung 未知

    公开(公告)号：DE112010004190T5

    公开(公告)日：2012-11-29

    申请号：DE112010004190

    申请日：2010-07-29

    Applicant: IBM

    Inventor： COTTE JOHN M ,  JAHNES CHRISTOPHER V ,  PEN HONGBO ,  ROSSNAGEL STEPHEN M

    IPC: G01R27/26 ,  G01N27/60

    Abstract: Ein Filter umfasst eine Membran, welche mehrere darin ausgebildete Nanokanäle (14) aufweist. Ein erstes Oberflächenladungsmaterial (18) ist auf einen Endabschnitt der Nanokanäle aufgebracht. Das erste Oberflächenladungsmaterial umfasst eine Oberflächenladung, um Ionen in einer elektrolytischen Lösung (20) derart elektrostatisch zu beeinflussen, dass die Nanokanäle Ionen in die elektrolytische Lösung zurückweisen, während ein Fluid der elektrolytischen Lösung durchgelassen wird. Es werden auch Verfahren zur Herstellung und Verwendung des Filters bereitgestellt.

    Planar cavity MEMS and related structures, methods of manufacture and design structures
    9.
    发明专利
    Planar cavity MEMS and related structures, methods of manufacture and design structures 未知

    公开(公告)号：GB2494359B

    公开(公告)日：2015-01-14

    申请号：GB201300085

    申请日：2011-06-08

    Applicant: IBM

    Inventor： HERRIN RUSSELL T ,  JAHNES CHRISTOPHER V ,  STAMPER ANTHONY K ,  WHITE ERIC J

    IPC: B81C1/00 ,  H01H57/00

    Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes patterning a wiring layer to form at least one fixed plate and forming a sacrificial material on the wiring layer. The method further includes forming an insulator layer of one or more films over the at least one fixed plate and exposed portions of an underlying substrate to prevent formation of a reaction product between the wiring layer and a sacrificial material. The method further includes forming at least one MEMS beam that is moveable over the at least one fixed plate. The method further includes venting or stripping of the sacrificial material to form at least a first cavity.

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