公开(公告)号：JP2004167671A

公开(公告)日：2004-06-17

申请号：JP2003348877

申请日：2003-10-07

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： KOCIS JOSEPH T ,  TORNELLO JAMES ,  PETRARCA KEVIN ,  VOLANT RICHARD ,  SUBANNA SESHADRI

IPC: B81C1/00 ,  B81B3/00 ,  H01H50/00

CPC classification number: B81C1/00666 ,  B81B2201/014 ,  B81C2201/0167 ,  H01F2007/068 ,  H01H50/005

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an encapsulated micro electro-mechanical system (MEMS) which causes little metallic fatigue and stress.
SOLUTION: The MEMS manufacturing method includes steps for forming a dielectric layer 204, patterning the upper surface of the first dielectric layer 204 to form a trench, forming a release material 212 in the trench, patterning the upper surface of the release material 212 to form the other trench, forming a first encapsulating layer 222 that includes sidewalls in the other trench, forming a core layer 242 in the first encapsulating layer 222, and forming a second encapsulating layer 262 above the core layer 242 where the second encapsulating layer 262 is connected to sidewalls of the first encapsulating layer 222.
COPYRIGHT: (C)2004,JPO

公开(公告)号：JP2004006310A

公开(公告)日：2004-01-08

申请号：JP2003109122

申请日：2003-04-14

Applicant: IBM

Inventor： VOLANT RICHARD P ,  ANGELL DAVID ,  CANAPERI DONALD F ,  KOCIS JOSEPH T ,  PETRARCA KEVIN S ,  STEIN KENNETH JAY ,  WILLE WILLIAM C

IPC: B81B3/00 ,  B81C1/00 ,  H01H49/00 ,  H01H59/00

Abstract: PROBLEM TO BE SOLVED: To provide a structure and a manufacturing method of a microelectric mechanical switch (MEMS) device provided with a self-alignment spacer or a bump. SOLUTION: The spacers arranged having the optimum size so as to make to the minimum a problem caused by stiction by functioning as restricting mechanism concerning the switch are designed. The spacers are manufactured by using the typically standard semi-conductor technology used for manufacturing a CMOS device. This method to manufacture these spacers does not need an additional deposition, excessive lithography process, and an additional etching. COPYRIGHT: (C)2004,JPO