Abstract:
A system for determining an amount of radiation includes a dosimeter configured to receive the amount of radiation, the dosimeter comprising a circuit having a resonant frequency, such that the resonant frequency of the circuit changes according to the amount of radiation received by the dosimeter, the dosimeter further configured to absorb RF energy at the resonant frequency of the circuit; a radio frequency (RF) transmitter configured to transmit the RF energy at the resonant frequency to the dosimeter; and a receiver configured to determine the resonant frequency of the dosimeter based on the absorbed RF energy, wherein the amount of radiation is determined based on the resonant frequency.
Abstract:
PROBLEM TO BE SOLVED: To simply integrate a high-speed and high-response photo detector in a monolithic form, by the method wherein a quantum well layer functions as a conductive channel so that a spacer layer separates a dopant in a supply layer from the conductive channel. SOLUTION: It comprises a single crystal semiconductor substrate 1, Si1-x Gex buffer layer 2 graded from x=0 to y ranging from 0.1 to 1.0, relaxing Si1-x Gex layer 3 of 0.25-10 μm thick, quantum well layer 4, undoped Si1-y Gey spacer layer 5 and doped Si1-y Gey supply layer 6. The relaxing Si1-x Gex layer 3 functions as an absorption region of a photo detector, the quantum well layer 4 can function as a conductive channel of a field effect transistor and the spacer layer 5 functions so as to separate a dopant in the supply layer from the conductive channel. Thus it is possible to manufacture a photo detector having an elevated speed and response, compared with a bulk Si.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for radiation monitoring that obtains real time information concerning the amount of radiation. SOLUTION: A semiconductor device includes: a semiconductor substrate; a buried insulator layer disposed on the semiconductor substrate, the buried insulator layer configured to retain an amount of charge in a plurality of charge traps in response to a radiation exposure by the semiconductor device; a semiconductor layer disposed on the buried insulating layer; a second insulator layer disposed on the semiconductor layer; a gate conducting layer disposed on the second insulator layer; and one or more side contacts electrically connected to the semiconductor layer. The method for radiation monitoring includes: applying a backgate voltage to a radiation monitor, the radiation monitor comprising a field effect transistor (FET); exposing the radiation monitor to radiation; determining a change in a threshold voltage of the radiation monitor; and determining an amount of radiation exposure based on the change in threshold voltage. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor structure including a gate electrode having a work function variable in the lateral direction. SOLUTION: The semiconductor structure, such as a CMOS structure, includes the gate electrode having the work function variable in the lateral direction. The gate electrode having the work function variable in the lateral direction can be formed using angle inclined ion implantation or a sequent lamination layer method. The gate electrode having the work function variable in the lateral direction brings improved electrical performance to a field-effect transistor device with a non-doped channel. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor structure including a gate electrode having a laterally variable work function.SOLUTION: A semiconductor structure, such as a CMOS structure, includes a gate electrode that has a laterally variable work function. The gate electrode that has the laterally variable work function may be formed using an angled ion implantation method or a sequential layering method. The gate electrode that has the laterally variable work function provides enhanced electrical performance within an undoped channel field effect transistor device.
Abstract:
PROBLEM TO BE SOLVED: To provide a method and a structure, capable of obtaining a germanium system semiconductor device, such as FET and MOS capacitor. SOLUTION: More specifically, the method for forming the semiconductor device, containing a stack consisting of a dielectric layer and a conductive material on the surface being an upper section or an internal section of a germanium contained material in which a non-oxygen chalcogen is rich (layer or wafer) or both of them is provided. The density of an interface trap is decreased, because undesirable formations of interface compounds at the time of growing the dielectric and thereafter is suppressed, by providing interfaces in which the non-oxygen chalcogen is rich. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor structure including a gate electrode having a laterally variable work function.SOLUTION: A semiconductor structure, such as a CMOS structure, includes a gate electrode that has a laterally variable work function. The gate electrode that has the laterally variable work function may be formed using an angled ion implantation method or a sequential layering method. The gate electrode that has the laterally variable work function provides enhanced electrical performance for an undoped channel field effect transistor device.
Abstract:
PROBLEM TO BE SOLVED: To make applicable the structure of an epitaxial field effect transistor to the intended uses of high-speed low-noise microwave and quasi-millimetric- wave devices, etc., by integrating into the epitaxial field effect transistor a silicon layer, a germanium layer, and silicon-germanium layers which form jointly a modulatorily doped heterostructure. SOLUTION: After forming on a single-crystal semiconductor substrate 11 a buffer layer 12 including a layer 12A, a layer 12B, and a layer 12C, a p-type doped relaxation silicon-germanium layer 13 is formed on the layer 12C of the buffer layer 12. Then, thereon, as a spacer, a non-doped strained silicon layer 14 is grown epitaxially to grow further on the layer 14 epitaxially a non-doped thin relaxation silicon-germanium layer 15. Subsequently, on the layer 15, there are grown epitaxially in succession a germanium layer 16, a silicon-germanium layer 17, and a silicon-germanium cap layer 18 to form the laminated layer of them.
Abstract:
Verfahren zum Herstellen eines Heteroübergang-Tunnel-Feldeffekttransistors (100), wobei das Verfahren aufweist: Bilden eines Gate-Bereichs (145) auf einer Siliciumschicht (115) eines Silicium-auf-Isolator-Substrats (105, 110); Bilden eines Drain-Bereichs (120) auf der Siliciumschicht (115), benachbart zu dem Gate-Bereich (145); und Bilden eines Source-Bereichs (125) mit vertikalem Heteroübergang (126) benachbart zu dem Gate-Bereich (145), wobei der Source-Bereich (125) mit vertikalem Heteroübergang (126) einen Tunnelweg (140) parallel zu einem Gate-Feld, das mit dem Gate-Bereich (145) verbunden ist, erzeugt.
Abstract:
Beispielhafte Ausführungsformen schließen ein Verfahren zum Herstellen eines Heteroübergang-Tunnel-Feldeffekttransistors (FET) ein, wobei das Verfahren das Bilden eines Gate-Bereichs auf einer Siliciumschicht eines Silicium-auf-Isolator(SOI)-Substrats, Bilden eines Drain-Bereichs auf der Siliciumschicht benachbart zu dem Gate-Bereich und Bilden eines Source-Bereichs mit vertikalem Heteroübergang benachbart zu dem Gate-Bereich aufweist, wobei der Source-Bereich mit vertikalem Heteroübergang einen Tunnelweg parallel zu einem Gate-Feld, das mit dem Gate-Bereich verbunden ist, erzeugt.