Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor structure including at least one e-fuse, and a manufacturing method which is easily integrated with standard semiconductor technologies, thus minimizing implementation costs. SOLUTION: A semiconductor structure includes at least one e-fuse embedded in a trench that is located in a semiconductor substrate (a bulk or semiconductor-on-insulator substrate). According to the present invention, the e-fuse is in electrical contact with a dopant region that is located in the semiconductor substrate. The present invention also provides a method of manufacturing the semiconductor structure in which the embedded e-fuse and trench isolation regions are formed almost at the same time. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a leak monitor element and a method improved for a DRAM. SOLUTION: A refresh-cycle time is directly adjusted based on a cell leakage state. In a method for designing a low power leakage monitor element, a memory cell being the same as a cell in an actual array is used. This monitor cell is designed so as to indicate an average cell or the worst state of cell leakage state. When leakage is severe, a refresh-cycle time is shortened greatly, for example, to a half. When a leakage level is very low or is undetectable, a refresh-cycle time is increased by a large amount for example, to twice. When leakage is normal or within a normal range, a refresh-cycle time is optimized, and power consumption used for DRAM refreshing is minimized.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a FinFET having a short fin having a uniform width. SOLUTION: There are provided a fin with a comparatively uniform width in a fin-type field effect transistor (FinFET) 100 and a device and a method for forming the same. A fin structure 110 can be formed so that the surface of a sidewall part of the fin structure is vertical with respect to a first crystal direction. A tapered region at the end portion of the fin structure can be vertical with respect to a second crystal direction. The fin structure can be subjected to a crystal-dependent etching. For a crystal-dependent etching, a material can be removed relatively quickly from the part of the fin vertical to the second crystal direction, and due to this, a fin structure with a comparatively uniform width can be brought about. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
AN ACTIVE FET BODY DEVICE WHICH COMPRISES AN ACTIVE FET REGION INCLUDING A GATE (13, 15, 16,24,26,28,30,3 I), A BODY REGION (4) AND ELECTRICAL CONNECTION BETWEEN SAID GATE AND SAID BODY REGION THAT IS LOCATED WITHIN THE ACTIVE FET REGION IS PROVIDED ALONG WITH VARIOUS METHODS FOR FABRICATING THE DEVICES. THE ELECTRICAL CONNECTION EXTENDS OVER SUBSTANTIALLY THE ENTIRE WIDTH OF THE FET. (FIGURE 6)