Abstract:
PROBLEM TO BE SOLVED: To provide a micro electronic component structure and a method for manufacturing it. SOLUTION: The micro electronic component structure and its manufacturing method includes a resistor formed on a substrate. A conductive connection layer is connected to the resistor. The maximum length of the conductive connection layer is so decided as to prevent occurrence of electromigration of a conductive material constituting the conductive connection layer by using a Blech constant. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
Damage to interconnect structures including vias and/or device interconnects through insulators having a low modulus of elasticity between materials having different coefficients of thermal expansion (CTEs) by providing bends or jogs in an interconnect which limit the axial length of the interconnect adjacent the via or device contact in accordance with the difference in CTEs. The interconnect thus limits the development of shear forces and serves to relieve them by flexure of the interconnect across portions of the narrow width of the interconnect; preventing concentration of shear forces near the via or device contact. Implementation as a design rule based on limitation of length of a straight segment of an interconnect trace is preferred.
Abstract:
A method and structure for fabricating a laser fuse and a method for programming the laser fuse. The laser fuse includes a first dielectric layer having two vias filled with a first self-passivated electrically conducting material. A fuse link is on top of the first dielectric layer. The fuse link electrically connects the two vias and includes a second material having a characteristic of changing its electrical resistance after being exposed to a laser beam. Two mesas are over the fuse link and directly over the two vias. The two mesas each include a third self-passivated electrically conducting material. The laser fuse is programmed by directing a laser beam to the fuse link. The laser beam is controlled such that, in response to the impact of the laser beam upon the fuse link, the electrical resistance of the fuse link changes but the fuse link is not blown off. Such electrical resistance change is sensed and converted to digital signal.