中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

6 records (took 0.017 seconds)

    2.
    发明专利
    未知

    公开(公告)号：ES2135507T3

    公开(公告)日：1999-11-01

    申请号：ES94108520

    申请日：1994-06-03

    Applicant: IBM

    Inventor： BERTIN CLAUDE LOUIS ,  FARRAR SR PAUL ALDEN ,  HOWELL WAYNE JOHN ,  MILLER CHRISTOPHER PAUL ,  PERLMAN DAVID JACOB

    IPC: H01L25/00 ,  H01L21/98 ,  H01L23/52 ,  H01L25/065

    Abstract: A cube package of stacked silicon semiconductor chips. To accommodate cube packaging, a metal transfer layer is added over the passivated chip face (16) to bring all of the surface electrical contacts to a common chip edge. The metal transfer layer (9) is insulated from the chip face and from the adjacent chip in the stack by polymer layers (16) having a low dielectric constant, and a thermal expansion coefficient matching that of the stacked chips. An adhesive polymer layer is added to strengthen the bond between the first polymer layers and the adjacent chip in the stack, by deposition of the adhesive layer and partial cure at the wafer level, and then full cure when the chips are stacked together to form the cube.

    3.
    发明专利
    未知

    公开(公告)号：DE69420201T2

    公开(公告)日：2000-03-23

    申请号：DE69420201

    申请日：1994-06-03

    Applicant: IBM

    Inventor： BERTIN CLAUDE LOUIS ,  FARRAR SR ,  HOWELL WAYNE JOHN ,  MILLER CHRISTOPHER PAUL ,  PERLMAN DAVID JACOB

    IPC: H01L25/00 ,  H01L21/98 ,  H01L23/52 ,  H01L25/065

    Abstract: A cube package of stacked silicon semiconductor chips. To accommodate cube packaging, a metal transfer layer is added over the passivated chip face (16) to bring all of the surface electrical contacts to a common chip edge. The metal transfer layer (9) is insulated from the chip face and from the adjacent chip in the stack by polymer layers (16) having a low dielectric constant, and a thermal expansion coefficient matching that of the stacked chips. An adhesive polymer layer is added to strengthen the bond between the first polymer layers and the adjacent chip in the stack, by deposition of the adhesive layer and partial cure at the wafer level, and then full cure when the chips are stacked together to form the cube.

    4.
    发明专利
    未知

    公开(公告)号：DE69420201D1

    公开(公告)日：1999-09-30

    申请号：DE69420201

    申请日：1994-06-03

    Applicant: IBM

    Inventor： BERTIN CLAUDE LOUIS ,  FARRAR SR ,  HOWELL WAYNE JOHN ,  MILLER CHRISTOPHER PAUL ,  PERLMAN DAVID JACOB

    IPC: H01L25/00 ,  H01L21/98 ,  H01L23/52 ,  H01L25/065

    Abstract: A cube package of stacked silicon semiconductor chips. To accommodate cube packaging, a metal transfer layer is added over the passivated chip face (16) to bring all of the surface electrical contacts to a common chip edge. The metal transfer layer (9) is insulated from the chip face and from the adjacent chip in the stack by polymer layers (16) having a low dielectric constant, and a thermal expansion coefficient matching that of the stacked chips. An adhesive polymer layer is added to strengthen the bond between the first polymer layers and the adjacent chip in the stack, by deposition of the adhesive layer and partial cure at the wafer level, and then full cure when the chips are stacked together to form the cube.

    5.
    发明专利
    未知

    公开(公告)号：AT183851T

    公开(公告)日：1999-09-15

    申请号：AT94108520

    申请日：1994-06-03

    Applicant: IBM

    Inventor： BERTIN CLAUDE LOUIS ,  FARRAR SR PAUL ALDEN ,  HOWELL WAYNE JOHN ,  MILLER CHRISTOPHER PAUL ,  PERLMAN DAVID JACOB

    IPC: H01L25/00 ,  H01L21/98 ,  H01L23/52 ,  H01L25/065

    Abstract: A cube package of stacked silicon semiconductor chips. To accommodate cube packaging, a metal transfer layer is added over the passivated chip face (16) to bring all of the surface electrical contacts to a common chip edge. The metal transfer layer (9) is insulated from the chip face and from the adjacent chip in the stack by polymer layers (16) having a low dielectric constant, and a thermal expansion coefficient matching that of the stacked chips. An adhesive polymer layer is added to strengthen the bond between the first polymer layers and the adjacent chip in the stack, by deposition of the adhesive layer and partial cure at the wafer level, and then full cure when the chips are stacked together to form the cube.

Patent Agency Ranking