公开(公告)号：DE3888608T2

公开(公告)日：1994-10-27

申请号：DE3888608

申请日：1988-08-23

Applicant: IBM

Inventor： BUCHWALTER STEPHEN LESLIE ,  KOVAC CAROLINE ANN ,  NGUYEN LUU THANH

IPC: C08G59/62 ,  C08G59/24 ,  C08G59/40 ,  C08G59/42 ,  C08G59/68 ,  C09K3/10 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31

公开(公告)号：DE69016113D1

公开(公告)日：1995-03-02

申请号：DE69016113

申请日：1990-04-10

Applicant: IBM

Inventor： NMN CHENG SHIRLEY ,  ARAPS CONSTANCE JOAN ,  ARNOLD ALLEN JOSEPH ,  COFFIN JEFFREY THOMAS ,  NGUYEN LUU THANH

IPC: C11D7/50 ,  C23F11/12 ,  C23F11/14 ,  C23F15/00 ,  H01L21/304 ,  H01L21/306 ,  H05K3/26

公开(公告)号：DE69016113T2

公开(公告)日：1995-06-29

申请号：DE69016113

申请日：1990-04-10

Applicant: IBM

Inventor： NMN CHENG SHIRLEY ,  ARAPS CONSTANCE JOAN ,  ARNOLD ALLEN JOSEPH ,  COFFIN JEFFREY THOMAS ,  NGUYEN LUU THANH

IPC: C11D7/50 ,  C23F11/12 ,  C23F11/14 ,  C23F15/00 ,  H01L21/304 ,  H01L21/306 ,  H05K3/26

公开(公告)号：DE3888608D1

公开(公告)日：1994-04-28

申请号：DE3888608

申请日：1988-08-23

Applicant: IBM

Inventor： BUCHWALTER STEPHEN LESLIE ,  KOVAC CAROLINE ANN ,  NGUYEN LUU THANH

IPC: C08G59/62 ,  C08G59/24 ,  C08G59/40 ,  C08G59/42 ,  C08G59/68 ,  C09K3/10 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31

公开(公告)号：DE68901573D1

公开(公告)日：1992-06-25

申请号：DE68901573

申请日：1989-03-16

Applicant: IBM

Inventor： LEDERMANN PETER GERARD ,  NGUYEN LUU THANH

IPC: B23K3/06 ,  H05K3/34

Abstract: A tool employing a solder foot (20) to deposit solder on a series of conductive surfaces (21, 22) as the tool moves. In one embodiment, non-wettable blade (18) attached to the tool breaks the film. A pair of sensors (15) coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an omnidirectional tool for deposition.