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公开(公告)号：GB1261108A
公开(公告)日：1972-01-19
申请号：GB1345569
申请日：1969-03-14
Applicant: IBM
Inventor： GIEDD GARY ROBERT , PERKINS MERLYN HAROLD
Abstract: 1,261,108. Controlling continuous furnaces. INTERNATIONAL BUSINESS MACHINES CORP. 14 March, 1969 [15 March, 1968], No. 13455/69. Heading F4B. [Also in Divisions B6, G2-G3 and H1] An automated apparatus, Fig. 1, for fabricating multi-layer ceramic modules is controlled by a process computer 2 through an output line 20. Wire mesh masks are coated with a photo-sensitized epoxy material in a screen preparation unit 16 and fed to a printed circuit exposure inspection tool 14 wherein the coated screen is exposed in a pattern determined by the computer. The exposed screen is then inspected and fed to a developing unit 18 after which it is inspected in tool 14 and passed to a printing unit 8. The developed screen is positioned on a ceramic green sheet, from a punch unit 6, and a conductive printed pattern deposited by a silk-screen printing process. After a further inspection in the tool 14 the modules are stacked in a unit 10 and fired in a heating unit 12 from which they are delivered as multi-layer ceramic modules. Heating unit, Fig. 8. A plurality of stacked modules are transferred, by belts 148, (1) through an entrance gate 152 into a first oven zone 153 which is preconditioned by heating coils 154 to provide a desired temperature profile, (2) through a gate 155 to a constant temperature firing zone 15, (3) through a gate 157 to a cooling zone 158 and finally exited at a gate 160. The heating coils 154 of the zones are controlled in response to thermocouples 159 and the operating conditions monitored by the computer.
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Patent Agency Ranking
公开(公告)号：DE1157300B
公开(公告)日：1963-11-14
申请号：DEJ0020492
申请日：1961-09-04
Applicant: IBM
Inventor： PERKINS MERLYN HAROLD , GIEDD GARY ROBERT , BEHRNDT MARIANNE E
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公开(公告)号：DE3878751T2
公开(公告)日：1993-09-23
申请号：DE3878751
申请日：1988-05-03
Applicant: IBM
IPC: G03F7/20 , H01J37/304 , H01J37/317 , H01L21/027 , H01L21/30 , H01J37/302 , H01J37/30
Abstract: This system employs writing of lithographic patterns with a shaped electron beam exposure system (10) which minimizes the time wasted by workpiece positional requirements. The writing field contains an array of sub-fields written in a raster sequence. The large width of the writing field (37) provided by the VAIL system reduces the number of mechanical scans required to write the pattern on the workpiece which further reduces the time required for workpiece positioning. When patterns are being superimposed over previously written patterns, registration is employed. This system includes a registration field (36) confined to local areas on the workpiece (7), which is larger than the writing field, without requiring change in focus and without requiring the mechanical system comprising the X-Y work table to change speed during the registration and reregistration of the various fields on a semiconductor wafer or mask. The registration field can be larger than the writing field, because the quality requirements demanded from the shaped electron beam(B) are less for detecting the locations of such registration (39) marks at the various locations on the wafer.
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公开(公告)号：DE3878751D1
公开(公告)日：1993-04-08
申请号：DE3878751
申请日：1988-05-03
Applicant: IBM
IPC: G03F7/20 , H01J37/304 , H01J37/317 , H01L21/027 , H01L21/30 , H01J37/302 , H01J37/30
Abstract: This system employs writing of lithographic patterns with a shaped electron beam exposure system (10) which minimizes the time wasted by workpiece positional requirements. The writing field contains an array of sub-fields written in a raster sequence. The large width of the writing field (37) provided by the VAIL system reduces the number of mechanical scans required to write the pattern on the workpiece which further reduces the time required for workpiece positioning. When patterns are being superimposed over previously written patterns, registration is employed. This system includes a registration field (36) confined to local areas on the workpiece (7), which is larger than the writing field, without requiring change in focus and without requiring the mechanical system comprising the X-Y work table to change speed during the registration and reregistration of the various fields on a semiconductor wafer or mask. The registration field can be larger than the writing field, because the quality requirements demanded from the shaped electron beam(B) are less for detecting the locations of such registration (39) marks at the various locations on the wafer.
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公开(公告)号：DE1640577B1
公开(公告)日：1970-06-18
申请号：DE1640577
申请日：1967-12-27
Applicant: IBM
Inventor： KURTZ FRANK JOSEPH , LOGUE JOSEPH CARL , GIEDD GARY ROBERT , PERKINS MERLYN HAROLD
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公开(公告)号：GB982324A
公开(公告)日：1965-02-03
申请号：GB2536061
申请日：1961-07-13
Applicant: IBM
Inventor： BEHRNDT MARIANNE E , GIEDD CARY ROBERT , WEED DONALD STRIPPLE , PERKINS MERLYN HAROLD
Abstract: A superconductor is formed by vapour depositing a film 1000-10.000 Angstroms thick of Sn, Pb, Ta or In on a heated substrate such as glass, mica or a plastic. The substrate is heated to 70-150 DEG C. so that the deposit will agglomerate and become discontinuous at the sloping edges of the layer. In a further embodiment a monatomic layer of Ag, Au or Pt is first vapour deposited on the substrate which is then heated prior to the deposition of the superconducting layer. As shown in Fig. 1, an evacuated vessel 2 at a pressure of 5 X 10-7 to 5 X 10-6 mm/s. Hg. contains a heated substrate 17 and a boat 9 containing the source material to be evaporated through mask 12. A shutter 14 prevents the material being deposited on the substrate until the required temperature is reached. The substrate is maintained at the correct temperature by a tungsten filament and a controller.
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