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公开(公告)号：GB2346716A
公开(公告)日：2000-08-16
申请号：GB9925758
申请日：1999-11-01
Applicant: IBM
Inventor： HUANG YUN-WU , JOHNSON ROBERT D , POLLAK ROGER A , PONZO JOHN J
IPC: G06F1/00 , G06F9/445 , G06F17/40 , G06F13/00 , G06F21/00 , G06F21/22 , H04L29/06 , H04L29/08 , H04M1/725 , G06F15/177
Abstract: A system for selectively distributing applications and databases from a server computer to at least one client, such as at least one of a plurality of intermittently connected handheld devices. Applications and databases to be downloaded and deleted are selected from an application list 503 maintained by handheld devices. After connection with the server computer, the application list of selected applications is copied to the server computer which maintains an access control list indicating which applications can be downloaded to which handheld devices. The server computer examines the application list and the access control list to determine which applications are both selected and authorized for use by the handheld device. After determining that requested applications are authorized for requesting devices, these applications are downloaded. If the connected handheld device does not have the application list, the application list is created for it and downloaded.
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公开(公告)号：DE69118442D1
公开(公告)日：1996-05-09
申请号：DE69118442
申请日：1991-05-15
Applicant: IBM
Inventor： GOLDBERG MARTIN J , ITO HIROSHI , KOVAC CAROLINE A , PALMER MICHAEL J , POLLAK ROGER A , POORE PAIGE A
Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.
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公开(公告)号：GB2346716B
公开(公告)日：2003-07-09
申请号：GB9925758
申请日：1999-11-01
Applicant: IBM
Inventor： HUANG YUN-WU , JOHNSON ROBERT D , POLLAK ROGER A , PONZO JOHN J
IPC: G06F1/00 , G06F9/445 , G06F17/40 , G06F13/00 , G06F21/00 , G06F21/22 , H04L29/06 , H04L29/08 , H04M1/725 , G06F15/177
Abstract: The present invention is a novel management system for selectively distributing applications and databases from a server computer to a plurality of intermittently connected handheld devices. The applications and databases to be downloaded and deleted are first selected from an application list maintained by handheld devices. After established a connection with the server computer, the application list of selected applications is copied to the server computer which maintains an access control list indicating which applications are permitted to be downloaded to which handheld devices. The server computer examines the application list and the access control list to determine which applications are both selected and are authorized for use by the handheld device. After determining that requested applications are authorized for requesting devices, these applications are downloaded. If the connected handheld device does not have that the application list, the application list is created for it and downloaded.
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公开(公告)号：DE69118442T2
公开(公告)日：1996-10-10
申请号：DE69118442
申请日：1991-05-15
Applicant: IBM
Inventor： GOLDBERG MARTIN J , ITO HIROSHI , KOVAC CAROLINE A , PALMER MICHAEL J , POLLAK ROGER A , POORE PAIGE A
Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.
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