公开(公告)号：DE69118442D1

公开(公告)日：1996-05-09

申请号：DE69118442

申请日：1991-05-15

Applicant: IBM

Inventor： GOLDBERG MARTIN J ,  ITO HIROSHI ,  KOVAC CAROLINE A ,  PALMER MICHAEL J ,  POLLAK ROGER A ,  POORE PAIGE A

IPC: B23K1/00 ,  B23K35/22 ,  B23K35/34 ,  B23K101/40 ,  H05K3/10 ,  H05K3/34

Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.

公开(公告)号：DE69118442T2

公开(公告)日：1996-10-10

申请号：DE69118442

申请日：1991-05-15

Applicant: IBM

Inventor： GOLDBERG MARTIN J ,  ITO HIROSHI ,  KOVAC CAROLINE A ,  PALMER MICHAEL J ,  POLLAK ROGER A ,  POORE PAIGE A

IPC: B23K1/00 ,  B23K35/22 ,  B23K35/34 ,  B23K101/40 ,  H05K3/10 ,  H05K3/34

Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.