公开(公告)号：MY117703A

公开(公告)日：2004-07-31

申请号：MYPI20010672

申请日：2001-02-14

Applicant: IBM

Inventor： ELLIS-MONAGHAN JOHN J ,  FEENEY PAUL M ,  GEFFKEN ROBERT M ,  LANDIS HOWARD S ,  PREVITI-KELLY ROSEMARY A ,  REUTER BETTE BERGMAN L ,  RUTTEN MATTHEW J ,  STAMPER ANTHONY K ,  YANKEE SALLY J

IPC: H01L23/52 ,  H01L23/58 ,  H01L21/3205 ,  H01L21/60 ,  H01L21/768 ,  H01L23/31 ,  H01L23/485 ,  H01L23/532

Abstract: A METHOD AND STRUCTURE FOR A SEMICONDUCTOR CHIP INCLUDES A PLURALITY OF LAYERS OF INTERCONNECT METALLURGY, AT LEAST ONE LAYER OF DEFORMABLE DIELECTRIC MATERIAL OVER THE INTERCONNECT METALLURGY, AT LEAST ONE INPUT/OUTPUT BONDING PAD, AND A SUPPORT STRUCTURE THAT INCLUDES A SUBSTANTIALLY RIGID DIELECTRIC IN A SUPPORTING RELATIONSHIP TO THE PAD THAT AVOIDS CRUSHING THE DEFORMABLE DIELECTRIC MATERIAL.