公开(公告)号：JPH0613495A

公开(公告)日：1994-01-21

申请号：JP25563591

申请日：1991-10-03

Applicant: IBM

Inventor： RORENSU MAAKU BURAUN ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  CHIYAARUZU ROBAATO DEIBISU ,  RIISA JIYANIIN HIMAARESU ,  ASHITO AABINDO MEETA ,  YUUJIIN ROOMAN SUKARUBINKO

IPC: C08L27/12 ,  C08L79/08 ,  H01L23/08 ,  H01L23/14 ,  H05K1/03 ,  H05K3/00

Abstract: PURPOSE: To provide perfluoro carbon composition of a polymer having thermal stability at the temperature at the laser processing and printed-circuit-board manufacturing at 308 nanometers. CONSTITUTION: This polymer composition has a main amount of perfluoro carbon composition, which is substantially transparent to ultraviolet rays, and a second polymer such as polyimide, which is thermally stable for imparting ultraviolet-ray processing. This is the manufacturing method for providing a forming method of the polymer composition, a through-hole for the polymer composition and the printed circuit board, including the laser removal of a via.

公开(公告)号：JPH02259762A

公开(公告)日：1990-10-22

申请号：JP30943489

申请日：1989-11-30

Applicant: IBM

Inventor： RORENSU MAAKU BURAUN ,  JIEFURII DONARUDO JIEROOMU ,  JIYOZEFU POORU KUTSUINSUKII ,  UIRIAMU HAUERU RORENSU

IPC: C08F2/50 ,  C08G59/00 ,  C08G59/18 ,  G03F7/038 ,  G03F7/20 ,  H05K3/00 ,  H05K3/28

Abstract: PURPOSE: To enable free radical polymn. without using an oxygen barrier sheet and to enhance the resolution of an image by using a specified photoresist. CONSTITUTION: A curable cationic photoresist is formed on a substrate and imagewisely exposed with laser beams from Ar ion laser, etc., the exposed part of the photoresist is cured by cationic polymn. and the photoresist is patterned by development. The photoresist preferably contains about 69-79wt.% octafunctional bisphenol A epoxy novolak (e.g. a compd. represented by formula I), about 15-17wt.% bifunctional alicyclic epoxy (e.g. a compd. represented by formula II), about 4-6wt.% trifunctional epoxy (e.g. a compd. represented by formula III), about 2.9-6.9wt.% photosensitizer (e.g. a compd. represented by formula IV) and 0 to about 0.15wt.% surfactant (e.g. a desired fluorine-contg. surfactant).