公开(公告)号：JP2003109918A

公开(公告)日：2003-04-11

申请号：JP2001300046

申请日：2001-09-28

Applicant: IBM

Inventor： CANAPERI DONALD F ,  COHEN GUY ,  RYAN HAN ,  OTT JOHN A ,  LOFARO MICHAEL ,  CHU JACK O

IPC: B24B37/00 ,  C08J5/14 ,  C09K3/14 ,  H01L21/304

Abstract: PROBLEM TO BE SOLVED: To provide a method and device by which a semiconductor substrate, a CMP tool, a brush cleaning tool, and a chemical wafer cleaning tool can be incorporated. SOLUTION: CMP is performed with a descending force of 1 psi, backward air pressure of 0.5 psi, platen speed of 50 rpm, carrier speed of 30 rpm, and slurry flow rate of 140 milliliter.