公开(公告)号：EP1554915A4

公开(公告)日：2008-08-20

申请号：EP03726799

申请日：2003-05-13

Applicant: IBM

Inventor： HOUGHAM GARETH G ,  FOGEL KEITH E ,  LAURO PAUL A ,  ZINTER JOSEPH

IPC: H01R13/24 ,  H01R43/00 ,  H05K3/40 ,  H05K3/42 ,  H05K7/10

CPC classification number: H01R13/2414 ,  H01R12/7082 ,  H01R12/714 ,  H01R43/007 ,  H05K3/4007 ,  H05K3/42 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/0959 ,  H05K2201/10378 ,  Y10S439/931 ,  Y10T442/109 ,  Y10T442/172

Abstract: Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic.Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there isprovided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets,and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them intoconductive electrical contacts.

公开(公告)号：DE60329857D1

公开(公告)日：2009-12-10

申请号：DE60329857

申请日：2003-05-13

Applicant: IBM

Inventor： HOUGHAM GARETH G ,  FOGEL KEITH E ,  LAURO PAUL A ,  ZINTER JOSEPH

IPC: H05K1/00 ,  H01R13/24 ,  H01R43/00 ,  H05K3/40 ,  H05K3/42 ,  H05K7/10

Abstract: Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.

公开(公告)号：AT447248T

公开(公告)日：2009-11-15

申请号：AT03726799

申请日：2003-05-13

Applicant: IBM

Inventor： HOUGHAM GARETH G ,  FOGEL KEITH E ,  LAURO PAUL A ,  ZINTER JOSEPH

IPC: H01R13/24 ,  H01R43/00 ,  H05K3/40 ,  H05K3/42 ,  H05K7/10

Abstract: Methods for fabricating Land Grid Array (LGA) interposer contacts that are both conducting and elastic. Also provided are LGA interposer contacts as produced by the inventive methods. Provided is LGA type which utilizes a pure unfilled elastomer button core that is covered with an electrically-conductive material that is continuous from the top surface to the bottom surface of the button structure. In order to obviate the disadvantages and drawbacks which are presently encountered in the technology pertaining to the fabrication and structure of land grid arrays using electrically-conductive interposer contacts, there is provided both methods and structure for molding elastomer buttons into premetallized LGA carrier sheets, and wherein the non-conductive elastomer buttons are surface-metallized in order to convert them into conductive electrical contacts.