公开(公告)号：DE19515187C2

公开(公告)日：2003-07-10

申请号：DE19515187

申请日：1995-04-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ATZESDORFER ALEXANDRA ,  STAMPKA PETER ,  HOUDEAU DETLEF

IPC: H01L23/28 ,  H01L23/58 ,  H01L23/31 ,  H01L23/04 ,  G06K19/077 ,  H05K3/28 ,  B42D15/10

Abstract: The description relates to a chip cover (6, 11) to cover completely or partially electrical, electronic, opto-electronic and/or electromechanical components of a chip (1, 8). The chip cover (6, 11) is characterized in that a pigmenting agent is added to the cover material. It is thus possible reliably to prevent unauthorised analyses and/or manipulations of the chip (1, 8).

公开(公告)号：DE19515189C2

公开(公告)日：2003-07-10

申请号：DE19515189

申请日：1995-04-25

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ATZESDORFER ALEXANDRA ,  HOUDEAU DETLEF ,  BAYER HEINER ,  STAMPKA PETER

IPC: G06K19/073 ,  G06K19/077 ,  G07F7/10 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498 ,  H01L25/18 ,  H01L23/04 ,  B42D15/10

Abstract: The description relates to a chip cover (6) to cover completely or partially electrical, electronic, opto-electronic and/or electromechanical components of a chip (1, 8). The chip cover (6) is characterized in that is has a polyimide coating with limited transparency. It is thus possible reliably to prevent unauthorised examinations and/or manipulations of the chip.

公开(公告)号：DE10139986A1

公开(公告)日：2002-11-14

申请号：DE10139986

申请日：2001-08-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ATZESDORFER ALEXANDRA ,  ROEDIG HERBERT

IPC: H01L23/485 ,  H01L23/50

Abstract: Electronic component comprises a semiconductor chip (2) having an active front side with semiconductor structures and a passive rear side without semiconductor structures. The semiconductor structures are accessed via small microscopic conductor strips which lead to contact connection surfaces (4) on the active front side for contacting the semiconductor structures with bonding wires and/or for assembling in flip-chip technology. An Independent claim is also included for a process for the production of the electronic component.

公开(公告)号：DE102017122454A1

公开(公告)日：2019-01-17

申请号：DE102017122454

申请日：2017-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： PÜSCHNER FRANK ,  ATZESDORFER ALEXANDRA ,  KRAUS JULIA KATHARINA ,  POHL JENS ,  SPÖTTL THOMAS

IPC: H01L23/50 ,  H01L21/60 ,  H01L21/768

Abstract: In verschiedenen Ausführungsbeispielen wird eine Chipanordnung bereitgestellt, aufweisend einen Chipkörper (310), mindestens einen Chip-Anschlussbereich (320), mindestens eine Passivierungsschicht (330) teilweise neben dem Chip-Anschlussbereich (320), wobei die Passivierungsschicht (330) eine Öffnung (332) aufweist, mittels der zumindest ein Teil des Chip-Anschlussbereichs (320) freigelegt ist, ein Substrat (340) mit einem Substrat-Anschlussbereich (342), und eine elektromechanische Verbindungsstruktur (350), die im Inneren einen Hohlraum (352) aufweist. Mindestens eine Wand (354)der Verbindungsstruktur (350) ist auf der Passivierungsschicht (330) und auf dem Substrat-Anschlussbereich (342) angeordnet. Die elektromechanische Verbindungsstruktur (350) verbindet den Chip-Anschlussbereich (320) elektrisch leitend mit dem Substrat-Anschlussbereich (342). Der Hohlraum (352) weist eine Tiefe (d1) auf, die größer ist als eine Tiefe (d2) der Öffnung (332).

公开(公告)号：DE59813952D1

公开(公告)日：2007-05-03

申请号：DE59813952

申请日：1998-12-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ATZESDORFER ALEXANDRA ,  MUELLER RAINER ,  HECKMANN KLAUS ,  BAUER FRIEDERIKE

IPC: B05D3/10 ,  C23F11/16 ,  B32B15/08 ,  C09D5/00 ,  C09D201/00 ,  C23F11/14 ,  H01L23/31 ,  H05K3/28 ,  H05K3/38

Abstract: Adhesion promoters for polymer coatings on metals are articulated into at least two head groups connected by a hydrocarbon spacer group. One head group reacts particularly well with polymer molecules. Other head groups form a durable bond with a metal surface. The length of the spacer group is such that a substance deposited in a substance layer on a metallic surface of a body or particle has hydrophobic properties. Suitable adhesion promoters can be sulfur compounds, amino compounds, hydroxyl or carbonyl compounds. A plastic composite body, a compound and a process of preparing a compound are also provided.

公开(公告)号：DE10110999A1

公开(公告)日：2002-10-02

申请号：DE10110999

申请日：2001-03-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： ATZESDORFER ALEXANDRA ,  WOERNER HOLGER ,  BAUER MICHAEL ,  BIRZER CHRISTIAN

IPC: H01L21/56 ,  H01L23/31 ,  H05K3/28 ,  H05K3/32

Abstract: An electronic component (1) has top (3) and bottom (4) sides, side edges (5) encasing the component and external contacts (9) distributed on the bottom side. On its topside (10) a printed circuit board (2) has contact connection surfaces (12) joined to a strip conductor structure (11) and connected electrically and mechanically to the external contacts by forming an intermediate space (13). An Independent claim is also included for a method for producing a structure with an electronic component and printed circuit board.