公开(公告)号：DE102005001590B4

公开(公告)日：2007-08-16

申请号：DE102005001590

申请日：2005-01-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  BENDER CARSTEN ,  GRAFE JUERGEN ,  WENNEMUTH INGO ,  GOSPODINOVA MINKA ,  SAVIGNAC DOMINIQUE

IPC: H01L23/50 ,  H01L25/065

公开(公告)号：DE102005001590A1

公开(公告)日：2006-07-20

申请号：DE102005001590

申请日：2005-01-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  BENDER CARSTEN ,  GRAFE JUERGEN ,  WENNEMUTH INGO ,  GOSPODINOVA MINKA ,  SAVIGNAC DOMINIQUE

IPC: H01L23/50 ,  H01L25/065

Abstract: Package has a silicon chip, fixed with its active side to a substrate (12), including a core having copper wires (15.1, 15.2) on both sides. Build-up layers (16.1, 16.2) with copper wire (17.1, 17.2) are found on the copper wires (15.1, 15.2). Build-up layers are structured on ball side by pressure and back etching process, so that the copper wires (17.1, 17.2) on the substrate is directly accessible in canal for wire bonds.