公开(公告)号：WO2005022588A2

公开(公告)日：2005-03-10

申请号：PCT/DE2004001853

申请日：2004-08-19

Applicant: INFINEON TECHNOLOGIES AG ,  GOSPODINOVA-DALTCHEVA MINKA ,  HUEBERT HARRY ,  SUBRAYA RAJESH ,  THOMAS JOCHEN ,  WENNEMUTH INGO

Inventor： GOSPODINOVA-DALTCHEVA MINKA ,  HUEBERT HARRY ,  SUBRAYA RAJESH ,  THOMAS JOCHEN ,  WENNEMUTH INGO

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/49 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/065 ,  H01L

CPC classification number: H01L25/0657 ,  H01L23/13 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2223/6627 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/49 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01052 ,  H01L2924/01068 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/1903 ,  H01L2924/19043 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: The invention relates to a semiconductor component comprising a plastic housing (41), at least one semiconductor chip (1), and a rewiring layer (8). The rewiring layer (8) is provided with an insulating level (9) and a rewiring level (10). The rewiring level (10) encompasses alternately disposed parallel signal conductors (12) and ground or power supply conductors (13) or exclusively parallel signal conductors (12). In the latter case, a electrically conducting metallic layer that can be connected to ground potential or power supply potential is additionally provided to close the rewiring layer or in the form of a coating.

Abstract translation: 本发明涉及一种具有塑料外壳（41），至少一个半导体芯片（1）和重新布线层（8）的半导体器件。 再布线层（8）具有绝缘层（9）和再布线层（10）。 重新布线层（10）彼此平行并且交替地布置信号导体迹线（12）和接地或供电导体迹线（13）或者仅彼此平行布置的信号导体迹线（12）。 在后一种情况下，可以连接到接地或供电电位的导电金属层作为再布线层的终端或以覆盖层的形式额外提供。

公开(公告)号：DE102004038989A1

公开(公告)日：2005-12-29

申请号：DE102004038989

申请日：2004-08-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： GOSPODINOVA-DALTCHEVA MINKA ,  THOMAS JOCHEN ,  IRSIGLER ROLAND

IPC: H01L25/065 ,  H01L27/108

Abstract: The module has an inner semiconductor chip stack (2) that exhibits an upper semiconductor chip and a lower semiconductor chip (4). The lower semiconductor chip exhibits a back wiring structure on its back. The lower semiconductor chip is electrically connected with flip chip contacts of the upper semiconductor chip. The back wiring structure stands over bond connections with external contacts of wiring substrates that are connected. An independent claim is also included for a method for manufacturing a semiconductor module.

公开(公告)号：DE10339770A1

公开(公告)日：2005-03-31

申请号：DE10339770

申请日：2003-08-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  GRAFE JUERGEN ,  WENNEMUTH INGO ,  GOSPODINOVA-DALTCHEVA MINKA ,  KUZMENKA MAKSIM

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/50

Abstract: The FBGA (fine pitch ball grid array) connection device (5) is for face-down integrated circuit chips (6). It has balls of solder (14) acting as electrical contacts on the underside of the chip. The balls are in contact with through-connectors (13) under a copper layer (18) and the chip. The connectors extend through two substrate plates (1,2). A central bonding channel extends through holes in the substrate. It consists of a stepped diameter cast mass of insulating material (16) containing bridging wires (10). The chip is encapsulated in a molding compound (17).

公开(公告)号：DE10339770B4

公开(公告)日：2007-08-30

申请号：DE10339770

申请日：2003-08-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  GRAFE JUERGEN ,  WENNEMUTH INGO ,  GOSPODINOVA-DALTCHEVA MINKA ,  KUZMENKA MAKSIM

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/31 ,  H01L23/498

公开(公告)号：DE10339762B4

公开(公告)日：2007-08-02

申请号：DE10339762

申请日：2003-08-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  SUBRAYA RAJESH ,  GOSPODINOVA-DALTCHEVA MINKA ,  WENNEMUTH INGO ,  HUEBERT HARRY

IPC: H01L23/50 ,  H01L21/60 ,  H01L23/13 ,  H01L23/31 ,  H01L23/49 ,  H01L23/498 ,  H01L23/552 ,  H01L23/66 ,  H01L25/065

公开(公告)号：DE10339762A1

公开(公告)日：2005-03-31

申请号：DE10339762

申请日：2003-08-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： THOMAS JOCHEN ,  SUBRAYA RAJESH ,  GOSPODINOVA-DALTCHEVA MINKA ,  WENNEMUTH INGO ,  HUEBERT HARRY

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/49 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/065 ,  H01L21/60