公开(公告)号：DE10329143A1

公开(公告)日：2005-01-20

申请号：DE10329143

申请日：2003-06-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KERLER RUDOLF ,  EURSKENS WOLFRAM ,  PAPE HEINZ ,  STROBEL PETER ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/10 ,  H05K3/46 ,  H05K7/02 ,  B23K26/00

Abstract: Electronic module (25) has a number of components (1-6) mounted on a wiring block (9). The wiring block has a number of outer sides (11-14) and contains internal connection leads (15) that connect external contact surfaces (10) on the outer sides of the block with each other. The contact surfaces connect to the contacts (7) of the components mounted on the block, : Independent claims are also included for the following:- (a) a device for manufacturing an electronic module and; (b) a method for manufacturing an electronic module in which a wiring block is produced by plastic injection molding and then contancts and components added to the raw plastic block.

公开(公告)号：DE10329143B4

公开(公告)日：2005-09-01

申请号：DE10329143

申请日：2003-06-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KERLER RUDOLF ,  EURSKENS WOLFRAM ,  PAPE HEINZ ,  STROBEL PETER ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/10 ,  H05K3/46 ,  H05K7/02 ,  B23K26/00

Abstract: Electronic module (25) has a number of components (1-6) mounted on a wiring block (9). The wiring block has a number of outer sides (11-14) and contains internal connection leads (15) that connect external contact surfaces (10) on the outer sides of the block with each other. The contact surfaces connect to the contacts (7) of the components mounted on the block, : Independent claims are also included for the following:- (a) a device for manufacturing an electronic module and; (b) a method for manufacturing an electronic module in which a wiring block is produced by plastic injection molding and then contancts and components added to the raw plastic block.

公开(公告)号：DE10209922A1

公开(公告)日：2003-10-02

申请号：DE10209922

申请日：2002-03-07

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  EURSKENS WOLFRAM ,  GRUENDLER GEROLD ,  KERLER RUDOLF ,  PAPE HEINZ ,  STROBEL PETER

IPC: H01L25/065 ,  H01L25/16 ,  H01L25/07 ,  H01L21/283

Abstract: The invention relates to an electronic module having electronic components, which are arranged in vertically staggered component layers, which are electrically conductively connected to one another via regions, which are uncovered within the respective component layers, of contact bumps or of bonding connections and via interconnects, which are arranged between the component layers and are connected to the uncovered regions. Moreover, the invention relates to a process for producing the electronic module, either in a panel or as individual components.