公开(公告)号：DE10329143B4

公开(公告)日：2005-09-01

申请号：DE10329143

申请日：2003-06-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KERLER RUDOLF ,  EURSKENS WOLFRAM ,  PAPE HEINZ ,  STROBEL PETER ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/10 ,  H05K3/46 ,  H05K7/02 ,  B23K26/00

Abstract: Electronic module (25) has a number of components (1-6) mounted on a wiring block (9). The wiring block has a number of outer sides (11-14) and contains internal connection leads (15) that connect external contact surfaces (10) on the outer sides of the block with each other. The contact surfaces connect to the contacts (7) of the components mounted on the block, : Independent claims are also included for the following:- (a) a device for manufacturing an electronic module and; (b) a method for manufacturing an electronic module in which a wiring block is produced by plastic injection molding and then contancts and components added to the raw plastic block.

公开(公告)号：DE10245451B4

公开(公告)日：2005-07-28

申请号：DE10245451

申请日：2002-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  BIRZER CHRISTIAN ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H01L23/485 ,  H01L23/48 ,  H01L21/50

Abstract: The top metallization layer (4) of the semiconductor chip has fixed contact surfaces (5) carrying a layer (6) of elastomeric embedding mass (7) with electroconducting components (8). A dimensionally-stable contact plate (9) is embedded in the mass by its underside (10) and edges (11, 12). The underside of the contact plate is electrically connected by the electroconducting components of the embedding mass with the contact surfaces of the semiconductor chip. An Independent claim is included for the corresponding method of manufacture.

公开(公告)号：DE102006053922A1

公开(公告)日：2008-05-29

申请号：DE102006053922

申请日：2006-11-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： BAUER MICHAEL ,  STOECKL STEPHAN

IPC: H05K1/18 ,  H01L23/488 ,  H05K3/32

Abstract: The invention relates to a module comprising a carrier element having a lower stiffness or a different structure in a first region than in a second region, and also comprising a component applied to the carrier element. The component and the first region are connected to one another by a wire connection covered by a material.

公开(公告)号：DE10329143A1

公开(公告)日：2005-01-20

申请号：DE10329143

申请日：2003-06-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KERLER RUDOLF ,  EURSKENS WOLFRAM ,  PAPE HEINZ ,  STROBEL PETER ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H05K1/00 ,  H05K1/18 ,  H05K3/10 ,  H05K3/46 ,  H05K7/02 ,  B23K26/00

Abstract: Electronic module (25) has a number of components (1-6) mounted on a wiring block (9). The wiring block has a number of outer sides (11-14) and contains internal connection leads (15) that connect external contact surfaces (10) on the outer sides of the block with each other. The contact surfaces connect to the contacts (7) of the components mounted on the block, : Independent claims are also included for the following:- (a) a device for manufacturing an electronic module and; (b) a method for manufacturing an electronic module in which a wiring block is produced by plastic injection molding and then contancts and components added to the raw plastic block.

公开(公告)号：DE10245451A1

公开(公告)日：2004-04-15

申请号：DE10245451

申请日：2002-09-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  BIRZER CHRISTIAN ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H01L23/485 ,  H01L23/48 ,  H01L21/50

Abstract: The top metallization layer (4) of the semiconductor chip has fixed contact surfaces (5) carrying a layer (6) of elastomeric embedding mass (7) with electroconducting components (8). A dimensionally-stable contact plate (9) is embedded in the mass by its underside (10) and edges (11, 12). The underside of the contact plate is electrically connected by the electroconducting components of the embedding mass with the contact surfaces of the semiconductor chip. An Independent claim is included for the corresponding method of manufacture.

公开(公告)号：DE10250541B9

公开(公告)日：2004-09-16

申请号：DE10250541

申请日：2002-10-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  BIRZER CHRISTIAN ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H01L21/56 ,  H01L21/58 ,  H01L21/60

Abstract: Electronic component (1) has external contacts (10) and semiconductor chip (2) with flip-chip contacts (3) and active surface (4) fixed on contact connecting surfaces (5) of rewiring substrate (6). The intermediate chamber (7) formed by the flip-chip contacts between substrate and semiconductor chip has thermoplastic material (8) as filler (9). The glass transition temperature of the thermoplastic material lies below the melting temperature of a solder material of the external contacts. An Independent claim is also included for a process for the production of an electronic component.

公开(公告)号：DE10250541B3

公开(公告)日：2004-04-15

申请号：DE10250541

申请日：2002-10-29

Applicant: INFINEON TECHNOLOGIES AG

Inventor： OFNER GERALD ,  BIRZER CHRISTIAN ,  STOECKL STEPHAN ,  BAUER MICHAEL

IPC: H01L21/56 ,  H01L21/58 ,  H01L21/60

Abstract: Electronic component (1) has external contacts (10) and semiconductor chip (2) with flip-chip contacts (3) and active surface (4) fixed on contact connecting surfaces (5) of rewiring substrate (6). The intermediate chamber (7) formed by the flip-chip contacts between substrate and semiconductor chip has thermoplastic material (8) as filler (9). The glass transition temperature of the thermoplastic material lies below the melting temperature of a solder material of the external contacts. An Independent claim is also included for a process for the production of an electronic component.