公开(公告)号：DE10200382A1

公开(公告)日：2003-07-24

申请号：DE10200382

申请日：2002-01-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MENSCH HANS

IPC: G06K19/077 ,  H01L23/498 ,  H01L23/053 ,  H01L21/52

Abstract: In the area of the connecting section between the chip module and the card body of a chip card, the chip support (1) is provided with an optionally structured layer that is intended as a reinforcement (3). In this manner, the mechanical properties and the surface properties of the chip support can be selectively adapted to the fastening border of the chip body in the area of connection of the chip module to the card body. The layer on the fastening border of the chip support may especially be a metallization layer applied to the side of the chip support facing the card body.

公开(公告)号：DE10111805A1

公开(公告)日：2002-09-26

申请号：DE10111805

申请日：2001-03-12

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MENSCH HANS ,  SPOETTL THOMAS ,  STAMPKA PETER ,  FISCHBACH REINHARD

IPC: G06F21/32 ,  G06F21/34 ,  G07F7/12

Abstract: According to the invention, a biometric sensor, e.g. a fingerprint sensor FiTiKey, is combined with a standardized medium. The standard of the MultiMediaCard (1) with the corresponding reading devices and with the standardized slots is a preferred embodiment, which consists of the combination of this existing standard for storage applications (MultiMediaCard with the corresponding system peripheral equipment) with the personal, mobile authentication and/or identification key FiTiKey (2) and, optionally, with additional chips (3).

公开(公告)号：DE10151151A1

公开(公告)日：2002-06-13

申请号：DE10151151

申请日：2001-10-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MENSCH HANS ,  SPOETTL THOMAS ,  KARL ANDREAS ,  MAYERHOFER BORIS ,  KOCZWARA NORBERT

IPC: G06K9/00 ,  H01L23/31 ,  H01L23/12

Abstract: The invention relates to a chip module, comprising a rectangular support frame and a chip, which lies at least on two opposite inner edges of said frame. According to said invention, said chip is firmly secured to the frame, by means of a fixing device, at only one of said two opposite inner edges.

公开(公告)号：DE10200382B4

公开(公告)日：2006-05-04

申请号：DE10200382

申请日：2002-01-08

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MENSCH HANS

IPC: H01L23/053 ,  G06K19/077 ,  H01L21/52 ,  H01L23/498

公开(公告)号：DE10146307A1

公开(公告)日：2003-05-08

申请号：DE10146307

申请日：2001-09-19

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MENSCH HANS ,  FISCHER JUERGEN

IPC: G01R31/311 ,  H01L21/66 ,  H01L21/56 ,  H01L21/60

Abstract: The method involves detecting faulty casings and/or coverings of wire contacts between one or more semiconducting chips and contact connection surfaces (83) and/or conducting tracks (84) of a bearer substrate (8) and/or between semiconducting chips (4,6) by detecting different degrees of reflection and/or intensity values using a camera system. Independent claims are also included for an electronic semiconducting component and a method of manufacturing and quality control of an electronic semiconducting component.

公开(公告)号：DE10135572A1

公开(公告)日：2003-02-13

申请号：DE10135572

申请日：2001-07-20

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MENSCH HANS ,  KOCZWARA NORBERT ,  SPOETTL THOMAS

IPC: H01L23/13 ,  H01L23/31 ,  H01L23/60 ,  H01L23/02 ,  H01L23/50

Abstract: The housing has a housing plate (1) in the form of a conductive metal frame, provided with a central opening (4) and a holding frame, supporting a semiconductor chip (3) attached to the holding frame within the opening. An adhesive or resin mass can be provided between the housing plate and the chip. An Independent claim for a chip module is also included.

公开(公告)号：DE10109327A1

公开(公告)日：2002-09-12

申请号：DE10109327

申请日：2001-02-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MENSCH HANS ,  SPOETTL THOMAS

IPC: G06K9/00 ,  H01L21/56 ,  H01L23/31 ,  H01L23/28

Abstract: The invention relates to a selective covering, which covers the terminal contact surfaces (3, 4) and bonding wires (5) with a casting compound (8) and which leaves active areas exposed, particularly a contact area (6) for a finger in a fingerprint sensor. To this end, the chip surface is selectively adapted by the provision of a varying roughness or coating and/or the viscosity of the casting compound is modified by irradiating the same.