公开(公告)号：JP2005251199A

公开(公告)日：2005-09-15

申请号：JP2005055172

申请日：2005-02-28

Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

Inventor： PUESCHNER FRANK ,  KARL ANDREAS ,  SCHINDLER WOLFGANG ,  STAMPKA PETER

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749

Abstract: PROBLEM TO BE SOLVED: To provide a chip card for noncontact data transmission having high long-term reliability, in relation to a thermomechanical load and a mechanical load. SOLUTION: This chip card for noncontact data transmission is assembled with a chip module and a card body 6. The chip module includes a carrier 1 having a first surface and a second surface, a semiconductor chip 2 on the first surface, a connection intermediary material 3 on the first surface, and a conductive connection part 4 between the semiconductor chip 2 and the connection intermediary material 3. The card body 6 includes an antenna for inductive data transmission, and an exposed connection part 5 of the antenna. A conductive means 7 is present between the first surface and the exposed connection part 5 in order to connect the the antenna to the semiconductor chip 2; and the connection intermediary material 3 is projected into the conductive means. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种相对于热机械负载和机械负载的具有高长期可靠性的非接触式数据传输的芯片卡。 解决方案：用于非接触数据传输的该芯片卡与芯片模块和卡体6组装。芯片模块包括具有第一表面和第二表面的载体1，第一表面上的半导体芯片2， 第一表面上的连接中介材料3以及半导体芯片2和连接中间材料3之间的导电连接部分4.卡体6包括用于感应数据传输的天线和天线的暴露的连接部分5。 为了将天线连接到半导体芯片2，在第一表面和暴露的连接部分5之间存在导电装置7; 并且连接中介材料3投影到导电装置中。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2007300121A

公开(公告)日：2007-11-15

申请号：JP2007119711

申请日：2007-04-27

Applicant: Infineon Technologies Ag ,  インフィネオン テクノロジーズ アクチエンゲゼルシャフト

Inventor： BOTHE KRISTOF ,  DRUMMER BERNHARD ,  SCHINDLER WOLFGANG ,  WALSER MICHAEL

IPC: H01L23/12

CPC classification number: G06K19/07745 ,  H01L23/49827 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/85385 ,  H01L2224/85444 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19107 ,  H01L2924/351 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

Abstract: PROBLEM TO BE SOLVED: To provide a chip module and a chip card each of which is strong against mechanical and thermal stress and methods for manufacturing the chip module and the chip card. SOLUTION: The chip module is provided with a base material 1 having a chip upper surface 2 and a contact upper surface 3 formed on the opposite side of the chip upper surface 2, a chip 8 mounted on the chip upper surface 2 of the base material 1, a contact bank 4 formed on the contact upper surface 3 of the base material 1, and at least one passage 6 formed on the base material 1. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供各自对机械和热应力强的芯片模块和芯片卡以及用于制造芯片模块和芯片卡的方法。 解决方案：芯片模块设置有具有芯片上表面2和形成在芯片上表面2的相对侧上的接触上表面3的基材1，安装在芯片上表面2的芯片上表面2上的芯片8 基材1，形成在基材1的接触上表面3上的接触堤4和形成在基材1上的至少一个通道6。版权所有（C）2008，JPO＆INPIT

公开(公告)号：DE102019128474A1

公开(公告)日：2021-04-22

申请号：DE102019128474

申请日：2019-10-22

Applicant: INFINEON TECHNOLOGIES AG

Inventor： LISK TIMO ,  SCHINDLER WOLFGANG

IPC: G06K19/077

Abstract: Eine Dual-Interface-Chipkarte (200) wird bereitgestellt, die einen Chipkartenkörper (102), eine kontaktbasierte Schnittstelle (112) zur kontaktbasierten Kommunikation, einen in dem Chipkartenkörper (102) angeordneten und mit der kontaktbasierten Schnittstelle (112) elektrisch leitend gekoppelten ersten Sicherheitschip (104_1), einen in dem Chipkartenkörper(102) angeordneten Fingerabdrucksensor (108), einen mit dem Fingerabdrucksensor (108) gekoppelten zweiten Sicherheitschip (104_2), der eingerichtet ist zum Durchführen einer Fingerabdruck-Verifikation mittels von dem Fingerabdrucksensor (108) erfassten Fingerabdrucksignalen, und eine Antenne (106), die mit dem zweiten Sicherheitschip (104_2) gekoppelt ist, aufweist.

公开(公告)号：DE102013105729A1

公开(公告)日：2014-12-04

申请号：DE102013105729

申请日：2013-06-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： HÖGERL JÜRGEN ,  PUESCHNER FRANK ,  STAMPKA PETER ,  MÜLLER-HIPPER ANDREAS ,  SCHINDLER WOLFGANG

IPC: G06K19/077

Abstract: Ein Chipkartenmodul zum Einsatz in einer Chipkarte kann einen Mikrochip und ein Kontaktfeld zur Kontaktierung des Mikrochips durch ein Lesegerät umfassen. Der Mikrochip kann von einer Ummantelung umschlossen sein, welche den Mikrochip vollständig von allen Seiten umschließen kann.

公开(公告)号：DE102004039693B4

公开(公告)日：2009-06-10

申请号：DE102004039693

申请日：2004-08-16

Applicant: INFINEON TECHNOLOGIES AG ,  DELO INDUSTRIEKLEBSTOFFE GMBH

Inventor： PUESCHNER FRANK ,  SPOETTL THOMAS ,  DENGLER DIETMAR ,  SCHINDLER WOLFGANG

IPC: H01L23/58 ,  C08L63/00 ,  H01L21/50 ,  H01L21/56 ,  H01L23/12 ,  H01L23/49

Abstract: A chip module having a chip which is mounted by means of chip adhesive on a mount and is electrically connected via bonding wires to contact pads, and an encapsulation compound which surrounds the chip and the bonding wires and is bounded by a subarea of the mount. The encapsulation compound is radiation-hardened and heat-hardened in a combined form and has radiation-impermeable pigments.

公开(公告)号：DE102004025911B4

公开(公告)日：2008-07-31

申请号：DE102004025911

申请日：2004-05-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MUELLER JOCHEN ,  STAMPKA PETER ,  SCHINDLER WOLFGANG ,  PUESCHNER FRANK

IPC: G06K19/077 ,  G06K19/07 ,  H01L23/31 ,  H01L23/498 ,  H01L23/544

Abstract: The chip card includes a support (2) on which a chip (3) is mounted opposite to contact surfaces (1) of the support and encapsulated. The contact surfaces have thickness larger than the thickness of the support. Terminals of the chip are connected to the contact surfaces by a jumper wire passing across openings (4) in the support. The Independent claims are also included for the following: (A) a method of manufacturing a contact chip card (B) utilization of the chip card in a wireless telephone.

公开(公告)号：DE102004020580A1

公开(公告)日：2005-11-17

申请号：DE102004020580

申请日：2004-04-27

Applicant: INFINEON TECHNOLOGIES AG

Inventor： TUTSCH GUENTER ,  SCHINDLER WOLFGANG ,  PUESCHNER FRANK

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H05K3/34

Abstract: BGA chip module and method for producing the BGA chip module by providing a carrier, forming holes at points at which bonding points of the BGA chip module are to be produced, forming metallization areas on an upper side of the carrier and covering the holes, connecting bonding points of a chip to the metallization areas, and introducing bonding elements into the holes.

公开(公告)号：DE102004010715A1

公开(公告)日：2005-09-29

申请号：DE102004010715

申请日：2004-03-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KARL ANDREAS ,  PUESCHNER FRANK ,  SCHINDLER WOLFGANG ,  STAMPKA PETER

IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077

Abstract: A chip module has an electroconductive coupling (4) between a carrier (1) and a semiconductor chip (2). The card main body (6) has a connection (5) exposing an antenna connected by an electroconductive component (7) to the semiconductor chip. A connection mediator (3) projects from the inner side of the electroconductive component and contacts the lower surface of the electroconductive coupling. An independent claim is also included for a chip card manufacturing method.

公开(公告)号：DE10329653A1

公开(公告)日：2005-02-10

申请号：DE10329653

申请日：2003-07-01

Applicant: INFINEON TECHNOLOGIES AG

Inventor： KARL ANDREAS ,  PUESCHNER FRANK ,  SCHINDLER WOLFGANG ,  STAMPKA PETER

IPC: G06K19/077 ,  H05K1/18 ,  H05K3/32

Abstract: Contact hill e.g. stud bump (3), or chemical or galvanic electric conducting material, is formed on conductive connection (4) for later connection with card body (6) or connection location (5) of antenna. Size of stud bump is between 5 to 100 Microm height. Non-conductive hot melt adhesive (8) fills gaps between chip module and connection location when chip module and card body are brought together. Independent claims included for 1) procedure to manufacture chip card 2) chip module to use in chip card.

公开(公告)号：DE10325566A1

公开(公告)日：2005-01-13

申请号：DE10325566

申请日：2003-06-05

Applicant: INFINEON TECHNOLOGIES AG

Inventor： MUELLER JOCHEN ,  JANKA STEPHAN ,  PUESCHNER FRANK ,  SCHINDLER WOLFGANG

IPC: G06K19/077 ,  H01L23/498

Abstract: The module has a chip (1) fixed on a support (2) using glue (6). Contact surfaces (4) formed at a side of the support are electrically connected to the chip by a wire link (3). Raised contacts (8) are formed on contact points of the chip, where the points are arranged along a single line and the contacts act as contact surface for the link. The link is arranged on the raised contacts with a loop.