Abstract:
PROBLEM TO BE SOLVED: To provide a memory having a charge trap memory cell, and a forming method of the memory having the trap memory cell. SOLUTION: The semiconductor memory is characterized in that a current direction of each channel region of a memory transistor is a longitudinal direction with respect to a related word line 3, in that a bit line 2 is arranged on a top surface of the word line so that it may be electrically insulated from the word line 3, in that a local interconnection 4, which is electrically conductive, of source/drain regions is prepared, in that the local interconnection 4 is arranged in a spacing zone between the above-mentioned word lines 3 so that it may be electrically insulated from the word line 3, and connected to the above-mentioned bit line 2 simultaneously, and in that a gate electrode is arranged within a trench at least partially formed inside a memory substrate. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
The method involves placing a structure with a gate contact (8) over a gate oxide layer (1) coated over a substrate (S). A silicon nitride layer (2) is laid over areas that are not covered by the structure. A spacer (3) made of tetra ethyl ortho silicate (TEOS) and placed on the nitride layer is etched to create a spacing of about 200 to 215 nanometer between the contact and a source region, and the contact and a drain region. An independent claim is also included for a semiconductor device with a MOS transistor having drain/source path.
Abstract:
In first step specified insulation (5) is deposited on semiconductor substrate (1) and onto surface is applied memory layer stack of first boundary layer (2), memory layer (3) and second boundary layer (4). In second step, first conductivity doped troughs (6) are formed by mask technique and application of doping material into semiconductor substrate. In third step, opposite conductivity doped troughs (7) are formed by doping semiconductor substrate. By using the same mask, in second step at least second boundary layer in region (10) for first conductivity troughs is removed. By using the same mask, in third layer at least second boundary layer in region (11) for second conductivity troughs is removed.
Abstract:
The memory has a substrate (1) with a substrate region, and electrically insulating units disposed in the substrate. Wells (2) of a doping type is disposed in the substrate, and a set of non-volatile memory cells is arranged in a set of sectors. A word line electrically connects memory cells of a group of sectors. A set of switching units connect the respective wells to a word line potential. An independent claim is also included for a method for operating a non-volatile semiconductor memory.