Abstract:
The invention relates to a vertical high-voltage semiconductor component, in which laterally extending semiconductor layers (3, 4) of alternating conductivity types are connected to a rear-mounted electrode via a conductive connection (5). The drift zone generated by these semiconductor layers (3, 4) lies outside the cell area and is connected to the latter by a component part.
Abstract:
Disclosed are a semiconductor memory device (1) having a memory effect due to phase transformation and a method for the production thereof, according to which a hollow space arrangement (H) comprising at least one hollow space (H1, H2) that is disposed near the respective memory element (E) is provided for each memory element (E) in a semiconductor substrate (20) such that thermal coupling of the respective memory element (E) to the surroundings thereof is embodied in a reduced manner by lowering thermal conductivity between the memory element (E) and the surroundings.
Abstract:
The invention relates to a low-resistance VDMOS semiconductor component and especially a VDMOS transistor or a vertical IGBT with a planar gate structure. A region (27) of the other conducting type is provided in the area of the bottom (26) pertaining to a trench (6). The region (27) surrounds said area. The trench (6) is at least partially filled with insulation material (31).
Abstract:
The invention relates to a semiconductor device which can be controlled by means of a field effect. Said device contains a semiconductor body (100) comprising a doped first and second contact area (20, 22, 24, 30) to which connecting electrodes (90, 92) for applying power supply potential are connected. A first control electrode (40, 42, 44; 48, 49) is insulated in relation to the semiconductor body (100; 200) and can be connected to a first control potential. A second control electrode (60, 62, 64; 66, 68; 67, 69; 61, 63) is arranged adjacently in relation to the first control electrode (40, 42, 44; 48, 49). Said second control electrode is arranged in the semiconductor body in an insulated manner and can be connected to a second control potential.
Abstract:
The invention relates to an MOS transistor structure with a trench gate electrode and a reduced specific closing resistor. The integral of the doping concentration of the body region in the lateral direction between two adjacent drift regions is greater than or equal to the integral of the doping concentration in a drift region in the same lateral direction. The invention also relates to methods for producing an MOS transistor structure. Body regions and drift regions are produced by means of epitaxic growth and implantation, repeated epitaxic growth or by filling trenches with doped conduction material.
Abstract:
The invention relates to a power transistor arrangement comprising a cascode series connection of a standard MOSFET and of a JFET, whereby the body zones of the MOSFET, and the channel region of the JFET are configured in such a way that the channel zone is cut-off in the channel region of the JFET when a voltage that is smaller than the permitted drain voltage of the MOSFET is applied in a forward direction.
Abstract:
Halbleiterdie (10), umfassend:ein Substrat (12);ein erstes Bauelementgebiet (18) mit einer ersten Epitaxialschicht (14) auf dem Substrat (12) und einem oder mehreren, in der ersten Epitaxialschicht (14) des ersten Bauelementgebiets (18) ausgebildeten Halbleiterbauelementen von einem ersten Typ;ein von dem ersten Bauelementgebiet (18) beabstandetes zweites Bauelementgebiet (20) mit einer zweiten Epitaxialschicht (16) auf dem Substrat (12) und einem oder mehreren, in der zweiten Epitaxialschicht (16) des zweiten Bauelementgebiets (20) ausgebildeten Halbleiterbauelementen von einem zweiten Typ;wobei die erste Epitaxialschicht (14) von der zweiten Epitaxialschicht (16) verschieden ist,wobei die erste Epitaxialschicht (14) auf dem Substrat (12) und die zweite Epitaxialschicht (16) auf der ersten Epitaxialschicht (14) ausgebildet ist, undwobei die zweite Epitaxialschicht (16) eine andere Dotierkonzentration als die erste Epitaxialschicht (14) aufweist und/oder im zweiten Bauelementgebiet (20) eine größere Dicke als in dem ersten Bauelementgebiet (18) aufweist.
Abstract:
In an embodiment, an apparatus includes a source region, a gate region and a drain region supported by a substrate, and a drift region including a plurality of vertically extending n-wells and p-wells to couple the gate region and the drain region of a transistor, wherein the plurality of n-wells and p-wells are formed in alternating longitudinal rows to form a superjunction drift region longitudinally extending between the gate region and the drain region of the transistor.