公开(公告)号：DE102004050391B4

公开(公告)日：2007-02-08

申请号：DE102004050391

申请日：2004-10-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHINDLER GUENTHER ,  PAMLER WERNER ,  GABRIC ZVONIMIR ,  UNGER EUGEN ,  TRAVING MARTIN ,  STEINLESBERGER GERNOT ,  STICH ANDREAS

IPC: H01L21/768 ,  H05K3/00

Abstract: In a method for manufacturing a layer arrangement, a plurality of electrically conductive structures are embedded in a substrate. Material of the substrate is removed at least between adjacent electrically conductive structures. An interlayer is formed on at least one portion of sidewalls of each of the electrically conductive structures. A first layer is formed on the interlayer where an upper partial region of the interlayer remaining free of a covering with the first layer. An electrically insulating second layer is formed selectively on that partial region of the interlayer which is free of the first layer, in such a way that the electrically insulating second layer bridges adjacent electrically conductive structures such that air gaps are formed between adjacent electrically conductive structures.

公开(公告)号：DE102004050391A1

公开(公告)日：2006-05-04

申请号：DE102004050391

申请日：2004-10-15

Applicant: INFINEON TECHNOLOGIES AG

Inventor： SCHINDLER GUENTHER ,  PAMLER WERNER ,  GABRIC ZVONIMIR ,  UNGER EUGEN ,  TRAVING MARTIN ,  STEINLESBERGER GERNOT ,  STICH ANDREAS

IPC: H01L21/768 ,  H05K3/00

Abstract: In a method for manufacturing a layer arrangement, a plurality of electrically conductive structures are embedded in a substrate. Material of the substrate is removed at least between adjacent electrically conductive structures. An interlayer is formed on at least one portion of sidewalls of each of the electrically conductive structures. A first layer is formed on the interlayer where an upper partial region of the interlayer remaining free of a covering with the first layer. An electrically insulating second layer is formed selectively on that partial region of the interlayer which is free of the first layer, in such a way that the electrically insulating second layer bridges adjacent electrically conductive structures such that air gaps are formed between adjacent electrically conductive structures.