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公开(公告)号:DE60311125T2
公开(公告)日:2007-10-25
申请号:DE60311125
申请日:2003-07-11
Applicant: INTEL CORP
Abstract: Microelectromechanical system (MEMS) apparatus and methods for surface acoustic wave (SAW) switching are disclosed. The apparatus includes a piezoelectric substrate having spaced apart input and output SAW transducers. A MEMS switch is arranged between the input and output SAW transducers The MEMS switch has a deformable member in electromagnetic communication with one or more actuation electrodes formed on or above the substrate. The deformable member is deformable to mechanically contact the substrate to deflect or absorb a SAW generated by the input SAW transducer.
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公开(公告)号:AU2003256550A1
公开(公告)日:2004-02-02
申请号:AU2003256550
申请日:2003-07-11
Applicant: INTEL CORP A DELAWARE CORP A D
Abstract: Microelectromechanical system (MEMS) apparatus and methods for surface acoustic wave (SAW) switching are disclosed. The apparatus includes a piezoelectric substrate having spaced apart input and output SAW transducers. A MEMS switch is arranged between the input and output SAW transducers The MEMS switch has a deformable member in electromagnetic communication with one or more actuation electrodes formed on or above the substrate. The deformable member is deformable to mechanically contact the substrate to deflect or absorb a SAW generated by the input SAW transducer.
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公开(公告)号:DE60311125D1
公开(公告)日:2007-02-22
申请号:DE60311125
申请日:2003-07-11
Applicant: INTEL CORP
Abstract: Microelectromechanical system (MEMS) apparatus and methods for surface acoustic wave (SAW) switching are disclosed. The apparatus includes a piezoelectric substrate having spaced apart input and output SAW transducers. A MEMS switch is arranged between the input and output SAW transducers The MEMS switch has a deformable member in electromagnetic communication with one or more actuation electrodes formed on or above the substrate. The deformable member is deformable to mechanically contact the substrate to deflect or absorb a SAW generated by the input SAW transducer.
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公开(公告)号:DE602005012385D1
公开(公告)日:2009-03-05
申请号:DE602005012385
申请日:2005-04-13
Applicant: INTEL CORP
Inventor: MA QING , WANG LI-PENG , SHIM DONG , RAO VALLURI
Abstract: Plural band film bulk acoustic resonators may be formed on the same integrated circuit using lithographic techniques. As a result, high volume production of reproducible components can be achieved, wherein the resonators, as manufactured, are designed to have different frequencies.
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公开(公告)号:AT421191T
公开(公告)日:2009-01-15
申请号:AT05737419
申请日:2005-04-13
Applicant: INTEL CORP
Inventor: MA QING , WANG LI-PENG , SHIM DONG , RAO VALLURI
Abstract: Plural band film bulk acoustic resonators may be formed on the same integrated circuit using lithographic techniques. As a result, high volume production of reproducible components can be achieved, wherein the resonators, as manufactured, are designed to have different frequencies.
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