Abstract:
A radiation-sensitive resin composition includes (A) a polymer, (B) a photoacid generator, (C) an acid diffusion controller, and (D) a solvent, the polymer (A) including a repeating unit (a-1) shown by the following general formula (a-1), and the acid diffusion controller (C) including at least one base selected from (C-1) a base shown by the following general formula (C-1) and (C-2) a photodegradable base. wherein R 1 individually represent a hydrogen atom or the like, R represents a monovalent group shown by the above general formula (a'), R 19 represents a chain-like hydrocarbon group having 1 to 5 carbon atoms or the like, A represents a divalent chain-like hydrocarbon group having 1 to 30 carbon atoms or the like, m and n are integers from 0 to 3 (m+n=1 to 3), and R 2 and R 3 individually represent a monovalent chain-like hydrocarbon group having 1 to 20 carbon atoms or the like, provided that the two R 2 may bond to form a ring structure.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition, having a large depth of focus and superior pattern peel-off resistance. SOLUTION: The radiation-sensitive resin composition includes (A) a polymer component, which at least includes a repeating unit expressed by general formula (1) and a repeating unit expressed by general formula (2), wherein the percentage of the repeating unit expressed by general formula (2) in the entire repeating units is 1 mol%-10 mol%; and (B) a radiation-sensitive acid-generating agent. In general formula (1), R 1 indicates a hydrogen atom, a methyl group or a trifluoromethyl group, and R 2 indicates a 1-4C straight chain or branching alkyl group or a 4-20C univalent alicyclic hydrocarbon group. R 3 s indicate a 1-4C straight chain or branching alkyl group or a 4-20C univalent alicyclic hydrocarbon group independently of each other, alternatively two R 3 s bond together to form a 4-20C bivalent alicyclic hydrocarbon group with carbon atoms bonded to each other. In general formula (2), R 1 indicates a hydrogen atom, a methyl group or a trifluoromethyl group, A indicates a 1-30C bivalent chain hydrocarbon group, a 3-30C bivalent alicyclic hydrocarbon group or a 6-30C bivalent aromatic hydrocarbon group, and X indicates a univalent group having a structure expressed by general formula (i). In the general formula (i), R 4 s indicate hydrogen atoms or 1-5C chain hydrocarbon groups, independently of each other, m indicates 1 or 2, and n indicates 1 or 2. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive composition capable of attaining a good pattern shape in lithography process for a high reflective substrate or a stepped substrate.SOLUTION: A radiation sensitive composition comprises: a polymer [A1] that includes a structural unit (HS1) derived from hydroxystyrene and a structural unit (a1) having a group represented by formula (a-1) and includes substantially no acid-dissociable group for producing an acidic functional group through dissociation caused by a function of an acid; and a polymer [A2] including a structural unit (HS2) derived from hydroxystyrene and the acid-dissociable group.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has a large depth of focus and ensures small LWR and MEEF, excellent pattern collapse resistance and excellent development defect control property. SOLUTION: The radiation-sensitive resin composition includes: a polymer (A) having one or more repeating units represented by general formulae (1) and (2) and one or more repeating units (3) having a carbonate structure; and a radiation-sensitive acid generator (B). COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a resist pattern having an excellent shape, and a scum margin, using a substrate having steps.SOLUTION: A radiation sensitive composition includes a polymer component comprising: at least one of a hydroxystyrene structure and a repeating unit which becomes a hydroxystyrene structure by action of an acid from a photoacid generator; and at least one kind selected from repeating units represented by the following general formulas.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for polymerizing a polymer for a semiconductor resist where formation of extremely high molecular weight components which are liable to be a cause of defects is suppressed as much as possible in the method for polymerizing a polymer using a lactone skeleton-including (meth)acrylic compound as the monomer, and to provide a polymer for semiconductor resist obtained by the method.SOLUTION: The method for polymerizing the polymer for a semiconductor resist is such that: using a (meth)acrylic monomer (A) including the lactone skeleton and a monomer (B) not including the lactone skeleton as raw material monomers; a monomer solution (i) comprising the monomer (A) and the monomer (B) is added to a reaction system for over 30 minutes to polymerize; and after the lapse of 30 minutes or more from the start of the polymerization, a monomer solution (ii) comprising the monomer (A) is further added to the reaction system to continue polymerization.
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation sensitive resin composition having not only excellent sensitivity and resolution but also large depth of focus and excellent pattern peel-off resistance even on a substrate with high reflectivity. SOLUTION: The radiation sensitive resin composition for a chemically amplified resist is provided, which contains (A) a polymer having a repeating unit derived from a compound having a plurality of hydroxyl groups, such as glycerol monomethacrylate and (D) a solvent. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a polymerization method of a polymer for a semiconductor, in which generation of a component having an extremely high molecular weight that easily causes a defect is suppressed as much as possible in a polymerization method of a polymer using a lactone skeleton-containing (meth)acrylic compound as a monomer, and to provide a polymer for a semiconductor resist obtained by the method.SOLUTION: The polymerization method of a polymer for a semiconductor resist is carried out by using a (meth)acrylic monomer (A) having a lactone skeleton and a monomer (B) having no lactone skeleton, as raw material monomers. In the method, polymerization is carried out while adding a monomer solution (i) containing the above monomer (A) and the above monomer (B) to a reaction system for 30 minutes or more; and after 30 minutes or more have passed from the initiation of the polymerization, polymerization is carried out by further adding a monomer solution (ii) containing the monomer (A) to the reaction system.
Abstract:
PROBLEM TO BE SOLVED: To provide a photoresist composition having excellent nanoedge roughness suppressing properties and a focal depth.SOLUTION: The photoresist composition contains a polymer having a structural unit (I) represented by formula (1-1) and an acid generating agent represented by formula (2). In the formula (2), Ris an organic group having at least one ester bond and is represented by formula (2-1a).
Abstract:
PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition having a wide depth of focus and good resistance to pattern peeling. SOLUTION: A polymer includes a repeating unit at least represented by general formula (a-1), a repeating unit represented by general formula (a-2) and includes a GPC weight-average molecular weight ranging from about 1,000 to about 100,000, wherein in general formulae (a-1) and (a-2), R 0 represents an alkyl group having a hydroxy group, R 1 represents a hydrogen atom or the like, and R 2 and R 3 each represents an 1-4C alkyl group. COPYRIGHT: (C)2011,JPO&INPIT