Abstract:
A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R , R , R , and R are an alkyl group , R and R are a hydroxyl group or -OR (wherein R is an organic group), A1 and A2 indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.
Abstract:
A positive-tone or negative-tone radiation sensitive resin composition comprising (A) a photoacid generator represented by the following formula (1-1) or (1-2): wherein R , R , R , and R are an alkyl group , R and R are a hydroxyl group or -OR (wherein R is an organic group), A1 and A2 indicate a monovalent anion, a and c denote an integer of 4-7, and b and d an integer of 0-7. The positive-tone resin composition further comprises (B1) an acid-cleavable group-containing resin or (B2) an alkali-soluble resin and an alkali solubility control agent, and the negative-tone radiation sensitive resin composition further comprises (C) an alkali-soluble resin and (D) a crosslinking agent. The resin compositions are highly sensitive and exhibit superior resolution and pattern forming performance.
Abstract:
There are provided a silicon-film-forming composition containing silicon particles and a dispersion medium and a method for forming a silicon film by forming a coating film of the silicon-film-forming composition on a substrate and subjecting the coating film to instantaneous fusion, a heat treatment or a light treatment. According to the composition and the method, a polysilicon film with a desired thickness which may be used as a silicon film for a solar battery can be formed efficiently and easily.
Abstract:
A novel photoacid generator containg a structure of the following formula (I), wherein R is a monovalent organic group with a fluorine content of 50 wt% or less, a nitro group, a cyano group, or a hydrogen atom, and Z and Z are individually a fluorine atom or a linear or branched perfluoroalkyl group having 1-10 carbon atoms, is provided. When used in a chemically amplified radiation-sensitive resin composition, the photoacid generator exhibits high transparency, comparatively high combustibility, and no bioaccumulation, and produces an acid exhibiting high acidity, high boiling point, moderately short diffusion length in the resist coating, and low dependency to mask pattern density.
Abstract:
A novel polysiloxane having the following structural units (I) and/or (II) and the structural unit (III), wherein A and A are an acid-dissociable monovalent organic group, R is hydrogen, monovalent (halogenated) hydrocarbon, halogen, or amino, R is monovalent (halogenated) hydrocarbon group, or halogen. A method of preparing such a polysiloxane, a silicon-containing alicyclic compound providing this polysiloxane, and a radiation-sensitive resin composition comprising this polysiloxane are also provided. The polysiloxane is useful as a resin component for a resist material, effectively senses radiation with a short wavelength, exhibits high transparency to radiation and superior dry etching properties, and excels in basic resist properties required for resist materials such as high sensitivity, resolution, developability, etc.
Abstract:
A novel photoacid generator containg a structure of the following formula (I), wherein R is a monovalent organic group with a fluorine content of 50 wt% or less, a nitro group, a cyano group, or a hydrogen atom, and Z and Z are individually a fluorine atom or a linear or branched perfluoroalkyl group having 1-10 carbon atoms, is provided. When used in a chemically amplified radiation-sensitive resin composition, the photoacid generator exhibits high transparency, comparatively high combustibility, and no bioaccumulation, and produces an acid exhibiting high acidity, high boiling point, moderately short diffusion length in the resist coating, and low dependency to mask pattern density.
Abstract:
A novel polysiloxane having the following structural units (I) and/or (II) and the structural unit (III), wherein A and A are an acid-dissociable monovalent organic group, R is hydrogen, monovalent (halogenated) hydrocarbon, halogen, or amino, R is monovalent (halogenated) hydrocarbon group, or halogen. A method of preparing such a polysiloxane, a silicon-containing alicyclic compound providing this polysiloxane, and a radiation-sensitive resin composition comprising this polysiloxane are also provided. The polysiloxane is useful as a resin component for a resist material, effectively senses radiation with a short wavelength, exhibits high transparency to radiation and superior dry etching properties, and excels in basic resist properties required for resist materials such as high sensitivity, resolution, developability, etc.
Abstract:
There are provided a silicon-film-forming composition containing silicon particles and a dispersion medium and a method for forming a silicon film by forming a coating film of the silicon-film-forming composition on a substrate and subjecting the coating film to instantaneous fusion, a heat treatment or a light treatment. According to the composition and the method, a polysilicon film with a desired thickness which may be used as a silicon film for a solar battery can be formed efficiently and easily.
Abstract:
A silane polymer is disclosed which has a larger molecular weight in view of boiling point, safety, and wetting property in case when it is applied to a substrate. In particular, a composition is disclosed which enables to form a good silicon film easily. A composition for forming a silicon film is disclosed which contains a silane polymer obtained by irradiating a photopolymerizable silane compound with light in a specific wavelength range for causing photopolymerization thereof. A method for forming a silicon film is also disclosed wherein such a composition is applied to a substrate and then subjected to heat treatment and/or photo treatment.