公开(公告)号：DE69716218D1

公开(公告)日：2002-11-14

申请号：DE69716218

申请日：1997-11-20

Applicant: JSR CORP

Inventor： KUROSAWA TAKAHIKO ,  YAMADA KINJI ,  MATSUBARA MINORU ,  INOUE YASUTAKE ,  SHINODA TOMOTAKA ,  GOTOU KOUHEI

IPC: C08G77/455 ,  C08K5/5415 ,  C08L79/08 ,  C09D183/10 ,  H01L21/312 ,  C08L83/04 ,  C09D179/08 ,  C09D183/04

Abstract: A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption. Semiconductor devices using this curable resin composition as an insulating film exhibit a low electricity consumption, work at a high speed, and have excellent reliability.

公开(公告)号：DE69716218T2

公开(公告)日：2003-04-17

申请号：DE69716218

申请日：1997-11-20

Applicant: JSR CORP

Inventor： KUROSAWA TAKAHIKO ,  YAMADA KINJI ,  MATSUBARA MINORU ,  INOUE YASUTAKE ,  SHINODA TOMOTAKA ,  GOTOU KOUHEI

IPC: C08G77/455 ,  C08K5/5415 ,  C08L79/08 ,  C09D183/10 ,  H01L21/312 ,  C08L83/04 ,  C09D179/08 ,  C09D183/04

Abstract: A curable resin composition comprising (A) a hydrolyzate or a partial condensate of an organosilane compound, or both; (B) at least one compound selected from the group consisting of polyamic acids having a hydrolyzable silyl group or carboxylic acid anhydride group, or both, and polyimides having a hydrolyzable silyl group or carboxylic acid anhydride group, or both; and (C) a chelate compound or an alkoxide compound with a metal selected from the group consisting of zirconium, titanium, and aluminum, or both the chelate compound and the alkoxide compound. The resin composition can be cured and fabricated without producing no cracks into a cured product such as a semiconductor device having a low dielectric constant, high heat resistance and moisture resistance, superior adhesion to various substrate materials, superb electrical insulation properties, and low moisture absorption. Semiconductor devices using this curable resin composition as an insulating film exhibit a low electricity consumption, work at a high speed, and have excellent reliability.

公开(公告)号：ES2527769T3

公开(公告)日：2015-01-29

申请号：ES13169627

申请日：2013-05-29

Applicant: JSR CORP

Inventor： KOSE OSAMU ,  MATSUKI YASUO ,  SHINODA TOMOTAKA

IPC: H01M4/62 ,  C08G73/10 ,  C08G79/08 ,  C08J5/18 ,  H01M4/38 ,  H01M4/48 ,  H01M10/0525

Abstract: Una composición de ligante para electrodo de un dispositivo acumulador eléctrico, la composición de ligante contiene: (A) por lo menos un polímero elegido entre el grupo formado por los ácidos poliámicos y los polímeros imidizados de los mismos que tienen un grado de imidización del 50 % o menos; y (B) agua, en la que el cociente Ma/Mb del contenido de el polímero (A), Ma (partes en peso), por el contenido de agua (B), Mb (partes en peso), se sitúa entre 500 y 5.000.

公开(公告)号：JP2015005526A

公开(公告)日：2015-01-08

申请号：JP2014179227

申请日：2014-09-03

Applicant: Jsr株式会社 ,  Jsr Corp ,  Jsr株式会社

Inventor： ITO KAZUTOSHI ,  SHINODA TOMOTAKA ,  MIYAUCHI HIROYUKI

IPC: H01M4/62 ,  C08K5/10 ,  C08K5/20 ,  C08L23/06 ,  C08L23/12 ,  C08L27/16 ,  C08L33/00 ,  H01M2/16 ,  H01M4/13

CPC classification number: H01M4/628 ,  H01G11/38 ,  H01G11/52 ,  H01M2/1653 ,  H01M2/166 ,  H01M2/1673 ,  H01M2/1686 ,  H01M4/13 ,  H01M4/622 ,  H01M4/623 ,  H01M10/0525 ,  H01M10/4235 ,  Y02E60/13

Abstract: 【課題】ブロッキング耐性に優れると共に、電極とセパレーターとを積層させる際には位置ずれを効果的に防止できる(すなわち適度にブロッキングできる)電極やセパレーターを製造可能な蓄電デバイス用組成物を提供する。【解決手段】本発明に係る蓄電デバイス用組成物は、バインダーと、ブロッキング防止剤と、液状媒体と、を含有し、前記バインダーの含有量をM1質量部、前記ブロッキング防止剤の含有量をM2質量部としたときに、1

Abstract translation: 要解决的问题：提供一种蓄电装置的组合物，其从耐粘连性的观点出发，并且能够制造有效地防止位移的电极和隔板（即，使层压时有足够的阻塞） 电极和分离器。根据本发明的用于蓄电装置的组合物包括：粘合剂; 防粘剂; 和液体介质。 如果粘合剂的含量为M1pts.mass，则防粘剂的含量为M2 pts.mass，M1和M2满足以下关系：1

公开(公告)号：JP2014067518A

公开(公告)日：2014-04-17

申请号：JP2012210453

申请日：2012-09-25

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： YAMADA KINJI ,  LEE HOJIN ,  SHINODA TOMOTAKA ,  OGAWA MASAKI

IPC: H01M10/054 ,  H01M10/04 ,  H01M10/0562 ,  H01M10/0585 ,  H01M10/0587

Abstract: PROBLEM TO BE SOLVED: To provide a power storage cell which has high output voltage, and has low toxicity to a living body even when a solid electrolyte layer is exposed to the living body.SOLUTION: A power storage cell 10 includes: a power storage unit 32 formed by laminating a positive electrode 40, a negative electrode 50, and a solid electrolyte layer 60 provided between the positive electrode 40 and the negative electrode 50; and an outer package 10 in which the power storage unit 32 is housed. The plurality of power storage units 32 are provided, and the plurality of power storage units 32 housed in the outer package 10 are connected in series and the solid electrolyte layer 60 contains a silver ion- conductive solid electrolyte.

Abstract translation: 要解决的问题：即使当固体电解质层暴露于生物体时，提供具有高输出电压并且对生物体具有低毒性的蓄电单元。解决方案：蓄电单元10包括：蓄电单元 通过层叠设置在正极40和负极50之间的正极40，负极50和固体电解质层60而形成的单元32; 以及容纳有蓄电部32的外包装体10。 设置多个蓄电单元32，并且容纳在外包装10中的多个蓄电单元32串联连接，固体电解质层60含有银离子导电固体电解质。

公开(公告)号：JP2013251110A

公开(公告)日：2013-12-12

申请号：JP2012124509

申请日：2012-05-31

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： KOSE OSAMU ,  MATSUKI YASUO ,  SHINODA TOMOTAKA

IPC: H01M4/62 ,  C08L79/08 ,  H01M4/131 ,  H01M4/134

CPC classification number: H01M4/622 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1064 ,  C08G73/1071 ,  C08L79/08 ,  H01M4/386 ,  H01M4/483 ,  H01M10/0525

Abstract: PROBLEM TO BE SOLVED: To provide a binder composition for an electrode, which provides a power storage device that has a large charge and discharge capacity and has small degree of capacity degradation due to repetition of charge and discharge cycles.SOLUTION: The binder composition for the electrode contains (A) at least one polymer selected from the group consisting of polyamic acid and imidized polymers of the polyamic acid, and (B) water. When the content of the (A) polymer is expressed by Ma pts.mass and the content of the (B) water is expressed by Mb pts.mass, the ratio of Ma/Mb is 500-10,000.

Abstract translation: 要解决的问题：提供一种用于电极的粘合剂组合物，其提供具有大的充放电能力并且由于重复充放电循环而具有小的容量劣化的蓄电装置。解决方案：用于 所述电极含有（A）至少一种选自聚酰胺酸和聚酰胺酸的酰亚胺化聚合物的聚合物，和（B）水。 （A）聚合物的含量由Ma pts.mass表示，（B）水的含量由Mb pts.mass表示，Ma / Mb的比例为500〜10,000。

公开(公告)号：JP2007088427A

公开(公告)日：2007-04-05

申请号：JP2006195337

申请日：2006-07-18

Applicant: Jsr Corp ,  Jsr株式会社 ,  Okutekku:Kk ,  Tokyo Electron Ltd ,  東京エレクトロン株式会社 ,  株式会社オクテック

Inventor： YAMANISHI YOSHIKI ,  HARADA MUNEO ,  KITANO TAKAHIRO ,  KAWAGUCHI TATSUZO ,  HIROTA YOSHIHIRO ,  SHIYOUDEN KENJI ,  YAMADA KINJI ,  SHINODA TOMOTAKA ,  O DOUKAI ,  OKUMURA KATSUYA

IPC: H01G4/12 ,  C04B35/64 ,  H01G4/10 ,  H01G13/00

CPC classification number: H01L28/55

Abstract: PROBLEM TO BE SOLVED: To provide a capacitor comprising a high-quality dielectric layer which is formed in a short baking time. SOLUTION: Atmosphere in a processing apparatus 100 is adjusted to, for example, oxygen atmosphere, by a gas supply source 112 and the like. Interior of a thermal processing apparatus 101 is set to oxygen atmosphere and raised to predetermined temperature. A wafer boat 161 having a dielectric precursor layer formed is loaded into the thermal processing apparatus 101 at a speed at which no defect is produced in wafer W. Thereafter, a reaction tube of the thermal processing apparatus 101 has its internal temperature raised to baking temperature, to perform baking for predetermined time. The wafer W is cooled to predetermined temperature in the thermal processing apparatus 101 and then to room temperature in the processing apparatus 100, and carried out from the processing apparatus 100. Before dielectric precursor layer formed on the wafer W is baked, it is maintained for predetermined time at the temperature higher than the temperature at which solvent in the dielectric precursor layer is volatilized and lower than the temperature at which the dielectric precursor layer starts crystallization to vaporize residual solvent. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种电容器，其包括在短的烘烤时间内形成的高质量电介质层。 解决方案：处理设备100中的气氛通过气体供应源112等被调节为例如氧气氛。 将热处理装置101的内部设定为氧气氛并升温至规定温度。 形成有电介质前体层的晶片舟161以晶片W中不产生缺陷的速度装载到热处理装置101中。此后，热处理装置101的反应管的内部温度升高至烘烤温度 以进行预定时间的烘烤。 将晶片W在热处理装置101中冷却至规定温度，然后在处理装置100中冷却至室温，并从处理装置100进行。在形成在晶片W上的电介质前体层被烘烤之前，维持 在高于电介质前体层中的溶剂挥发的温度的温度下的预定时间低于电介质前体层开始结晶以蒸发残余溶剂的温度。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005255464A

公开(公告)日：2005-09-22

申请号：JP2004069428

申请日：2004-03-11

Applicant: Jsr Corp ,  Jsr株式会社

Inventor： YAMADA KINJI ,  TAKAHASHI MASAYUKI ,  RYU KYOICHIRO ,  SHINODA TOMOTAKA

IPC: C04B35/00 ,  B28B1/30 ,  C04B35/46 ,  C04B35/495

CPC classification number: C23C18/1216

Abstract: PROBLEM TO BE SOLVED: To provide a composition for forming a film for forming a dielectric film with an ABOx type crystal structure capable of forming a dielectric film having a reduced dielectric loss and satisfactory insulation properties. SOLUTION: The composition for forming a film comprises: a reaction product between (A) a first metal compound as a metal hydroxide containing at least one kind of metal atom selected from Ba, Sr and Ca and (B) a second metal compound as at least one kind of metal alkoxide selected from Ti, Zr and Hf and/or the partially hydrolyzed condensate thereof; and (C) an organic solvent, and the molar ratio between the metal atoms of the first metal compound and the metal atoms of the second metal compound is 0.9 to 1.1. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于形成具有能够形成具有降低的介电损耗和令人满意的绝缘性能的电介质膜的ABOx型晶体结构的电介质膜形成用组合物。 解决方案：用于形成膜的组合物包括：（A）作为金属氢氧化物的第一金属化合物，其含有选自Ba，Sr和Ca中的至少一种金属原子和（B）第二金属 作为选自Ti，Zr和Hf的至少一种金属醇盐和/或其部分水解缩合物的化合物; 和（C）有机溶剂，第一金属化合物的金属原子与第二金属化合物的金属原子的摩尔比为0.9〜1.1。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2003068729A

公开(公告)日：2003-03-07

申请号：JP2001256560

申请日：2001-08-27

Applicant: Jsr Corp ,  ジェイエスアール株式会社

Inventor： IKEDA NORIHIKO ,  SHINODA TOMOTAKA ,  KOMATSU SATOSHI ,  YAMADA KINJI

IPC: H01G4/33 ,  H01L21/316 ,  H01L21/8246 ,  H01L27/105 ,  H01L35/24 ,  H01L41/193

Abstract: PROBLEM TO BE SOLVED: To obtain a compound for forming a ferroelectric thin film capable of forming a ferroelectric thin film where good hysteresis characteristics and saturation characteristics are obtained, on a substrate such as platinum, iridium, and iridium oxide.
SOLUTION: Coating solution for forming the ferroelectric thin film, which contains (A) organic solvent expressed in the following general formula (1) and (B) organo-metallic compound, in which content of propylene glycol is 10,000 ppm or less. R
1 O(CHCH
3 CH
2 O)
n R
2 ...(1) (where R
1 and R
2 independently show monovalent organic group selected from hydrogen atom, alkyl group having 1 to 4 of carbon number, or CH
3 CO, at least one of R
1 and R
2 is a group other than hydrogen atom, and n expresses integer of 1 to 2).
COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：为了获得能够形成具有良好滞后特性和饱和特性的铁电薄膜的铁电薄膜的化合物，在诸如铂，铱和氧化铱的基板上。 解决方案：含有（A）下述通式（1）表示的有机溶剂和（B）丙二醇含量为10,000ppm以下的有机金属化合物的铁电体薄膜形成用涂布液。 R 1 O（CHCH 3 CH 2 O）n R 2 ...（1）（其中R 1和R 2独立地表示选自氢原子，具有1-4个碳原子的烷基的一价有机基团 数或CH 3 CO，R 1和R 2中的至少一个是除氢原子以外的基团，n表示1〜2的整数）。

公开(公告)号：JP2002363491A

公开(公告)日：2002-12-18

申请号：JP2001175603

申请日：2001-06-11

Applicant: JSR CORP

Inventor： SHINODA TOMOTAKA ,  SUGIURA MAKOTO ,  YOSHIOKA MUTSUHIKO ,  SHIODA ATSUSHI ,  NISHIKAWA MICHINORI ,  YAMADA KINJI

IPC: C09D183/02 ,  C09D5/25 ,  C09D183/04 ,  C09D183/14 ,  H01L21/312

Abstract: PROBLEM TO BE SOLVED: To obtain a film-forming composition capable of giving a coating film having a low relative dielectric constant as an interlaminar electrical film material in a semiconductor device, or the like, and scarcely causing foreign materials even when stored as a varnish for a long period. SOLUTION: The film-forming composition contains (A) a hydrolyzed condensation product which is obtained by hydrolyzing and condensing an alkylalkoxysilane, (B) an organic solvent, and (C) a compound expressed by the formula (4): R R R Si-O-SiR R R (R to R are each an alkyl or an aryl, and are same or different from each other).